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    Platen for wafer polishing having diamond-ceramic composites
    2.
    发明授权
    Platen for wafer polishing having diamond-ceramic composites 有权
    具有金刚石陶瓷复合材料的用于晶片抛光的压板

    公开(公告)号：US09149904B1

    公开(公告)日：2015-10-06

    申请号：US14304684

    申请日：2014-06-13

    Applicant: Seagate Technology LLC

    Inventor： Raymond Leroy Moudry ,  Mihaela Ruxandra Baurceanu ,  Joel William Hoehn ,  Jeffrey R. O'Konski

    IPC: B24B37/04 ,  B24B37/12 ,  B24D3/28 ,  B24D18/00

    CPC classification number: B24B37/12 ,  B24B37/048 ,  B24D3/28 ,  B24D18/0072

    Abstract: A lapping platen having a working surface and an abrasive coating on the working surface. The abrasive coating comprises a plurality of individual abrasive composites adhered to the working surface with an epoxy, the abrasive composites comprising diamond particles and a ceramic matrix. The diamond particles have an average particle size of 0.1 micrometers to 3 micrometers with no particle larger than 6 micrometers. The abrasive composites have an average particle size of 15 micrometers to 100 micrometers with no particle larger than 150 micrometers.

    Abstract translation: 研磨台板，具有在工作表面上的工作表面和磨料涂层。 研磨涂层包括用环氧树脂粘附到工作表面上的多个单独的磨料复合材料，磨料复合材料包含金刚石颗粒和陶瓷基体。 金刚石颗粒的平均粒径为0.1微米至3微米，没有颗粒大于6微米。 研磨复合材料的平均粒径为15微米至100微米，没有大于150微米的颗粒。

    IN-SITU LAPPING PLATE MAPPING DEVICE
    4.
    发明申请
    IN-SITU LAPPING PLATE MAPPING DEVICE 有权
    现场拉板测绘装置

    公开(公告)号：US20150062746A1

    公开(公告)日：2015-03-05

    申请号：US14018027

    申请日：2013-09-04

    Applicant: Seagate Technology LLC

    Inventor： Raymond Leroy Moudry ,  Pramit Parikh ,  Mark Allen Herendeen ,  Joel W. Hoehn

    IPC: G11B21/21 ,  G11B5/56 ,  G11B7/08

    CPC classification number: G11B7/08 ,  G11B5/1871 ,  G11B5/3169 ,  G11B5/6005

    Abstract: A device and associated method of use can have at least an object with a work surface that contacts a lapping surface of a tool. Topography of the lapping surface can be mapped in-situ by an adjacent sensor array and the topography stored in a memory. The sensor array may be configured with a plurality of sensors positioned on opposite sides of the object.

    Abstract translation: 装置和相关联的使用方法可以具有至少一个具有与工具的研磨表面接触的工作表面的物体。 研磨表面的地形可以通过相邻的传感器阵列原位映射并且存储在存储器中的形貌。 传感器阵列可以配置有位于物体的相对侧上的多个传感器。

    Method of patterning a lapping plate, and patterned lapping plates
    8.
    发明授权
    Method of patterning a lapping plate, and patterned lapping plates 有权
    图案化研磨板和图案化研磨板的方法

    公开(公告)号：US09522454B2

    公开(公告)日：2016-12-20

    申请号：US13716456

    申请日：2012-12-17

    Applicant: Seagate Technology LLC

    Inventor： Raymond Leroy Moudry ,  Joel William Hoehn

    IPC: B24B37/16 ,  B24B37/26 ,  B24D18/00

    CPC classification number: B24B37/16 ,  B24B37/26 ,  B24D18/0009

    Abstract: A method of forming a patterned lapping plate by providing a working tool having a pattern comprising a plurality of raised teeth, each of the raised teeth having a base, at least one side wall, and a terminal end, and patterning the lapping plate with the tool to provide a working surface having an inverse pattern of the tool surface in the working surface of the lapping plate, the patterning process plastically deforming the working surface of the lapping plate.

    Abstract translation: 一种通过提供具有包括多个凸起齿的图案的加工工具来形成图案化研磨板的方法，每个凸起的齿具有基部，至少一个侧壁和末端，并且将研磨板与 工具，以提供在研磨板的工作表面中具有工具表面的相反图案的工作表面，图案化工艺使研磨板的工作表面发生塑性变形。

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