公开(公告)号：US08029333B2

公开(公告)日：2011-10-04

申请号：US11911808

申请日：2007-10-17

申请人： Tamami Takahashi ,  Kenya Ito ,  Mitsuhiko Shirakashi ,  Kazuyuki Inoue ,  Kenji Yamaguchi ,  Masaya Seki ,  Satoru Sato ,  Jun Watanabe ,  Kenji Kato ,  Jun Tamura ,  Souichi Asakawa

发明人： Tamami Takahashi ,  Kenya Ito ,  Mitsuhiko Shirakashi ,  Kazuyuki Inoue ,  Kenji Yamaguchi ,  Masaya Seki ,  Satoru Sato ,  Jun Watanabe ,  Kenji Kato ,  Jun Tamura ,  Souichi Asakawa

IPC分类号： B24B49/00

CPC分类号： B24B9/065 ,  B24B21/16

摘要： A device for polishing the peripheral edge part of a semiconductor wafer includes a wafer stage for holding the wafer, a wafer stage unit including devices for rotating the wafer stage, causing the wafer stage to undergo a rotary reciprocating motion within the same plane as the surface of the wafer stage, and moving the wafer stage parallel to the surface, a notch polishing part for polishing the notch on the wafer and a bevel polishing part for polishing the beveled part of the wafer. Pure water is supplied to the wafer to prevent it from becoming dry as it is transported from the notch polishing part to the bevel polishing part.

摘要翻译： 用于抛光半导体晶片的周边部分的装置包括用于保持晶片的晶片台，包括用于旋转晶片台的装置的晶片台单元，使得晶片台在与表面相同的平面内进行旋转往复运动 的晶片台，并且平行于表面移动晶片台，用于抛光晶片上的凹口的凹口抛光部分和用于抛光晶片的斜面部分的斜面抛光部分。 将纯水供应到晶片，以防止其从凹口抛光部件输送到斜面抛光部件时变干。

公开(公告)号：US20090093192A1

公开(公告)日：2009-04-09

申请号：US11911808

申请日：2006-04-18

申请人： Tamami Takahashi ,  Kenya Ito ,  Mitsuhiko Shirakashi ,  Kazuyuki Inoue ,  Kenji Yamaguchi ,  Masaya Seki ,  Satoru Sato ,  Jun Watanabe ,  Kenji Kato ,  Jun Tamura ,  Souichi Asakawa

发明人： Tamami Takahashi ,  Kenya Ito ,  Mitsuhiko Shirakashi ,  Kazuyuki Inoue ,  Kenji Yamaguchi ,  Masaya Seki ,  Satoru Sato ,  Jun Watanabe ,  Kenji Kato ,  Jun Tamura ,  Souichi Asakawa

IPC分类号： B24B9/00 ,  B24B49/12

CPC分类号： B24B9/065 ,  B24B21/16

摘要： A device for polishing the peripheral edge part of a semiconductor wafer includes a wafer stage for holding the wafer, a wafer stage unit including devices for rotating the wafer stage, causing the wafer stage to undergo a rotary reciprocating motion within the same plane as the surface of the wafer stage, and moving the wafer stage parallel to the surface, a notch polishing part for polishing the notch on the wafer and a bevel polishing part for polishing the beveled part of the wafer. Pure water is supplied to the wafer to prevent it from becoming dry as it is transported from the notch polishing part to the bevel polishing part.

摘要翻译： 用于抛光半导体晶片的周边部分的装置包括用于保持晶片的晶片台，包括用于旋转晶片台的装置的晶片台单元，使得晶片台在与表面相同的平面内进行旋转往复运动 的晶片台，并且平行于表面移动晶片台，用于抛光晶片上的凹口的凹口抛光部分和用于抛光晶片的斜面部分的斜面抛光部分。 将纯水供应到晶片，以防止其从凹口抛光部件输送到斜面抛光部件时变干。

公开(公告)号：US07108582B2

公开(公告)日：2006-09-19

申请号：US11303207

申请日：2005-12-15

申请人： Satoru Sato ,  Jun Tamura ,  Jun Watanabe

发明人： Satoru Sato ,  Jun Tamura ,  Jun Watanabe

IPC分类号： B24B49/00

CPC分类号： B24B21/002 ,  B24B9/065

摘要： A polishing machine uses a polishing head having a movable pad to press a polishing tape for polishing beveled and edge parts of a disk-shaped object. A rotary shaft is connected to the polishing head in a direction of contact surface between the polishing tape and the object. A rotary-and-reciprocating motion device rotates the polishing head around the axial line of the rotary shaft and moves it reciprocatingly along its axial line. A moving device undergoes a reciprocating motion perpendicularly to the object surface while supporting the object. When in use, the polishing head is rotated while the pad causes the polishing tape to protrude from it while the object is rotated.

摘要翻译： 抛光机使用具有可移动垫的抛光头来按压用于抛光圆盘形物体的斜面和边缘部分的抛光带。 旋转轴在抛光带和物体之间的接触表面的方向上连接到抛光头。 旋转往复运动装置使抛光头围绕旋转轴的轴线旋转，并沿其轴线往复运动。 移动装置在支撑物体的同时进行垂直于物体表面的往复运动。 当使用时，当物体旋转时，抛光头旋转，同时衬垫使得抛光带从其上突出。

公开(公告)号：US20060094343A1

公开(公告)日：2006-05-04

申请号：US11303207

申请日：2005-12-15

申请人： Satoru Sato ,  Jun Tamura ,  Jun Watanabe

发明人： Satoru Sato ,  Jun Tamura ,  Jun Watanabe

IPC分类号： B24B21/00

CPC分类号： B24B21/002 ,  B24B9/065

摘要： A polishing machine uses a polishing head having a movable pad to press a polishing tape for polishing beveled and edge parts of a disk-shaped object. A rotary shaft is connected to the polishing head in a direction of contact surface between the polishing tape and the object. A rotary-and-reciprocating motion device rotates the polishing head around the axial line of the rotary shaft and moves it reciprocatingly along its axial line. A moving device undergoes a reciprocating motion perpendicularly to the object surface while supporting the object. When in use, the polishing head is rotated while the pad causes the polishing tape to protrude from it while the object is rotated.

公开(公告)号：US20080293332A1

公开(公告)日：2008-11-27

申请号：US12126383

申请日：2008-05-23

申请人： Jun Watanabe ,  Tetsujiro Tada ,  Takashi Arahata ,  Jun Tamura ,  Moriaki Akazawa ,  Masaru Sakamoto ,  Takahiko Kawasaki

发明人： Jun Watanabe ,  Tetsujiro Tada ,  Takashi Arahata ,  Jun Tamura ,  Moriaki Akazawa ,  Masaru Sakamoto ,  Takahiko Kawasaki

IPC分类号： B24B1/00 ,  B24D11/00

CPC分类号： B24B37/26

摘要： A circular polishing pad has grooves formed on the surface in a spiral pattern with its center point offset from the center of the pad. The spiral pattern is an Archimedean spiral pattern or a parabolic spiral pattern. A target object is polished by using such a polishing pad without oscillating the platen to which the polishing pad is pasted or the polishing head that holds the target object.

摘要翻译： 圆形抛光垫具有以螺旋形图案形成在其表面上的凹槽，其中心点偏离垫的中心。 螺旋图案是阿基米德螺旋图案或抛物线螺旋图案。 也就是说，通过使用这样的抛光垫，抛光目标物体，而不会使保持目标物体的抛光头摆动。

公开(公告)号：US07241204B2

公开(公告)日：2007-07-10

申请号：US11518065

申请日：2006-09-07

申请人： Jun Watanabe ,  Takuya Nagamine ,  Jun Tamura ,  Takashi Arahata

发明人： Jun Watanabe ,  Takuya Nagamine ,  Jun Tamura ,  Takashi Arahata

IPC分类号： B24B1/00

CPC分类号： B24B37/245 ,  B24D3/28

摘要： A polishing pad has a resin sheet having a flat surface and abrading particles fixed inside and on the surface of this resin sheet. Its tensile strength is in the range of 30 MPa or greater and 70 MPa or less and preferably in the range of 40 MPa or greater and 60 MPa or less. Its tensile tear elongation is in the range of 50% or less, preferably 20% or less and more preferably 5% or less. The average diameter of the primary particles of the abrading particles is in the range of 0.005 μm or greater and less than 0.5 μm, and preferably in the range of 0.005 μm or greater and 0.2 μm or less. The content of the abrading particles fixed to the resin sheet is 10 volume % or greater and 50 volume % or less, or preferably 10 volume % or greater and 24 volume or less.

摘要翻译： 抛光垫具有平坦表面的树脂片和固定在该树脂片的内部和表面上的研磨颗粒。 其拉伸强度为30MPa以上且70MPa以下，优选为40MPa以上且60MPa以下的范围。 其拉伸撕裂伸长率为50％以下，优选为20％以下，更优选为5％以下。 研磨颗粒的一次颗粒的平均直径在0.005μm以上且小于0.5μm的范围内，优选在0.005μm以上且0.2μm以下的范围内。 固定在树脂片上的研磨粒子的含量为10体积％以上且50体积％以下，优选为10体积％以上且24体积以下。

公开(公告)号：US20070054600A1

公开(公告)日：2007-03-08

申请号：US11518065

申请日：2006-09-07

申请人： Jun Watanabe ,  Takuya Nagamine ,  Jun Tamura ,  Takashi Arahata

发明人： Jun Watanabe ,  Takuya Nagamine ,  Jun Tamura ,  Takashi Arahata

IPC分类号： B24B1/00 ,  B24B7/30 ,  B24D11/00

CPC分类号： B24B37/245 ,  B24D3/28

摘要： A polishing pad has a resin sheet having a flat surface and abrading particles fixed inside and on the surface of this resin sheet. Its tensile strength is in the range of 30MPa or greater and 70 MPa or less and preferably in the range of 40MPa or greater and 60MPa or less. Its tensile tear elongation is in the range of 50% or less, preferably 20% or less and more preferably 5% or less. The average diameter of the primary particles of the abrading particles is in the range of 0.005 μm or greater and less than 0.5 μm, and preferably in the range of 0.005 μm or greater and 0.2 μm or less. The content of the abrading particles fixed to the resin sheet is 10 volume % or greater and 50 volume % or less, or preferably 10 volume % or greater and 24 volume or less.

摘要翻译： 抛光垫具有平坦表面的树脂片和固定在该树脂片的内部和表面上的研磨颗粒。 其拉伸强度为30MPa以上且70MPa以下，优选为40MPa以上且60MPa以下的范围。 其拉伸撕裂伸长率为50％以下，优选为20％以下，更优选为5％以下。 研磨颗粒的一次颗粒的平均直径在0.005μm以上且小于0.5μm的范围内，优选在0.005μm以上且0.2μm以下的范围内。 固定在树脂片上的研磨粒子的含量为10体积％以上且50体积％以下，优选为10体积％以上且24体积以下。

公开(公告)号：US07927187B2

公开(公告)日：2011-04-19

申请号：US12126383

申请日：2008-05-23

申请人： Jun Watanabe ,  Tetsujiro Tada ,  Takashi Arahata ,  Jun Tamura ,  Moriaki Akazawa ,  Masaru Sakamoto ,  Takahiko Kawasaki

发明人： Jun Watanabe ,  Tetsujiro Tada ,  Takashi Arahata ,  Jun Tamura ,  Moriaki Akazawa ,  Masaru Sakamoto ,  Takahiko Kawasaki

IPC分类号： B24B7/22

CPC分类号： B24B37/26

摘要： A circular polishing pad has grooves formed on the surface in a spiral pattern with its center point offset from the center of the pad. The spiral pattern is an Archimedean spiral pattern or a parabolic spiral pattern. A target object is polished by using such a polishing pad without oscillating the platen to which the polishing pad is pasted or the polishing head that holds the target object.

摘要翻译： 圆形抛光垫具有以螺旋形图案形成在其表面上的凹槽，其中心点偏离垫的中心。 螺旋图案是阿基米德螺旋图案或抛物线螺旋图案。 也就是说，通过使用这样的抛光垫，抛光目标物体，而不会使保持目标物体的抛光头摆动。

公开(公告)号：US20080242576A1

公开(公告)日：2008-10-02

申请号：US11890291

申请日：2007-08-03

申请人： Jun Tamura ,  Toshihiro Kobayashi ,  Jun Watanabe

发明人： Jun Tamura ,  Toshihiro Kobayashi ,  Jun Watanabe

IPC分类号： C11D17/00

CPC分类号： C11D17/041 ,  B08B1/00 ,  C11D3/373 ,  C11D11/0047 ,  G01R3/00

摘要： A probe cleaning sheet for removing foreign objects attached to tip part of a probe is formed with a plastic sheet having a flat and even surface and a uniform thickness and a cleaning layer with a flat and even surface and a uniform thickness formed on the surface of this plastic sheet. The cleaning layer has viscoelastic properties. Its Young's modulus is 30 MPa or more and 700 MPa les less, its storage modulus at 25° C. is 1.2×108 dyn/cm2 or more and 1.2×109 dyn/cm2 or less, and the value of its storage modulus at 25° C. is 1.2 or more and 3.0 or less times the value of its storage modulus at 150° C.

摘要翻译： 用于去除附着在探针的尖端部分上的异物的探针清洁片由具有平坦且均匀的表面和均匀厚度的塑料片形成，并且具有平坦且均匀的表面和均匀厚度的清洁层，其形成在 这个塑料片。 清洁层具有粘弹性。 其杨氏模量为30MPa以上且700MPa以下，其在25℃下的储能模量为1.2×10 8 / cm 2以上且1.2×10 3， SUP> 9Dyn / cm 2以下，其在25℃下的储能模量值为其在150℃下的储能模量值的1.2倍以上且3.0以下 C。

公开(公告)号：US10534112B2

公开(公告)日：2020-01-14

申请号：US16230497

申请日：2018-12-21

申请人： Kohji Sakai ,  Miho Higuchi ,  Jun Watanabe

发明人： Kohji Sakai ,  Miho Higuchi ,  Jun Watanabe

IPC分类号： G02B3/00 ,  G02B27/48 ,  G02B27/01 ,  B60K35/00 ,  G03B29/00 ,  G03B21/625 ,  H04N9/31 ,  G03B21/20 ,  G03B21/00

摘要： A microlens array includes N lenses ranging from a 1st lens to an Nth lens and a lens arrangement area. N is a positive integer. The lens arrangement area has the N lenses arranged in array. The lens arrangement area receives light emitted from a light source. An ith (i being 1st to Nth) lens satisfies a conditional expression below: −20°≤θ≤20° where θ denotes an angle formed by a main-axis orientation of double refraction and a reference orientation.