公开(公告)号：US06808661B2

公开(公告)日：2004-10-26

申请号：US10013079

申请日：2001-12-11

申请人： See Yap Ong ,  Kock Hien Wee ,  Shu Chuen Ho ,  Teng Hock Kuah ,  Jian Wu

发明人： See Yap Ong ,  Kock Hien Wee ,  Shu Chuen Ho ,  Teng Hock Kuah ,  Jian Wu

IPC分类号： B29C3108

CPC分类号： B29C45/14655 ,  B29C45/1701 ,  B29C45/18 ,  B29C70/72 ,  B29C2045/14868

摘要： A system is proposed for encapsulating in plastics material leadframe items comprising an IC wired to a leadframe. Dust of the plastics material is removed from the encapsulation system, and in particular from those items where dust principally accumulates, such as the surfaces of the molds. To reduce the level of dust which enters the molding region, the path along which the leadframe items are conveyed to the molding region is closed at times when the leadframe items are not being transported there. Additionally, the leadframe items are conveyed to the molding region under a cover including a vacuum source, so that the dust is continually sucked away from them.

摘要翻译： 提出一种用于封装在塑料材料引线框架中的系统，其包括连接到引线框的IC。 塑料材料的粉尘从包封系统中除去，特别是从灰尘主要积聚的物品（如模具表面）中除去。 为了降低进入模制区域的灰尘的水平，引导框架物品被输送到模制区域的路径在引导框架物品未被运送到那里时被关闭。 此外，引线框架物品被输送到包括真空源的盖子下方的模制区域，使得灰尘被连续地从它们中吸出。