公开(公告)号：US10567688B2

公开(公告)日：2020-02-18

申请号：US16107403

申请日：2018-08-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jun-taek Lee ,  Yun-jeong Kim ,  Sun-yong Park ,  Goon-suk Jang ,  Jeong-seob Hong

IPC: H04N5/374 ,  H01L25/16 ,  H01L27/146 ,  H04N5/341 ,  H04N5/369

Abstract: An image sensor, imaging device, and method are provided. The image sensor includes a pixel array including an active area in which plural active pixels are located, and a dummy area in which plural dummy pixels are located, and a test element group (TEG) which is located in the dummy area and on which a test light-shielding pattern, different from a light-shielding pattern formed on the active area, is formed to detect a degree of misalignment between the light-shielding pattern and the active area.

公开(公告)号：US10564404B2

公开(公告)日：2020-02-18

申请号：US15657781

申请日：2017-07-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Tae-kun Lee ,  Min Heu ,  Yun-jeong Kim

IPC: G02B3/02 ,  G02B13/00 ,  G02B13/06

Abstract: Provided are an optical lens assembly and an electronic apparatus including the same according to various embodiments. The optical lens assembly includes: a first lens group having a positive refractive power; a second lens group having a positive refractive power; and a bending unit located between the first lens group and the second lens group and configured to bend an optical path, wherein the first lens group, the second lens group, and the bending unit are sequentially arranged from an object side to an image side, and the optical lens assembly has a maximum viewing angle of 130° or more. Other embodiments may be implemented.