公开(公告)号：US20230209703A1

公开(公告)日：2023-06-29

申请号：US17927204

申请日：2021-05-21

Applicant: Scio Holding GmbH

Inventor： Marius Sillmann ,  Jürgen Goldmann ,  Franz Padinger

IPC: H05K1/02 ,  B60R13/00 ,  H05K3/12 ,  H05K1/18 ,  H05K3/30

CPC classification number: H05K1/0274 ,  B60R13/005 ,  H05K3/1216 ,  H05K1/185 ,  H05K3/305 ,  H05K2201/10106 ,  H05K2201/10022 ,  H05K2201/0108 ,  H05K2201/0129 ,  H05K2201/10303 ,  H05K2201/09736

Abstract: The invention relates to a method for manufacturing a component (1) comprising a printed circuit board (2) and a number of electrical components (3) arranged thereon. According to the invention, the electrical components (3) are pre-fixed on the printed circuit board (2), which is formed of plastic, by means of a fixing adhesive (9) and then completely encapsulated with an UV-adhesive (8).