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23 条记录 (耗时 0.014 秒)

    Chair
    2.
    外观设计
    Chair 有权

    公开(公告)号：USD650604S1

    公开(公告)日：2011-12-20

    申请号：US29383680

    申请日：2011-01-20

    申请人： Sangho Lee

    设计人： Sangho Lee

    Chair
    3.
    外观设计
    Chair 有权
    椅子

    公开(公告)号：USD641562S1

    公开(公告)日：2011-07-19

    申请号：US29383681

    申请日：2011-01-20

    申请人： Sangho Lee

    设计人： Sangho Lee

    Ultra thin bumped wafer with under-film
    5.
    发明授权
    Ultra thin bumped wafer with under-film 有权
    带薄膜的超薄凸起晶圆

    公开(公告)号：US07838391B2

    公开(公告)日：2010-11-23

    申请号：US11745045

    申请日：2007-05-07

    申请人： Junghoon Shin ,  Sangho Lee ,  Sungyoon Lee

    发明人： Junghoon Shin ,  Sangho Lee ,  Sungyoon Lee

    IPC分类号： H01L21/30 ,  H01L21/46

    CPC分类号： H01L21/78 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/0401

    摘要： A semiconductor device begins with a wafer having a plurality of bumps formed on a surface of the wafer. An under-film layer is formed over the wafer to completely cover all portions of the bumps with the under-film layer. An adhesive layer is formed over the under-film layer. A support layer is attached over the adhesive layer. A back surface of the wafer undergoes grinding. The support layer provides structural support to the wafer. The support layer is removed to expose the adhesive layer. The adhesive layer is removed to expose the under-film layer. The wafer is singulated into semiconductor die. The semiconductor die is mounted to a substrate by applying force to a back surface of the semiconductor die to press the bumps through under-film layer to contact the substrate while the under-film layer provides an underfill between the semiconductor die and substrate.

    摘要翻译： 半导体器件开始于在晶片的表面上形成有多个凸块的晶片。 在晶片之上形成底膜层，以完全覆盖具有底膜层的凸块的所有部分。 在底膜层上形成粘合剂层。 支撑层附着在粘合剂层上。 晶片的后表面进行研磨。 支撑层为晶片提供结构支撑。 去除支撑层以暴露粘合剂层。 去除粘合剂层以暴露底膜层。 将晶片分成半导体芯片。 通过向半导体管芯的背面施加力将半导体管芯安装到基板上，以通过底膜层将凸块按压以接触基板，同时底膜层在半导体管芯和基板之间提供底部填充。

    Apparatus and method for providing real-time traceback connection using connection redirection technique
    6.
    发明申请
    Apparatus and method for providing real-time traceback connection using connection redirection technique 审中-公开
    使用连接重定向技术提供实时追溯连接的装置和方法

    公开(公告)号：US20050060582A1

    公开(公告)日：2005-03-17

    申请号：US10749744

    申请日：2003-12-30

    申请人： Yang Choi ,  Hwan Kim ,  Dong Seo ,  Sangho Lee

    发明人： Yang Choi ,  Hwan Kim ,  Dong Seo ,  Sangho Lee

    IPC分类号： H04L12/28 ,  G06F11/30 ,  H04L29/06

    CPC分类号： H04L63/1441 ,  H04L2463/146

    摘要： An apparatus and method for providing traceback connection using a connection redirection technique are provided. A packet blocking unit blocks an attack packet transmitted to the system and a first response packet output from the system in response to the attack packet, if a system attack sensing signal is received. A response packet generation unit generates a second response packet into which a watermark is inserted, in response to the attack packet, and transmits the second response packet to a system corresponding to the source address of the attack packet. A path traceback unit receives a detection packet containing transmission path information of the second response packet from a system existing on a transmission path of the second response packet, and based on the received detection packet, traces back the transmission path of the second response packet and identifies the location of the attacker system. According to the apparatus and method, even when an attacker attacks a predetermined system via a plurality of systems, the actual location of the attacker system can be traced back fast and accurately and damage of the victim system can be minimized.

    摘要翻译： 提供了一种使用连接重定向技术提供回溯连接的装置和方法。 如果接收到系统攻击感知信号，则分组阻塞单元阻止发送到系统的攻击分组和响应于攻击分组从系统输出的第一响应分组。 响应分组生成单元响应于攻击分组生成插入了水印的第二响应分组，并将第二响应分组发送到与攻击分组的源地址对应的系统。 路径追溯单元从存在于第二响应分组的传输路径上的系统接收包含第二响应分组的传输路径信息的检测分组，并且基于接收到的检测分组，追踪第二响应分组的传输路径， 识别攻击者系统的位置。 根据该装置和方法，即使攻击者通过多个系统攻击预定的系统，也可以快速，准确地跟踪攻击者系统的实际位置，并且可以使受害者系统的损坏最小化。

    Modular paneled structure having connective means to prevent gap opening and disconnection
    8.
    发明授权
    Modular paneled structure having connective means to prevent gap opening and disconnection 有权

    公开(公告)号：US11629464B2

    公开(公告)日：2023-04-18

    申请号：US17197482

    申请日：2021-03-10

    申请人： Sung Woo Lee ,  Sangho Lee

    发明人： Sung Woo Lee ,  Sangho Lee

    IPC分类号： E01D19/12 ,  E01D101/24 ,  E01D101/30

    摘要： A modular paneled structure, comprising a main panel with a symmetric profile which has a closed-sectional portion in the middle and open-sectional portions at each end; and further comprising a cover panel which interconnects two side-by-side main panels, where the cover panel closes the open-sectional portions of the two side-by-side main panels forming a closed-sectional shape together with main panels; and further comprising a tensioning member which interconnects and pre-tensions the main panels that are placed side by side; and consequently, forms an assembled paneled structure with all these connective means, which is used to construct a paneled ground structures.

    Chair
    9.
    外观设计
    Chair 有权

    公开(公告)号：USD651008S1

    公开(公告)日：2011-12-27

    申请号：US29383678

    申请日：2011-01-20

    申请人： Sangho Lee

    设计人： Sangho Lee