Apparatus and method for providing real-time traceback connection using connection redirection technique
    1.
    发明申请
    Apparatus and method for providing real-time traceback connection using connection redirection technique 审中-公开
    使用连接重定向技术提供实时追溯连接的装置和方法

    公开(公告)号:US20050060582A1

    公开(公告)日:2005-03-17

    申请号:US10749744

    申请日:2003-12-30

    IPC分类号: H04L12/28 G06F11/30 H04L29/06

    CPC分类号: H04L63/1441 H04L2463/146

    摘要: An apparatus and method for providing traceback connection using a connection redirection technique are provided. A packet blocking unit blocks an attack packet transmitted to the system and a first response packet output from the system in response to the attack packet, if a system attack sensing signal is received. A response packet generation unit generates a second response packet into which a watermark is inserted, in response to the attack packet, and transmits the second response packet to a system corresponding to the source address of the attack packet. A path traceback unit receives a detection packet containing transmission path information of the second response packet from a system existing on a transmission path of the second response packet, and based on the received detection packet, traces back the transmission path of the second response packet and identifies the location of the attacker system. According to the apparatus and method, even when an attacker attacks a predetermined system via a plurality of systems, the actual location of the attacker system can be traced back fast and accurately and damage of the victim system can be minimized.

    摘要翻译: 提供了一种使用连接重定向技术提供回溯连接的装置和方法。 如果接收到系统攻击感知信号,则分组阻塞单元阻止发送到系统的攻击分组和响应于攻击分组从系统输出的第一响应分组。 响应分组生成单元响应于攻击分组生成插入了水印的第二响应分组,并将第二响应分组发送到与攻击分组的源地址对应的系统。 路径追溯单元从存在于第二响应分组的传输路径上的系统接收包含第二响应分组的传输路径信息的检测分组,并且基于接收到的检测分组,追踪第二响应分组的传输路径, 识别攻击者系统的位置。 根据该装置和方法,即使攻击者通过多个系统攻击预定的系统,也可以快速,准确地跟踪攻击者系统的实际位置,并且可以使受害者系统的损坏最小化。

    Electrode assembly and secondary battery having the same

    公开(公告)号:US08535822B2

    公开(公告)日:2013-09-17

    申请号:US12456624

    申请日:2009-06-19

    IPC分类号: H01M4/00

    CPC分类号: H01M2/1066

    摘要: A secondary battery includes an electrode assembly, an open-topped can accommodating the electrode assembly, and a cap assembly sealing the can. The electrode assembly includes a positive electrode plate having a positive electrode coated portion and positive electrode non-coating portions, a negative electrode plate having a negative electrode coated portion and negative electrode non-coating portions, and a separator interposed between the positive and negative electrode plates and wound with the electrode plates. The positive electrode non-coating portion has a region where the height of the positive electrode non-coating potion is lower than that of the positive electrode coating portions.

    Chair
    5.
    外观设计
    Chair 有权

    公开(公告)号:USD650604S1

    公开(公告)日:2011-12-20

    申请号:US29383680

    申请日:2011-01-20

    申请人: Sangho Lee

    设计人: Sangho Lee

    Chair
    6.
    外观设计
    Chair 有权
    椅子

    公开(公告)号:USD641562S1

    公开(公告)日:2011-07-19

    申请号:US29383681

    申请日:2011-01-20

    申请人: Sangho Lee

    设计人: Sangho Lee

    Ultra thin bumped wafer with under-film
    8.
    发明授权
    Ultra thin bumped wafer with under-film 有权
    带薄膜的超薄凸起晶圆

    公开(公告)号:US07838391B2

    公开(公告)日:2010-11-23

    申请号:US11745045

    申请日:2007-05-07

    IPC分类号: H01L21/30 H01L21/46

    摘要: A semiconductor device begins with a wafer having a plurality of bumps formed on a surface of the wafer. An under-film layer is formed over the wafer to completely cover all portions of the bumps with the under-film layer. An adhesive layer is formed over the under-film layer. A support layer is attached over the adhesive layer. A back surface of the wafer undergoes grinding. The support layer provides structural support to the wafer. The support layer is removed to expose the adhesive layer. The adhesive layer is removed to expose the under-film layer. The wafer is singulated into semiconductor die. The semiconductor die is mounted to a substrate by applying force to a back surface of the semiconductor die to press the bumps through under-film layer to contact the substrate while the under-film layer provides an underfill between the semiconductor die and substrate.

    摘要翻译: 半导体器件开始于在晶片的表面上形成有多个凸块的晶片。 在晶片之上形成底膜层,以完全覆盖具有底膜层的凸块的所有部分。 在底膜层上形成粘合剂层。 支撑层附着在粘合剂层上。 晶片的后表面进行研磨。 支撑层为晶片提供结构支撑。 去除支撑层以暴露粘合剂层。 去除粘合剂层以暴露底膜层。 将晶片分成半导体芯片。 通过向半导体管芯的背面施加力将半导体管芯安装到基板上,以通过底膜层将凸块按压以接触基板,同时底膜层在半导体管芯和基板之间提供底部填充。

    Methods and apparatuses for providing DRM interoperability
    9.
    发明授权
    Methods and apparatuses for providing DRM interoperability 有权
    提供DRM互操作性的方法和设备

    公开(公告)号:US08386799B2

    公开(公告)日:2013-02-26

    申请号:US12630646

    申请日:2009-12-03

    IPC分类号: G06F21/00

    CPC分类号: G06F21/10 G06F2221/0728

    摘要: Methods and apparatuses for providing DRM interoperability are provided. Proxy re-encryption technique using bilinear map is used, and the same content can be used in different devices. According to the method of providing DRM interoperability includes in proxy agent with respect to digital rights management (DRM) service providers and device which supports predetermined DRM, first DRM service provider, second DRM service provider, the proxy agent, and the device identify each other, and proxy re-encrypt an interoperable content (IC) and provide the IC to the device. The IC is second-level encrypted by using a key of the first DRM service provider, and the proxy re-encryption is performed by using a proxy key generated from proxy key information provided from the first DRM service provider and the second DRM service provider. Therefore, a problem in which interoperability cannot be guaranteed since a DRM technique depends on a service provider is resolved.

    摘要翻译: 提供了提供DRM互操作性的方法和设备。 使用双线性映射的代理重新加密技术,相同的内容可以在不同的设备中使用。 根据提供DRM互操作性的方法,其包括关于数字权限管理(DRM)服务提供商的代理代理和支持预定DRM的设备,第一DRM服务提供商,第二DRM服务提供商,代理代理和设备彼此识别 ,并且代理重新加密可互操作的内容(IC)并将IC提供给设备。 IC通过使用第一DRM服务提供商的密钥进行二级加密,并且通过使用从第一DRM服务提供商和第二DRM服务提供商提供的代理密钥信息生成的代理密钥来执行代理重新加密。 因此,解决了DRM技术取决于服务提供商的互操作性不能保证的问题。

    Chair
    10.
    外观设计
    Chair 有权

    公开(公告)号:USD637415S1

    公开(公告)日:2011-05-10

    申请号:US29363025

    申请日:2010-06-03

    申请人: Sangho Lee

    设计人: Sangho Lee