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公开(公告)号:US20150062746A1
公开(公告)日:2015-03-05
申请号:US14018027
申请日:2013-09-04
Applicant: Seagate Technology LLC
Inventor: Raymond Leroy Moudry , Pramit Parikh , Mark Allen Herendeen , Joel W. Hoehn
CPC classification number: G11B7/08 , G11B5/1871 , G11B5/3169 , G11B5/6005
Abstract: A device and associated method of use can have at least an object with a work surface that contacts a lapping surface of a tool. Topography of the lapping surface can be mapped in-situ by an adjacent sensor array and the topography stored in a memory. The sensor array may be configured with a plurality of sensors positioned on opposite sides of the object.
Abstract translation: 装置和相关联的使用方法可以具有至少一个具有与工具的研磨表面接触的工作表面的物体。 研磨表面的地形可以通过相邻的传感器阵列原位映射并且存储在存储器中的形貌。 传感器阵列可以配置有位于物体的相对侧上的多个传感器。
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公开(公告)号:US09776299B2
公开(公告)日:2017-10-03
申请号:US14045494
申请日:2013-10-03
Applicant: Seagate Technology LLC
Inventor: Mark Allen Herendeen
IPC: B24B37/30 , B24B49/10 , B24B37/013 , B24B37/04
CPC classification number: B24B37/013 , B24B37/048 , B24B37/30 , B24B49/10
Abstract: A carrier may be configured and operated to engage a lapping plate with a plurality of physically separated sliders attached to a common adhesive of the carrier. The carrier can be constructed to have at least one finger adjacent to and capable of translating a single slider of the plurality of physically separated sliders.
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公开(公告)号:US09286930B2
公开(公告)日:2016-03-15
申请号:US14018027
申请日:2013-09-04
Applicant: Seagate Technology LLC
Inventor: Raymond Leroy Moudry , Pramit Parikh , Mark Allen Herendeen , Joel W. Hoehn
CPC classification number: G11B7/08 , G11B5/1871 , G11B5/3169 , G11B5/6005
Abstract: A device and associated method of use can have at least an object with a work surface that contacts a lapping surface of a tool. Topography of the lapping surface can be mapped in-situ by an adjacent sensor array and the topography stored in a memory. The sensor array may be configured with a plurality of sensors positioned on opposite sides of the object.
Abstract translation: 装置和相关联的使用方法可以具有至少一个具有与工具的研磨表面接触的工作表面的物体。 研磨表面的地形可以通过相邻的传感器阵列原位映射并且存储在存储器中的形貌。 传感器阵列可以配置有位于物体的相对侧上的多个传感器。
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公开(公告)号:US20150099427A1
公开(公告)日:2015-04-09
申请号:US14045494
申请日:2013-10-03
Applicant: Seagate Technology LLC
Inventor: Mark Allen Herendeen
IPC: B24B37/013 , B24B49/10 , B24B37/30
CPC classification number: B24B37/013 , B24B37/048 , B24B37/30 , B24B49/10
Abstract: A carrier may be configured and operated to engage a lapping plate with a plurality of physically separated sliders attached to a common adhesive of the carrier. The carrier can be constructed to have at least one finger adjacent to and capable of translating a single slider of the plurality of physically separated sliders.
Abstract translation: 载体可以被构造和操作以使研磨板与附接到载体的共同粘合剂的多个物理分离的滑块接合。 载体可以构造成具有与多个物理上分离的滑块的单个滑块相邻并且能够平移的至少一个手指。
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