公开(公告)号：US20240153905A1

公开(公告)日：2024-05-09

申请号：US18411680

申请日：2024-01-12

申请人： SEOUL VIOSYS CO., LTD.

发明人： Jong Hyeon CHAE

IPC分类号： H01L23/00 ,  H01L25/075 ,  H01L33/62

CPC分类号： H01L24/72 ,  H01L25/0753 ,  H01L33/62

摘要： A display apparatus including a circuit board, at least one LED stack configured to emit light, electrode pads disposed on the at least one LED stack and electrically connected to the at least one LED stack, and electrodes disposed on the electrode pads and electrically connected to the electrode pads, respectively, in which each of the electrodes has a fixed portion that is fixed to one of the electrode pads and an extending portion that is spaced apart from the one of the electrode pads, and the electrodes include at least two metal layers having different thermal expansion coefficients from each other.

公开(公告)号：US11908826B2

公开(公告)日：2024-02-20

申请号：US17658885

申请日：2022-04-12

申请人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

发明人： Keunhyuk Lee ,  Jerome Teysseyre ,  Tiburcio A. Maldo

IPC分类号： H01L23/00

CPC分类号： H01L24/72 ,  H01L24/90

摘要： A clip preform includes a die contact portion and an aligner structure. An intermediate portion connects the die contact portion to a lead contact portion in the aligner structure. The die contact portion is configured to contact a semiconductor die. The aligner structure is configured to attach the lead contact portion to a lead post. The die contact portion, the intermediate portion, and the aligner structure form a structure of a primary clip for connecting the semiconductor die to the lead post. The clip preform is severable by removing parts of the die contact portion and the intermediate portion of the clip preform to form a secondary clip for connecting the semiconductor die to the lead post. The aligner structure, a remaining part of the die contact portion, and a remaining part of the intermediate portion of the clip preform form a structure of the secondary clip.

公开(公告)号：US20230387068A1

公开(公告)日：2023-11-30

申请号：US18366843

申请日：2023-08-08

申请人： Infineon Technologies AG

发明人： Melvin Levardo ,  Ryan Ross Agbay Alinea ,  Markus Dinkel

IPC分类号： H01L23/00

CPC分类号： H01L24/72 ,  H01L24/73

摘要： A method of manufacturing a package includes: connecting an electronic component with a carrier by a clip having at least one locking recess; partially encapsulating the clip by an encapsulant so that at least part of a main surface of the clip remains partially exposed with respect to the encapsulant; and locking the encapsulant and the clip by accommodating material of the encapsulant in the at least one locking recess.

公开(公告)号：US20190206776A1

公开(公告)日：2019-07-04

申请号：US16311780

申请日：2016-06-20

申请人： Zhuzhou CRRC Times Electric Co. Ltd. ,  Dynex Semiconductor Limited

发明人： Robin Adam Simpson

IPC分类号： H01L23/498 ,  H01L23/00 ,  H01L25/11

CPC分类号： H01L23/49811 ,  H01L23/49844 ,  H01L24/72 ,  H01L24/90 ,  H01L24/97 ,  H01L25/115

摘要： We disclose herein a semiconductor device sub-assembly comprising: a plurality of semiconductor units laterally spaced to one another; a semiconductor unit locator comprising a plurality of holes, wherein each semiconductor unit is located in each hole of the semiconductor unit locator; a plurality of pressure means for applying pressure to each semiconductor unit, and a conductive malleable layer located between the plurality of pressure means and the semiconductor unit locator.

公开(公告)号：US20180205033A1

公开(公告)日：2018-07-19

申请号：US15792050

申请日：2017-10-24

申请人： Intel Corporation

发明人： Douglas G. Bennett

IPC分类号： H01L51/52 ,  H01R12/71 ,  H01L51/56 ,  H05K1/02 ,  H01L23/00 ,  H01R12/52 ,  H01R4/48 ,  H01L27/32 ,  H01R13/24 ,  H05K3/32 ,  H01R12/57

CPC分类号： H01L51/52 ,  H01L24/72 ,  H01L27/32 ,  H01L51/56 ,  H01R4/48 ,  H01R12/52 ,  H01R12/57 ,  H01R12/718 ,  H01R13/2407 ,  H01R13/6485 ,  H01R2101/00 ,  H05K1/0215 ,  H05K3/325 ,  H05K2201/0311

摘要： Generally, this disclosure provides systems, devices and methods for improved electrical coupling of multiple ground planes of a device. The device may include a plurality of ground planes and an electrically conductive ground clip. The ground clip may include a base portion configured to secure the ground clip to the device and a plurality of spring fingers. Each of the spring fingers may be configured to contact and electrically couple to one of the plurality of ground planes, wherein the ground clip is to provide a conduction path between each of the spring fingers. One of the spring fingers may pass through an opening or cut-through in a first ground plane to contact a second ground plane. The device may be a mobile communication or computing platform.

公开(公告)号：US20180184517A1

公开(公告)日：2018-06-28

申请号：US15388643

申请日：2016-12-22

申请人： Google LLC

发明人： Pierre-luc Cantin

IPC分类号： H05K1/02 ,  H01L23/498 ,  H01L23/66 ,  H05K1/11 ,  H05K1/18 ,  H01L23/00

CPC分类号： H05K1/0271 ,  H01L23/32 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/562 ,  H01L23/645 ,  H01L23/66 ,  H01L24/72 ,  H01L24/90 ,  H01L2223/6616 ,  H01L2223/6638 ,  H01L2224/16227 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K1/0243 ,  H05K1/0251 ,  H05K1/111 ,  H05K1/116 ,  H05K1/181 ,  H05K3/3436 ,  H05K3/429 ,  H05K2201/10325 ,  H05K2201/10378 ,  H01L2924/00015

摘要： At least one aspect is directed to a IC socket with impedance-controlled signal lines. The IC socket includes a first plurality of signal contacts configured to make electrical connections to leads of an integrated circuit, a second plurality of signal contacts configured to make electrical connections to pads of a printed circuit board, a substrate disposed between the first and second pluralities of signal contacts, and a plurality of signal lines passing through the substrate. The substrate comprises a plurality of layers, the layers alternating between dielectric layers and at least one conductor layer. Each signal line electrically connects a first signal contact of the first plurality of signal contacts with a second signal contact of the second plurality of signal contacts. Each conductor layer defines a gap around each signal line. The proximity of each signal line to each conductor layer creates a capacitance between the two.

公开(公告)号：US20180175007A1

公开(公告)日：2018-06-21

申请号：US15803706

申请日：2017-11-03

申请人： Fuji Electric Co., Ltd.

发明人： Yuji IIZUKA

IPC分类号： H01L25/07 ,  H01L23/32 ,  H01L23/492

CPC分类号： H01L25/072 ,  H01L23/32 ,  H01L23/492 ,  H01L24/72 ,  H01L25/115 ,  H01L2224/01 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012

摘要： A pressure contact-type semiconductor module includes a plurality of semiconductor units disposed side-by-side, each of the semiconductor units including: a semiconductor device substrate; a first electrode formed below the semiconductor device substrate, a second electrode formed above the semiconductor device substrate, an electrode plate electrically connected to the second electrode; and a pressure contact adjustment member screwed into the electrode plate, the pressure contact adjustment member having a top surface as a pressure contact-receiving surface to which a lead-out electrode plate that is common to the plurality of semiconductor units is to be pressure-contacted, levels of the respective top surfaces of the pressure contact adjustment members in the plurality of semiconductor units being adjustable to match a reference pressure contact plane so that contact pressures in the respective top surfaces applied by the lead-out electrode plate are substantially the same among the semiconductor units.

公开(公告)号：US20180122768A1

公开(公告)日：2018-05-03

申请号：US15852325

申请日：2017-12-22

申请人： ABB Schweiz AG

发明人： Franc Dugal

IPC分类号： H01L23/00 ,  H01L25/11 ,  H01L25/07 ,  H01L25/18 ,  H01L23/492

CPC分类号： H01L24/72 ,  H01L23/492 ,  H01L25/071 ,  H01L25/072 ,  H01L25/074 ,  H01L25/11 ,  H01L25/112 ,  H01L25/115 ,  H01L25/117 ,  H01L25/18 ,  H01R12/714 ,  H01R12/73

摘要： The present invention relates to a spring element for a power semiconductor module, wherein the spring element includes a first part made from a first material and a second part made from a second material, the first material being different from the second material, wherein the first part comprises both a first contact portion having a first contact and a second contact portion having a second contact, wherein the first part comprises an electrically conductive path formed from the first contact portion to the second contact portion, and wherein the second part is adapted for exerting a spring force (FS) onto the first contact portion and the second contact portion for pressing the first contact to a first contact area of a power semiconductor module and the second contact to a second contact area of a power semiconductor module. Such a spring element may form a press contact in a power semiconductor module and may be less bulky compared to solutions in the prior art and may be formed cost-sparingly.

公开(公告)号：US20180026005A1

公开(公告)日：2018-01-25

申请号：US15657277

申请日：2017-07-24

申请人： SEMIKRON ELEKTRONIK GMBH & CO. KG

发明人： HARALD KOBOLLA ,  JÖRG AMMON

IPC分类号： H01L23/00 ,  H01L23/36

CPC分类号： H01L24/72 ,  H01L23/36 ,  H01L23/4093 ,  H01L23/42 ,  H01L23/49811 ,  H01L23/4985 ,  H01L24/90 ,  H01L25/072

摘要： A switching device has a substrate, a power semiconductor component arranged thereon, a connection device and a pressure device. The substrate has conductor tracks electrically insulated from each another. A power semiconductor component is arranged on one of the conductor tracks. The connection device is embodied as a film composite having an electrically conductive film and an electrically insulating film and forming a first and a second main surface. The switching device is connected in a circuit-conforming manner by the connection device, and a contact area of the first main surface of the power semiconductor component is connected to a first contact area of an assigned conductor track of the substrate in a force-locking and electrically conductive manner.

公开(公告)号：US20180025854A1

公开(公告)日：2018-01-25

申请号：US15654774

申请日：2017-07-20

申请人： SEMIKRON ELEKTRONIK GMBH & CO. KG

发明人： HARALD KOBOLLA ,  Jörg Ammon

IPC分类号： H01H1/20 ,  H01H9/52

CPC分类号： H01H1/20 ,  H01H9/52 ,  H01L23/4093 ,  H01L23/42 ,  H01L23/49811 ,  H01L23/4985 ,  H01L24/72 ,  H01L24/90 ,  H01L25/072

摘要： A switching device has a substrate, a connection device and a pressure device, wherein the substrate has electrically insulated conductor tracks, and a power semiconductor component is on one of the conductor tracks with a first main surface and is conductively connected thereto. The connection device is a film composite with conductive film and an insulating film and forms a first and a second main surface. The switching device is connected by the connection device and a contact area of the second main surface of the power semiconductor component is connected to a first contact area of the first main surface of the connection device in a force-locking and electrically conductive manner with a pressure body and a pressure element projecting toward the power semiconductor component.