公开(公告)号：US20240157457A1

公开(公告)日：2024-05-16

申请号：US18505287

申请日：2023-11-09

Applicant: Seagate Technology LLC

Inventor： Daniel Glen Hardy ,  Aaron Michael Collins ,  Joseph Langford Nelson

IPC: B23K1/00 ,  B23K1/005

CPC classification number: B23K1/0016 ,  B23K1/0056

Abstract: A method of interconnecting multiple components of an electrical assembly with a solder joint that includes the steps of positioning a suspension adjacent to a slider to provide a connection area between the suspension and the slider, wherein the suspension comprises a pre-deposited quantity of solder material with a height that provides for a predefined gap between a lower surface of the slider and an upper surface of the solder material, and applying energy to the solder material to melt the solder material and allow it to move toward and contact the lower surface of the slider.