公开(公告)号：US09603254B2

公开(公告)日：2017-03-21

申请号：US14129076

申请日：2012-07-10

申请人： Sehoon Yoo ,  Chang Woo Lee ,  Jun Ki Kim ,  Jeong Han Kim ,  Young Ki Ko

发明人： Sehoon Yoo ,  Chang Woo Lee ,  Jun Ki Kim ,  Jeong Han Kim ,  Young Ki Ko

IPC分类号： H05K3/00 ,  H01L21/768

CPC分类号： H05K3/0094 ,  H01L21/76898 ,  H01L2924/0002 ,  Y10T29/49165 ,  Y10T29/5193

摘要： A wafer via solder filling device includes a solder bath comprising an accommodation space for accommodating a molten solder, with an open top, and an air outlet for exhausting air from the accommodation space; a fixing unit for fixing the wafer having a via formed in one surface in the accommodation space to seal the accommodation space airtight; and a pressing unit for pressing a bottom of the molten solder arranged in the solder bath and moving the molten solder upward, to fill the molten solder in the via.

公开(公告)号：US20140123488A1

公开(公告)日：2014-05-08

申请号：US14129076

申请日：2012-07-10

申请人： Sehoon Yoo ,  Chang Woo Lee ,  Jun Ki Kim ,  Jeong Han Kim ,  Young Ki Ko

发明人： Sehoon Yoo ,  Chang Woo Lee ,  Jun Ki Kim ,  Jeong Han Kim ,  Young Ki Ko

IPC分类号： H05K3/00

CPC分类号： H05K3/0094 ,  H01L21/76898 ,  H01L2924/0002 ,  Y10T29/49165 ,  Y10T29/5193

摘要： A wafer via solder filling device includes a solder bath comprising an accommodation space for accommodating a molten solder, with an open top, and an air outlet for exhausting air from the accommodation space; a fixing unit for fixing the wafer having a via formed in one surface in the accommodation space to seal the accommodation space airtight; and a pressing unit for pressing a bottom of the molten solder arranged in the solder bath and moving the molten solder upward, to fill the molten solder in the via.

摘要翻译： 晶片通过焊料填充装置包括焊料槽，其包括用于容纳熔融焊料的容纳空间和开口顶部，以及用于从容纳空间排出空气的空气出口; 固定单元，用于固定具有形成在容纳空间中的一个表面中的通孔的晶片，以密封住容纳空间; 以及按压单元，用于按压布置在焊料槽中的熔融焊料的底部并向上移动熔融焊料，以填充通孔中的熔融焊料。

公开(公告)号：US08486827B2

公开(公告)日：2013-07-16

申请号：US13262293

申请日：2009-12-30

申请人： Se Hoon Yoo ,  Chang Woo Lee ,  Jun Ki Kim ,  Jeong Han Kim ,  Cheol Hee Kim ,  Young Ki Ko ,  Yue Seon Shin

发明人： Se Hoon Yoo ,  Chang Woo Lee ,  Jun Ki Kim ,  Jeong Han Kim ,  Cheol Hee Kim ,  Young Ki Ko ,  Yue Seon Shin

IPC分类号： H01L21/768

CPC分类号： H01L21/68785 ,  H01L21/68721 ,  H01L21/76898

摘要： A device of filling metal in a through-via-hole formed in a semiconductor wafer and a method of filling metal in a through-via-hole using the same are disclosed. A device of filling metal in a through-via-hole formed in a semiconductor wafer includes a jig base comprising a jig configured to fix the wafer having the through-via-hole formed therein; a upper chamber 120 installed on the jig base; a lower chamber installed under the jig base; a heater installed in the upper chamber, the heater configured to apply heat to filling metal placed on the wafer to melt the filling metal; and a vacuum pump configured to generate pressure difference between the upper chamber and the lower chamber by the pressure of the lower chamber reduced by discharging air of the lower chamber 130 outside, only to fill the melted filling metal in the through-via-hole.

摘要翻译： 公开了一种在半导体晶片中形成的通孔中填充金属的装置以及使用该通孔的贯通孔中填充金属的方法。 在半导体晶片中形成的通孔中填充金属的装置包括夹具基座，其包括夹具，其被配置为固定其中形成有通孔的晶片; 安装在夹具基座上的上腔室120; 安装在夹具底下的下腔室; 安装在所述上部腔室中的加热器，所述加热器构造成对放置在所述晶片上的填充金属施加热量以熔化所述填充金属; 以及真空泵，其构造成通过下部腔室130的空气排出而被下部腔室的压力产生上部腔室和下部腔室之间的压力差，仅将填充金属填充到通孔中。

公开(公告)号：US20120034776A1

公开(公告)日：2012-02-09

申请号：US13262293

申请日：2009-12-30

申请人： Se Hoon Yoo ,  Chang Woo Lee ,  Jun Ki Kim ,  Jeong Han Kim ,  Cheol Hee Kim ,  Young Ki Ko ,  Yue Seon Shin

发明人： Se Hoon Yoo ,  Chang Woo Lee ,  Jun Ki Kim ,  Jeong Han Kim ,  Cheol Hee Kim ,  Young Ki Ko ,  Yue Seon Shin

IPC分类号： H01L21/768 ,  B23K9/04

CPC分类号： H01L21/68785 ,  H01L21/68721 ,  H01L21/76898

摘要： A device of filling metal in a through-via-hole formed in a semiconductor wafer and a method of filling metal in a through-via-hole using the same are disclosed. A device of filling metal in a through-via-hole formed in a semiconductor wafer includes a jig base comprising a jig configured to fix the wafer having the through-via-hole formed therein; a upper chamber 120 installed on the jig base; a lower chamber installed under the jig base; a heater installed in the upper chamber, the heater configured to apply heat to filling metal placed on the wafer to melt the filling metal; and a vacuum pump configured to generate pressure difference between the upper chamber and the lower chamber by the pressure of the lower chamber reduced by discharging air of the lower chamber 130 outside, only to fill the melted filling metal in the through-via-hole.

摘要翻译： 公开了一种在半导体晶片中形成的通孔中填充金属的装置以及使用该通孔的贯通孔中填充金属的方法。 在半导体晶片中形成的通孔中填充金属的装置包括夹具基座，其包括夹具，其被配置为固定其中形成有通孔的晶片; 安装在夹具基座上的上腔室120; 安装在夹具底下的下腔室; 安装在所述上部腔室中的加热器，所述加热器构造成对放置在所述晶片上的填充金属施加热量以熔化所述填充金属; 以及真空泵，其构造成通过下部腔室130的空气排出而被下部腔室的压力产生上部腔室与下部腔室之间的压力差，仅将填充金属填充到通孔中。