公开(公告)号：US11951700B2

公开(公告)日：2024-04-09

申请号：US17602587

申请日：2020-04-09

Applicant: COMPAGNIE GENERALE DES ETABLISSEMENTS MICHELIN

Inventor： Guillaume Portier ,  Nicolas Eyroulet ,  Claude Lallement ,  Baptiste Forichon

IPC: B29D30/00 ,  B29C70/72 ,  B60C23/04 ,  G06K19/077

CPC classification number: B29D30/0061 ,  B29C70/72 ,  B60C23/0493 ,  G06K19/07764 ,  B29D2030/0077

Abstract: A method for encapsulating electronic devices comprises, successively, placing a profiled strip on a conveyor belt, the profiled strip comprising a base, at least one flap protruding with respect to said base; positioning an electronic device, in the longitudinal direction, on the receiving zone of the profiled strip; and plastically deforming the flap by application of an application force in a predetermined direction.

公开(公告)号：US11926077B2

公开(公告)日：2024-03-12

申请号：US17817064

申请日：2022-08-03

Applicant: The Boeing Company

Inventor： Jason Turner ,  Mitchell Zachary Kotlik ,  Christopher Robert Schwartz ,  Michael B. Black

IPC: B32B3/12 ,  B29C43/02 ,  B29C43/20 ,  B29C43/36 ,  B29C43/40 ,  B29C70/02 ,  B29C70/46 ,  B29C70/54 ,  B29C70/76 ,  B29D99/00 ,  B32B3/02 ,  B32B3/30 ,  B29C70/68 ,  B29C70/72 ,  B29L31/00 ,  B29L31/30 ,  B29L31/60

CPC classification number: B29C43/02 ,  B29C43/203 ,  B29C43/36 ,  B29C43/40 ,  B29C70/026 ,  B29C70/46 ,  B29C70/545 ,  B29C70/763 ,  B29D99/0089 ,  B32B3/02 ,  B32B3/12 ,  B32B3/30 ,  B29C2043/403 ,  B29C70/685 ,  B29C70/72 ,  B29C2793/0027 ,  B29C2793/009 ,  B29L2031/3076 ,  B29L2031/608 ,  B29L2031/72 ,  B32B2250/40 ,  B32B2605/18

Abstract: A composite sandwich panel comprises a first composite skin, a second composite skin, a hollow cell core between the first composite skin and the second composite skin, and a first over-crush edge region with a first edge. The first edge has a first thickness at least 40% less than a nominal thickness of the composite sandwich panel. The first over-crush edge region has a length of at least 0.25 inches over which a thickness of the composite sandwich panel decreases.

公开(公告)号：US11903758B2

公开(公告)日：2024-02-20

申请号：US16261796

申请日：2019-01-30

Applicant: OLYMPUS CORPORATION

Inventor： Toshihiro Kitahara

IPC: A61B8/12 ,  B29C70/72 ,  A61B8/14 ,  A61B8/00 ,  B29L31/00 ,  B33Y10/00 ,  B33Y80/00 ,  B29C64/135

CPC classification number: A61B8/12 ,  A61B8/14 ,  A61B8/445 ,  B29C64/135 ,  B29C70/72 ,  B33Y10/00 ,  B33Y80/00 ,  B29L2031/753

Abstract: A method of manufacturing an ultrasonic transducer module, the ultrasonic transducer module including an ultrasonic transducer, a cable electrically connecting the ultrasonic transducer and a board connectable to an ultrasonic observation device, and a relay board relaying electrical connection between the ultrasonic transducer and the cable, the method including: performing a first molding to form a first part of a casing by molding a single type of resin having an insulation property through a stereo lithographic molding method; and performing a second molding to form a second part of the casing in a state where the ultrasonic transducer, the relay board, and the cable are provided in the first part of the casing, the second part being manufactured by further molding the resin in a side of the first part, in which the ultrasonic transducer, the relay board, and the cable are arranged, through the stereo lithographic molding method.

公开(公告)号：US11890825B2

公开(公告)日：2024-02-06

申请号：US16972145

申请日：2019-06-13

Applicant: Zephyros, Inc.

Inventor： Henry E. Richardson

IPC: B29C44/00 ,  B29C44/04 ,  B62D29/00 ,  B29C70/52 ,  B29C65/48 ,  B29C44/18 ,  B29C70/72 ,  B29K75/00 ,  B29L31/30

CPC classification number: B29C70/52 ,  B29C44/00 ,  B29C44/04 ,  B29C44/186 ,  B29C65/48 ,  B62D29/002 ,  B29C70/72 ,  B29K2075/00 ,  B29L2031/3005 ,  B29L2031/3055

Abstract: A structural member (10) comprising: (i) a pultruded secondary member (14) including a first surface and an opposing second surface; and (ii) a molded carrier (12) overmolded onto at least one of the first and second surface of the pultruded secondary member, the molded carrier including a plurality of ribs (16); wherein the secondary member and the carrier are dissimilar materials.

公开(公告)号：US11828184B2

公开(公告)日：2023-11-28

申请号：US17908065

申请日：2021-02-19

Applicant: SAFRAN AIRCRAFT ENGINES

Inventor： Matteo Minervino ,  François Charleux ,  Didier Fromonteil

IPC: F01D11/00 ,  B29C70/24 ,  B29C70/72 ,  F01D5/14 ,  F01D5/28

CPC classification number: F01D11/008 ,  B29C70/24 ,  B29C70/72 ,  F01D5/147 ,  F01D5/282 ,  F05D2220/36 ,  F05D2240/80 ,  F05D2250/712 ,  F05D2300/44 ,  F05D2300/6034

Abstract: A composite platform for an aircraft turbine engine fan includes a wall of elongate shape that is configured to extend between two fan blades. The wall has an aerodynamic external face and an internal face on which is disposed a fixing tab configured to be fixed to a fan disc. A method for manufacturing the composite platform includes the steps of: a) producing a preform by three-dimensionally weaving of fibers, b) unbinding some of the fibers of the preform to detach at least one longitudinal layer of fibers from the rest of the preform, c) inserting a metal reinforcement between this layer and the rest of the preform, and d) injecting a resin into the preform so as to form said wall and secure the reinforcement to this wall.

公开(公告)号：US20230194076A1

公开(公告)日：2023-06-22

申请号：US18069247

申请日：2022-12-21

Applicant: Elemental LED, Inc.

Inventor： Brian McKay

IPC: F21V31/04 ,  F21S4/28 ,  B29C70/68 ,  B29C70/72

CPC classification number: F21V31/04 ,  B29C70/72 ,  B29C70/683 ,  F21S4/28 ,  F21Y2115/10

Abstract: A method for making continuous encapsulated linear lighting is disclosed. In this method, a PCB is placed within a channel, and the channel is dammed by one or more stoppers. The dammed segment is filled and then caused or allowed to cure. The stoppers are then removed from their initial positions and moved along the channel. If one runs out of channel before the desired length of linear lighting is achieved, a second piece of channel is abutted to the previous segment of channel, the PCB is laid into it, and a segment is dammed, filled, and cured. The process continues iteratively until the desired length is achieved or more channel is required. The PCB may initially be cut to the full desired length and applied to the channel piecewise as needed.

公开(公告)号：US20190211705A1

公开(公告)日：2019-07-11

申请号：US15868289

申请日：2018-01-11

Applicant: United Technologies Corporation

Inventor： Colin J. Kling

IPC: F01D21/04 ,  F01D25/24 ,  B32B1/08 ,  B32B3/08 ,  B32B3/28 ,  B32B5/26 ,  D04C1/06

CPC classification number: F01D21/045 ,  B29C70/228 ,  B29C70/24 ,  B29C70/70 ,  B29C70/72 ,  B29D99/0014 ,  B32B1/08 ,  B32B3/08 ,  B32B3/28 ,  B32B5/26 ,  B32B2260/021 ,  D04C1/06 ,  D10B2401/063 ,  D10B2505/02 ,  F01D25/24 ,  F05D2220/32 ,  F05D2220/36 ,  F05D2300/603 ,  F05D2300/6034

Abstract: A gas turbine engine component includes a tubular body section including a plurality of fiber wraps encompassed within a matrix composition and one or more integrally-formed stiffeners extending from an outer surface of the body section and in a component circumferential direction around the body section. The stiffener includes one or more fiber wraps extending radially outwardly from the body section over a form and to the body section from the form.

公开(公告)号：US09960543B2

公开(公告)日：2018-05-01

申请号：US14966748

申请日：2015-12-11

Applicant: JITS COMM CO., LTD(GD)

Inventor： Huanyi Chen

IPC: H01R13/6585 ,  H01R24/60 ,  H01R43/16 ,  B29C70/72 ,  H01R43/24 ,  H01R24/00 ,  H01R13/504 ,  B29C70/68 ,  H01R107/00 ,  B29L31/34 ,  B29K105/20

CPC classification number: H01R13/6585 ,  B29C70/683 ,  B29C70/72 ,  B29K2105/20 ,  B29K2995/0005 ,  B29K2995/0007 ,  B29L2031/3481 ,  H01R13/5045 ,  H01R23/02 ,  H01R24/60 ,  H01R43/16 ,  H01R43/24 ,  H01R2107/00

Abstract: A electrical connector includes an insulating body having a tongue plate, a plurality of upper conductive terminals having upper contact portions, and a plurality of lower conductive terminals having lower contact portions; the upper and lower conductive terminals are buried and molded in the insulating body, the upper contact portions and the lower contact portions are vertically aligned one by one and respectively exposed on an upper surface and a lower surface of the tongue plate; the upper conductive terminals vertically corresponding to the lower conductive terminals one by one so as to form a plurality of corresponding columns, and the upper and lower conductive terminals of at least one corresponding columns are fixedly connected with each other by riveting.

公开(公告)号：US20180097978A1

公开(公告)日：2018-04-05

申请号：US15679154

申请日：2017-08-17

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu WANG ,  Zhenyu CHEN ,  Nan GUO ,  Takehiko TANAKA ,  Bojie ZHAO ,  Zilong DENG

IPC: H04N5/225 ,  G02B7/10 ,  B29C43/18 ,  G02B7/02 ,  B29C43/52 ,  B29C43/36 ,  B29L31/00

CPC classification number: H04N5/2257 ,  B29C33/44 ,  B29C43/18 ,  B29C43/36 ,  B29C43/52 ,  B29C45/0025 ,  B29C45/14336 ,  B29C45/14467 ,  B29C45/14655 ,  B29C45/14819 ,  B29C45/40 ,  B29C70/72 ,  B29C70/88 ,  B29D11/00807 ,  B29K2101/12 ,  B29K2995/0003 ,  B29K2995/0018 ,  B29L2031/3425 ,  B29L2031/3437 ,  B29L2031/764 ,  G02B7/022 ,  G02B7/10 ,  G02B13/0085 ,  H04N5/2253 ,  H04N5/2254 ,  H05K1/0274 ,  H05K1/181 ,  H05K1/185 ,  H05K3/284 ,  H05K2201/10121 ,  H05K2203/0195 ,  H05K2203/1316 ,  H05K2203/1327 ,  Y02P70/611

Abstract: A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demoulding and avoiding stray lights.

公开(公告)号：US20180035028A1

公开(公告)日：2018-02-01

申请号：US15439909

申请日：2017-02-22

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu WANG ,  Zhenyu CHEN ,  Nan GUO ,  Takehiko TANAKA ,  Bojie ZHAO ,  Zilong DENG

IPC: H04N5/225 ,  B29C43/52 ,  B29C43/18 ,  B29C43/36 ,  G02B7/02 ,  G02B7/10

CPC classification number: H04N5/2257 ,  B29C33/44 ,  B29C43/18 ,  B29C43/36 ,  B29C43/52 ,  B29C45/0025 ,  B29C45/14336 ,  B29C45/14467 ,  B29C45/14655 ,  B29C45/14819 ,  B29C45/40 ,  B29C70/72 ,  B29C70/88 ,  B29D11/00807 ,  B29K2101/12 ,  B29K2995/0003 ,  B29K2995/0018 ,  B29L2031/3425 ,  B29L2031/3437 ,  B29L2031/764 ,  G02B7/022 ,  G02B7/10 ,  G02B13/0085 ,  H04N5/2253 ,  H04N5/2254 ,  H05K1/0274 ,  H05K1/181 ,  H05K1/185 ,  H05K3/284 ,  H05K2201/10121 ,  H05K2203/0195 ,  H05K2203/1316 ,  H05K2203/1327

Abstract: A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demoulding and avoiding stray lights.