公开(公告)号：US08410368B2

公开(公告)日：2013-04-02

申请号：US12891402

申请日：2010-09-27

申请人： Samuel Hartmann ,  Dominik Truessel

发明人： Samuel Hartmann ,  Dominik Truessel

IPC分类号： H01R4/58

CPC分类号： H01L24/37 ,  H01L23/49811 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15787 ,  H01L2924/00

摘要： An electrical conductor includes a primary electrical contact, at least one secondary electrical contact, and a connection element. The connection element electrically connects the first and the at least one secondary electrical contacts, and includes at least one plate-like region. Each plate-like region includes at least one deflection component with at least one first and at least one second pivot, wherein the first and second pivots of each deflection means are arranged such that each secondary electrical contact is movable relative to the primary electrical contact in a deflection direction, without creation of a shear force.

摘要翻译： 电导体包括主电接触，至少一个次电接触和连接元件。 连接元件电连接第一和至少一个次级电触点，并且包括至少一个板状区域。 每个板状区域包括具有至少一个第一和至少一个第二枢轴的至少一个偏转部件，其中每个偏转装置的第一和第二枢轴被布置成使得每个次级电接触件可相对于主电接触件移动 偏转方向，而不产生剪切力。

公开(公告)号：US08013435B2

公开(公告)日：2011-09-06

申请号：US12689746

申请日：2010-01-19

申请人： Dominik Truessel ,  Daniel Schneider

发明人： Dominik Truessel ,  Daniel Schneider

IPC分类号： H01L23/12

CPC分类号： H01L23/3135 ,  H01L23/296 ,  H01L25/072 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor module includes a base plate, at least one semiconductor chip mounted on the base plate, a case fixed to the base plate and surrounding the at least one semiconductor chip, an electrically insulating gel layer covering the at least one semiconductor chip, a thermosetting resin layer formed on top of the gel layer, and a lid formed on top of the thermosetting resin layer. The lid comprises a lid-extension, which defines a lid-opening. The lid-opening extends through the thermosetting resin layer to the gel layer and allows gel of the gel layer to expand into the lid-opening.

摘要翻译： 半导体模块包括基板，安装在基板上的至少一个半导体芯片，固定到基板并围绕至少一个半导体芯片的壳体，覆盖至少一个半导体芯片的电绝缘凝胶层，热固性 形成在凝胶层顶部的树脂层和形成在热固性树脂层的顶部上的盖。 盖子包括限定盖子开口的盖子延伸部分。 盖开口通过热固性树脂层延伸到凝胶层，并允许凝胶层的凝胶膨胀到盖开口中。