公开(公告)号：US20240094070A1

公开(公告)日：2024-03-21

申请号：US18524740

申请日：2023-11-30

Applicant: Sciosense B.V.

Inventor： Hilco Suy ,  Frans De Jong ,  Agata Sakic ,  Nebojsa Nenadovic ,  Geert Calaerts ,  Hans Ten Cate ,  Renie De Kok ,  Andreis Valter

IPC: G01K15/00 ,  G01R31/69

CPC classification number: G01K15/005 ,  G01R31/69 ,  G01K5/28

Abstract: In an embodiment a method for calibrating temperature sensors includes arranging devices-under-test (DUTs) in a sealable and thermally isolated chamber of a calibration arrangement such that each of the DUTs is in proximity to, associated to and in thermal contact with at least one of a number of reference samples, controlling the calibration arrangement to thermalize the DUTs and the reference samples to a temperature set point and generating, based on a temperature-dependent quantity, a set of measurement signals for each of the DUTs, wherein each set of measurement signals comprises a test measurement signal from a distinct one of the DUTs and a reference measurement signal from each of an associated at least one of the reference samples.

公开(公告)号：US11885692B2

公开(公告)日：2024-01-30

申请号：US16975936

申请日：2019-02-26

Applicant: SCIOSENSE B.V.

Inventor： Hilco Suy ,  Frans De Jong ,  Agata Sakic ,  Nebojsa Nenadovic ,  Geert Calaerts ,  Hans Ten Cate ,  Renie De Kok ,  Andreis Valter

IPC: G01K15/00 ,  G01R31/69 ,  G01K5/28

CPC classification number: G01K15/005 ,  G01R31/69 ,  G01K5/28

Abstract: A calibration arrangement has a sealable and thermally-isolated chamber comprising a socket mount having a number of reference samples in thermal contact with the socket mount and a number of sample sockets for devices-under test, DUTs, with each sample socket being arranged in proximity to and associated to at least one of the reference samples. The arrangement further comprises a thermal chuck and a circuit board, which is configured to provide electrical connection to the reference samples in the socket mount and DUTs in the sample sockets. The thermal chuck is configured to thermalize the socket mount and the circuit board to a temperature set point.

公开(公告)号：US12216008B2

公开(公告)日：2025-02-04

申请号：US18524740

申请日：2023-11-30

Applicant: Sciosense B.V.

Inventor： Hilco Suy ,  Frans De Jong ,  Agata Sakic ,  Nebojsa Nenadovic ,  Geert Calaerts ,  Hans Ten Cate ,  Renie De Kok ,  Andreis Valter

IPC: G01K15/00 ,  G01R31/69 ,  G01K5/28

Abstract: In an embodiment a method for calibrating temperature sensors includes arranging devices-under-test (DUTs) in a sealable and thermally isolated chamber of a calibration arrangement such that each of the DUTs is in proximity to, associated to and in thermal contact with at least one of a number of reference samples, controlling the calibration arrangement to thermalize the DUTs and the reference samples to a temperature set point and generating, based on a temperature-dependent quantity, a set of measurement signals for each of the DUTs, wherein each set of measurement signals comprises a test measurement signal from a distinct one of the DUTs and a reference measurement signal from each of an associated at least one of the reference samples.

公开(公告)号：US12158440B2

公开(公告)日：2024-12-03

申请号：US17433856

申请日：2020-02-26

Applicant: Sciosense B.V.

Inventor： Frederik Willem Maurits Vanhelmont ,  Nebojsa Nenadovic ,  Hilco Suy ,  Agata Sakic ,  Micha in't Zandt ,  Guido Stefanuto

IPC: G01N27/12 ,  G01N33/00

Abstract: A sensor device includes a first sensor including a heating element configured to heat up the first sensor in a controllable manner and a second sensor thermally coupled to the heating element of the first sensor such that the heating element is further configured to heat up the second sensor in a controllable manner.

公开(公告)号：US20220128502A1

公开(公告)日：2022-04-28

申请号：US17433856

申请日：2020-02-26

Applicant: Sciosense B.V.

Inventor： Frederik Willem Maurits Vanhelmont ,  Nebojsa Nenadovic ,  Hilco Suy ,  Agata Sakic ,  Micha in't Zandt ,  Guido Stefanuto

IPC: G01N27/12

Abstract: In an embodiment a sensor device include a first sensor including a heating element configured to heat up the first sensor in a controllable manner and a second sensor thermally coupled to the heating element of the first sensor such that the heating element is further configured to heat up the second sensor in a controllable manner.