Abstract:
In a plasma display device, a secondary coil of a transformer is connected across a panel capacitor formed by a scan electrode and a sustain electrode performing a sustain discharge. The plasma display device uses resonance between a secondary coil of a transformer and a panel capacitor to apply a sustain discharge pulse to a scan electrode and a sustain electrode in a sustain period.
Abstract:
A method of fabricating a semiconductor device that may include at least one of the following steps: Forming a lower metal wiring on and/or over a semiconductor substrate. Forming an interlayer insulating film having a damascene hole on and/or over the semiconductor substrate and the lower metal wiring. Forming an anti-diffusion film on and/or over the exposed lower metal wiring below the damascene hole and/or on side surfaces of the damascene hole. Selectively removing the anti-diffusion film formed on and/or over the exposed lower metal wiring at the bottom of the damascene hole using a plasma process that uses an inert gas.
Abstract:
A BOAC/COA of a semiconductor device is manufactured by forming a conductive pad over a semiconductor device, forming a passivation oxide film over the semiconductor device including the conductive pad, forming an oxide film over the entire surface of the conductive pad and the passivation oxide film, forming an oxide film pattern defining a bond pad region on the conductive pad, sequentially forming a barrier film and a metal seed layer over the oxide film pattern, the passivation oxide film and the conductive pad, forming a metal layer over the metal seed layer, planarizing the metal layer exposing the oxide film pattern and portions of the barrier film and the metal seed layer, and removing the oxide film pattern by an etching process.
Abstract:
Embodiments relate to a semiconductor device and a method for fabricating the same. According to embodiments, a semiconductor device may include a first device, a silicon epitaxial layer formed on and/or over the first device, a second device formed on and/or over the silicon epitaxial layer, and a connection via formed through the silicon epitaxial layer, which may electrically interconnect the first device and the second device. According to embodiments, a method for fabricating a semiconductor device may include forming a first device, forming a silicon epitaxial layer on and/or over the first device, forming a connection via through the silicon epitaxial layer, and forming a second device on and/or over the silicon epitaxial layer such that the second device may be electrically connected to the connection via.
Abstract:
A PDP driving circuit for a stable operation of a ramp pulse. A capacitor having a temperature characteristic opposite to a temperature characteristic of a part coupled to a switch that operates as a constant current source for generation of a ramp pulse is arranged in the driving circuit for generating a ramp pulse. The ramp pulse linearly increases or decreases a panel voltage of the PDP with respect to time. Parts having opposite temperature characteristics are coupled in parallel to control variation of a gradient of the ramp pulse so that values of the parts may not be varied depending on the temperature changes. Thus, stable operation of the ramp pulse is obtained.
Abstract:
A semiconductor device includes a substrate formed with a predetermined trench, a plurality of devices fixed into the trench, an etch stop layer on an entire surface of the substrate including the devices while selectively exposing the devices, an interlayer dielectric layer on the etch stop layer, in which the interlayer dielectric layer includes a predetermined via hole and a predetermined trench, and a via plug and a metal line formed on the interlayer dielectric layer while filling the via hole and the trench.
Abstract:
A method for driving a surface discharge type plasma display panel (PDP) having a matrix display form is provided. The surface discharge type PDP is driven by a progressive driving method such that non-discharge regions are removed by combining common and scanning electrodes traversing neighboring discharge cells or two neighboring scanning electrodes into one. While the scanning electrodes traversing neighboring discharge cells are reduced to one to be used in common, sequential scanning is allowed. Thus, the number of driver circuits can be reduced. Also, since the distance between electrodes of the respective lines can be reduced, a high-precision PDP can be achieved by reducing a line pitch. Also, the ratio of the area occupied by display electrodes in a unit emission region is increased and the range in which a surface discharge occurs is extended, thereby improving the luminance.
Abstract:
A method for driving a plasma display having a plurality of cathodes and anodes arranged in a matrix structure and a plurality of discharge cells formed at intersecting portions of the cathodes and anodes. Each cathode is addressed and subsequently a sustaining pulse for a predetermined time during a sustaining period is applied to each cathode so that the sustaining period is increased. The method maintains a discharge-sustaining time by adding a predetermined sustaining pulse during a writing phase after addressing all cathodes, thereby enhancing the brightness of the discharge cell.
Abstract:
An apparatus for processing images may include a de-multiplexer that receives a data stream and de-multiplexes a video signal and channel information from the data stream, a first decoder that provides a decoded video signal, a thumbnail generator coupled to the first decoder to generate at least one of a still picture thumbnail or a moving picture thumbnail based on the decoded video signal, and an encoder coupled to the thumbnail generator and the de-multiplexer. The encoder encodes the thumbnail with the channel information to provide a thumbnail data stream to provide thumbnails of moving pictures and/or still pictures on a display.
Abstract:
An image sensor and a method for fabricating the same having enhanced sensivity. The image sensor enhances sensitivity and minimizes optical loss by isolating color filters from each other using a metal that has superior light reflection properties while having no effect on the color filters during deposition of the metal.