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    Polishing machine
    3.
    发明授权
    Polishing machine 有权
    抛光机

    公开(公告)号：US07108582B2

    公开(公告)日：2006-09-19

    申请号：US11303207

    申请日：2005-12-15

    申请人： Satoru Sato ,  Jun Tamura ,  Jun Watanabe

    发明人： Satoru Sato ,  Jun Tamura ,  Jun Watanabe

    IPC分类号： B24B49/00

    CPC分类号： B24B21/002 ,  B24B9/065

    摘要： A polishing machine uses a polishing head having a movable pad to press a polishing tape for polishing beveled and edge parts of a disk-shaped object. A rotary shaft is connected to the polishing head in a direction of contact surface between the polishing tape and the object. A rotary-and-reciprocating motion device rotates the polishing head around the axial line of the rotary shaft and moves it reciprocatingly along its axial line. A moving device undergoes a reciprocating motion perpendicularly to the object surface while supporting the object. When in use, the polishing head is rotated while the pad causes the polishing tape to protrude from it while the object is rotated.

    摘要翻译： 抛光机使用具有可移动垫的抛光头来按压用于抛光圆盘形物体的斜面和边缘部分的抛光带。 旋转轴在抛光带和物体之间的接触表面的方向上连接到抛光头。 旋转往复运动装置使抛光头围绕旋转轴的轴线旋转，并沿其轴线往复运动。 移动装置在支撑物体的同时进行垂直于物体表面的往复运动。 当使用时，当物体旋转时，抛光头旋转，同时衬垫使得抛光带从其上突出。

    Polishing machine
    4.
    发明申请
    Polishing machine 有权

    公开(公告)号：US20060094343A1

    公开(公告)日：2006-05-04

    申请号：US11303207

    申请日：2005-12-15

    申请人： Satoru Sato ,  Jun Tamura ,  Jun Watanabe

    发明人： Satoru Sato ,  Jun Tamura ,  Jun Watanabe

    IPC分类号： B24B21/00

    CPC分类号： B24B21/002 ,  B24B9/065

    摘要： A polishing machine uses a polishing head having a movable pad to press a polishing tape for polishing beveled and edge parts of a disk-shaped object. A rotary shaft is connected to the polishing head in a direction of contact surface between the polishing tape and the object. A rotary-and-reciprocating motion device rotates the polishing head around the axial line of the rotary shaft and moves it reciprocatingly along its axial line. A moving device undergoes a reciprocating motion perpendicularly to the object surface while supporting the object. When in use, the polishing head is rotated while the pad causes the polishing tape to protrude from it while the object is rotated.

    Probe cleaner and cleaning method
    5.
    发明申请
    Probe cleaner and cleaning method 审中-公开
    探头清洁和清洁方法

    公开(公告)号：US20080070481A1

    公开(公告)日：2008-03-20

    申请号：US11895469

    申请日：2007-08-24

    申请人： Jun Tamura ,  Kenji Kato

    发明人： Jun Tamura ,  Kenji Kato

    IPC分类号： B24B1/00 ,  B24D3/00

    CPC分类号： B24D13/145 ,  B08B1/00 ,  G01R3/00

    摘要： A probe cleaner for removing foreign objects from the tip part of a probe is formed with a cleaner sheet having a surface part with microfibers and abrading particles affixed to the surface of the microfibers at this surface part. The average fiber diameter of the microfibers is in the range of 0.1 μm or more and 20 μm or less. The average particle diameter of the abrading particles is in the range of 0.05 μm or more and 3.0 μm or less. For cleaning the tip part of a probe, the probe cleaner is set to the surface of a table, the tip part of the probe is caused to penetrate inside the surface part, and the probe is caused to undergo a reciprocal motion in the direction of the thickness of the surface part.

    摘要翻译： 用于从探针的尖端部分去除异物的探针清洁器形成有具有表面部分的清洁片，微细纤维和在该表面部分处附着在微纤维表面上的研磨颗粒。 微纤维的平均纤维直径在0.1μm以上且20μm以下的范围内。 研磨粒子的平均粒径为0.05μm以上3.0μm以下的范围。 为了清洁探头的尖端部分，将探针清洁器设置在桌子的表面上，使探头的尖端部分穿透到表面部分内，并使探头沿着方向往复运动 表面部分的厚度。

    Probe cleaning sheet
    7.
    发明申请
    Probe cleaning sheet 审中-公开
    探头清洁纸

    公开(公告)号：US20080242576A1

    公开(公告)日：2008-10-02

    申请号：US11890291

    申请日：2007-08-03

    申请人： Jun Tamura ,  Toshihiro Kobayashi ,  Jun Watanabe

    发明人： Jun Tamura ,  Toshihiro Kobayashi ,  Jun Watanabe

    IPC分类号： C11D17/00

    CPC分类号： C11D17/041 ,  B08B1/00 ,  C11D3/373 ,  C11D11/0047 ,  G01R3/00

    摘要： A probe cleaning sheet for removing foreign objects attached to tip part of a probe is formed with a plastic sheet having a flat and even surface and a uniform thickness and a cleaning layer with a flat and even surface and a uniform thickness formed on the surface of this plastic sheet. The cleaning layer has viscoelastic properties. Its Young's modulus is 30 MPa or more and 700 MPa les less, its storage modulus at 25° C. is 1.2×108 dyn/cm2 or more and 1.2×109 dyn/cm2 or less, and the value of its storage modulus at 25° C. is 1.2 or more and 3.0 or less times the value of its storage modulus at 150° C.

    摘要翻译： 用于去除附着在探针的尖端部分上的异物的探针清洁片由具有平坦且均匀的表面和均匀厚度的塑料片形成，并且具有平坦且均匀的表面和均匀厚度的清洁层，其形成在 这个塑料片。 清洁层具有粘弹性。 其杨氏模量为30MPa以上且700MPa以下，其在25℃下的储能模量为1.2×10 8 / cm 2以上且1.2×10 3， SUP> 9Dyn / cm 2以下，其在25℃下的储能模量值为其在150℃下的储能模量值的1.2倍以上且3.0以下 C。

    Polishing pad, method of producing same and method of polishing
    9.
    发明授权
    Polishing pad, method of producing same and method of polishing 失效
    抛光垫，其制造方法和抛光方法

    公开(公告)号：US07241204B2

    公开(公告)日：2007-07-10

    申请号：US11518065

    申请日：2006-09-07

    申请人： Jun Watanabe ,  Takuya Nagamine ,  Jun Tamura ,  Takashi Arahata

    发明人： Jun Watanabe ,  Takuya Nagamine ,  Jun Tamura ,  Takashi Arahata

    IPC分类号： B24B1/00

    CPC分类号： B24B37/245 ,  B24D3/28

    摘要： A polishing pad has a resin sheet having a flat surface and abrading particles fixed inside and on the surface of this resin sheet. Its tensile strength is in the range of 30 MPa or greater and 70 MPa or less and preferably in the range of 40 MPa or greater and 60 MPa or less. Its tensile tear elongation is in the range of 50% or less, preferably 20% or less and more preferably 5% or less. The average diameter of the primary particles of the abrading particles is in the range of 0.005 μm or greater and less than 0.5 μm, and preferably in the range of 0.005 μm or greater and 0.2 μm or less. The content of the abrading particles fixed to the resin sheet is 10 volume % or greater and 50 volume % or less, or preferably 10 volume % or greater and 24 volume or less.

    摘要翻译： 抛光垫具有平坦表面的树脂片和固定在该树脂片的内部和表面上的研磨颗粒。 其拉伸强度为30MPa以上且70MPa以下，优选为40MPa以上且60MPa以下的范围。 其拉伸撕裂伸长率为50％以下，优选为20％以下，更优选为5％以下。 研磨颗粒的一次颗粒的平均直径在0.005μm以上且小于0.5μm的范围内，优选在0.005μm以上且0.2μm以下的范围内。 固定在树脂片上的研磨粒子的含量为10体积％以上且50体积％以下，优选为10体积％以上且24体积以下。

    Polishing pad, method of producing same and method of polishing
    10.
    发明申请
    Polishing pad, method of producing same and method of polishing 失效
    抛光垫，其制造方法和抛光方法

    公开(公告)号：US20070054600A1

    公开(公告)日：2007-03-08

    申请号：US11518065

    申请日：2006-09-07

    申请人： Jun Watanabe ,  Takuya Nagamine ,  Jun Tamura ,  Takashi Arahata

    发明人： Jun Watanabe ,  Takuya Nagamine ,  Jun Tamura ,  Takashi Arahata

    IPC分类号： B24B1/00 ,  B24B7/30 ,  B24D11/00

    CPC分类号： B24B37/245 ,  B24D3/28

    摘要： A polishing pad has a resin sheet having a flat surface and abrading particles fixed inside and on the surface of this resin sheet. Its tensile strength is in the range of 30MPa or greater and 70 MPa or less and preferably in the range of 40MPa or greater and 60MPa or less. Its tensile tear elongation is in the range of 50% or less, preferably 20% or less and more preferably 5% or less. The average diameter of the primary particles of the abrading particles is in the range of 0.005 μm or greater and less than 0.5 μm, and preferably in the range of 0.005 μm or greater and 0.2 μm or less. The content of the abrading particles fixed to the resin sheet is 10 volume % or greater and 50 volume % or less, or preferably 10 volume % or greater and 24 volume or less.

    摘要翻译： 抛光垫具有平坦表面的树脂片和固定在该树脂片的内部和表面上的研磨颗粒。 其拉伸强度为30MPa以上且70MPa以下，优选为40MPa以上且60MPa以下的范围。 其拉伸撕裂伸长率为50％以下，优选为20％以下，更优选为5％以下。 研磨颗粒的一次颗粒的平均直径在0.005μm以上且小于0.5μm的范围内，优选在0.005μm以上且0.2μm以下的范围内。 固定在树脂片上的研磨粒子的含量为10体积％以上且50体积％以下，优选为10体积％以上且24体积以下。