公开(公告)号：US4677252A

公开(公告)日：1987-06-30

申请号：US933369

申请日：1986-11-18

申请人： Satoshi Takahashi ,  Akira Tsutsumi ,  Junji Suzuki ,  Hiroshi Kumakura ,  Takao Ito ,  Kenji Ohsawa ,  Yuji Ikegami ,  Muneyuki Haruki ,  Nobuyuki Yasuda ,  Masayuki Ohta

发明人： Satoshi Takahashi ,  Akira Tsutsumi ,  Junji Suzuki ,  Hiroshi Kumakura ,  Takao Ito ,  Kenji Ohsawa ,  Yuji Ikegami ,  Muneyuki Haruki ,  Nobuyuki Yasuda ,  Masayuki Ohta

IPC分类号： H05K1/02 ,  H05K1/00 ,  H05K1/05 ,  H05K1/18 ,  H05K7/20

CPC分类号： H05K1/056 ,  H05K1/0284 ,  H05K1/189 ,  H05K2203/302

摘要： A circuit board comprises a rigid metal substrate, a conductive metal layer formed into a predetermined circuit pattern, and a resinous layer interposed between the metal substrate and the metal layer for electrically insulating and bonding the metal substrate and the metal layer, the conductive metal layer having an elongation at break of not less than 15%, and the resinous layer comprising a first resinous layer having a volume resistivity of not less than 10.sup.10 .OMEGA.. cm, and a second resinous layer having an elongation at break of not less than 100%. The circuit board has a desired dielectric strength between the metal substrate and the conductive metal layer and can be bent without resulting disconnection in the metal layer or the like.

摘要翻译： 电路板包括刚性金属基板，形成为预定电路图案的导电金属层和介于金属基板和金属层之间的用于电绝缘和接合金属基板和金属层的树脂层，导电金属层 具有不小于15％的断裂伸长率，并且所述树脂层包含体积电阻率不小于1010ΩEGA的第一树脂层。 cm，断裂伸长率为100％以上的第二树脂层。 电路板在金属基板和导电金属层之间具有期望的介电强度，并且可以在金属层等中弯曲而不会导致断开。