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公开(公告)号:US07817422B2
公开(公告)日:2010-10-19
申请号:US12193441
申请日:2008-08-18
申请人: Satish Sivarama Gunturi , Mahadevan Balasubramaniam , Ramakrishna Venkata Mallina , Richard Alfred Beaupre , Le Yan , Richard S. Zhang , Ljubisa Dragoljub Stevanovic , Adam Gregory Pautsch , Stephen Adam Solovitz
发明人: Satish Sivarama Gunturi , Mahadevan Balasubramaniam , Ramakrishna Venkata Mallina , Richard Alfred Beaupre , Le Yan , Richard S. Zhang , Ljubisa Dragoljub Stevanovic , Adam Gregory Pautsch , Stephen Adam Solovitz
IPC分类号: H05K7/20
CPC分类号: F28F3/12 , H01L23/473 , H01L25/117 , H01L2924/0002 , H01L2924/13055 , H01L2924/3011 , H01L2924/00
摘要: A heat sink for directly cooling at least one electronic device package is provided. The electronic device package has an upper contact surface and a lower contact surface. The heat sink comprises a cooling piece formed of at least one thermally conductive material. The cooling piece defines multiple inlet manifolds configured to receive a coolant and multiple outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved. The cooling piece further defines multiple millichannels configured to receive the coolant from the inlet manifolds and to deliver the coolant to the outlet manifolds. The millichannels and inlet and outlet manifolds are further configured to directly cool one of the upper and lower contact surface of the electronic device package by direct contact with the coolant, such that the heat sink comprises an integral heat sink.
摘要翻译: 提供了用于直接冷却至少一个电子设备封装的散热器。 电子器件封装具有上接触表面和下接触表面。 散热器包括由至少一种导热材料形成的冷却片。 冷却片限定了多个入口歧管,其构造成接收冷却剂和多个出口歧管,其被配置为排出冷却剂。 入口和出口歧管交错。 冷却片进一步限定多个毫通道,其构造成从入口歧管接收冷却剂并且将冷却剂输送到出口歧管。 毫通道和入口和出口歧管还被构造成通过与冷却剂直接接触直接冷却电子器件封装的上接触表面和下接触表面之一,使得散热器包括整体式散热器。
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公开(公告)号:US20100038058A1
公开(公告)日:2010-02-18
申请号:US12193441
申请日:2008-08-18
申请人: Satish Sivarama Gunturi , Mahadevan Balasubramaniam , Ramakrishna Venkata Mallina , Richard Alfred Beaupre , Le Yan , Richard S. Zhang , Ljubisa Dragoljub Stevanovic , Adam Gregory Pautsch , Stephen Adam Solovitz
发明人: Satish Sivarama Gunturi , Mahadevan Balasubramaniam , Ramakrishna Venkata Mallina , Richard Alfred Beaupre , Le Yan , Richard S. Zhang , Ljubisa Dragoljub Stevanovic , Adam Gregory Pautsch , Stephen Adam Solovitz
IPC分类号: F28F7/00
CPC分类号: F28F3/12 , H01L23/473 , H01L25/117 , H01L2924/0002 , H01L2924/13055 , H01L2924/3011 , H01L2924/00
摘要: A heat sink for directly cooling at least one electronic device package is provided. The electronic device package has an upper contact surface and a lower contact surface. The heat sink comprises a cooling piece formed of at least one thermally conductive material. The cooling piece defines multiple inlet manifolds configured to receive a coolant and multiple outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved. The cooling piece further defines multiple millichannels configured to receive the coolant from the inlet manifolds and to deliver the coolant to the outlet manifolds. The millichannels and inlet and outlet manifolds are further configured to directly cool one of the upper and lower contact surface of the electronic device package by direct contact with the coolant, such that the heat sink comprises an integral heat sink.
摘要翻译: 提供了用于直接冷却至少一个电子设备封装的散热器。 电子器件封装具有上接触表面和下接触表面。 散热器包括由至少一种导热材料形成的冷却片。 冷却片限定了多个入口歧管,其构造成接收冷却剂和多个出口歧管,其被配置为排出冷却剂。 入口和出口歧管交错。 冷却片进一步限定多个毫通道,其构造成从入口歧管接收冷却剂并且将冷却剂输送到出口歧管。 毫通道和入口和出口歧管还被构造成通过与冷却剂直接接触直接冷却电子器件封装的上接触表面和下接触表面之一,使得散热器包括整体式散热器。
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公开(公告)号:US20100038774A1
公开(公告)日:2010-02-18
申请号:US12193429
申请日:2008-08-18
申请人: Richard S. Zhang , Richard Alfred Beaupre , Ramakrishna Venkata Mallina , Arun Virupaksha Gowda , Le Yan , Ljubisa Dragoljub Stevanovic , Peter Morley , Stephen Adam Solovitz
发明人: Richard S. Zhang , Richard Alfred Beaupre , Ramakrishna Venkata Mallina , Arun Virupaksha Gowda , Le Yan , Ljubisa Dragoljub Stevanovic , Peter Morley , Stephen Adam Solovitz
IPC分类号: H01L23/34
CPC分类号: H01L23/473 , H01L24/72 , H01L2924/01079 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/3011 , H01L2924/00
摘要: A heat sink for cooling at least one electronic device package is provided. The electronic device package has an upper contact surface and a lower contact surface. The heat sink comprises at least one thermally conductive material and defines multiple inlet manifolds configured to receive a coolant, multiple outlet manifolds configured to exhaust the coolant, and multiple millichannels configured to receive the coolant from the inlet manifolds and to deliver the coolant to the outlet manifolds. The manifolds and millichannels are disposed proximate to the respective one of the upper and lower contact surface of the electronic device package for cooling the respective surface with the coolant.
摘要翻译: 提供了用于冷却至少一个电子设备封装的散热器。 电子器件封装具有上接触表面和下接触表面。 散热器包括至少一个导热材料并且限定被配置为接收冷却剂的多个入口歧管,被配置为排出冷却剂的多个出口歧管以及被配置成从进气歧管接收冷却剂并将冷却剂输送到出口的多个通路 歧管。 歧管和毫通道靠近电子装置包装的上接触表面和下接触表面中的相应一个设置,用于用冷却剂冷却相应的表面。
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