公开(公告)号：US4573422A

公开(公告)日：1986-03-04

申请号：US628467

申请日：1984-07-06

申请人： Seiichiro Murata ,  Masaru Tateishi ,  Kohji Hayakawa ,  Takeshi Sakamoto ,  Shin Takeuchi ,  Kohsuke Mukasa

发明人： Seiichiro Murata ,  Masaru Tateishi ,  Kohji Hayakawa ,  Takeshi Sakamoto ,  Shin Takeuchi ,  Kohsuke Mukasa

IPC分类号： B63B3/62 ,  B63B3/20

CPC分类号： B63B3/20

摘要： A transverseless ship has at least its side portions and bottom portion comprised of a double hull construction which comprises an inner hull plating and an outer hull plating connected together only by transverse bulkheads and a plurality of longitudinal connecting member fixed to the bulkheads. The bottom portion of the ship has a space defined by at least two optionally selected connecting longitudinal members and divided by two horizontal partitions into two upper chambers and a lower chamber. The upper chambers are adapted to pass different fluids therethrough, and the lower chamber is provided with docking brackets each conforming to the sectional shape thereof. With this structure, external forces acting on the ship are delivered from the connecting longitudinal members to the transverse bulkheads to prevent the inner and outer platings from buckling. The absence of reinforcing transverse members intersecting the connecting longitudinal members assures automatic welding operation with greatly improved efficiency. Since the space within the double hull is utilized to provide fluid channels, there is no need to provide additional fluid transport piping. The docking bracket provided under the fluid channel prevents the bottom portion from deforming when the ship is supported on blocks within a dock.

摘要翻译： 至少其横向船体至少具有侧部，底部由双层船体构造构成，该双层船体结构包括内部船体电镀和外部船体电镀，外部船体电镀仅通过横向舱壁连接在一起，并且固定在舱壁上的多个纵向连接构件。 船的底部具有由至少两个可选择的连接纵向构件限定的空间，并由两个水平隔板分成两个上室和下室。 上部腔室适于使不同的流体通过其中，并且下部腔室设置有各自符合其截面形状的对接支架。 利用这种结构，作用在船上的外力从连接的纵向构件被输送到横向舱壁，以防止内部和外部电镀板屈曲。 没有与连接纵向构件相交的加强横向构件确保了自动焊接操作，并且效率大大提高。 由于双壳体内的空间用于提供流体通道，所以不需要提供附加的流体输送管道。 设置在流体通道下方的对接托架防止当船舶支撑在码头内的块上时底部部分变形。

公开(公告)号：US4674430A

公开(公告)日：1987-06-23

申请号：US824524

申请日：1986-01-31

申请人： Seiichiro Murata ,  Masaru Tateishi ,  Kohji Hayakawa ,  Takeshi Sakamoto ,  Kohsuke Mukasa

发明人： Seiichiro Murata ,  Masaru Tateishi ,  Kohji Hayakawa ,  Takeshi Sakamoto ,  Kohsuke Mukasa

IPC分类号： B63B3/62 ,  B63B3/20 ,  B29C45/18

CPC分类号： B63B3/20

摘要： A transverseless ship has at least its side portions and bottom portion comprised of a double hull construction which comprises an inner hull plating and an outer hull plating connected together only by transverse bulkheads and a plurality of connecting longitudinal members fixed to the bulkheads. The bottom portion of the ship has a space defined by at least two optionally selected connecting longitudinal members and divided by a partition into an upper chamber and a lower chamber. The upper chamber is adapted in its entirety to pass a fluid therethrough. With this structure, external forces acting on the ship are delivered from the connecting longitudinal members to the transverse bulkheads to prevent the inner and outer platings from buckling. The absence of reinforcing transverse members intersecting the connecting longitudinal members assures automatic welding operation with greatly improved efficiency. Since the space defined by the connecting longitudinal members is utilized as a fluid channel, there is no need to provide additional fluid transport piping.

摘要翻译： 至少其横截面的船只至少具有由双层船体结构构成的底部部分，该双层船体结构包括内部船体电镀和外部船体电镀板，其仅通过横向舱壁连接在一起，并且多个连接纵向构件固定在舱壁上。 船的底部具有由至少两个可选择的连接纵向构件限定的空间，并且被隔板分隔成上室和下室。 上部腔室整体适应通过流体。 利用这种结构，作用在船上的外力从连接的纵向构件被输送到横向舱壁，以防止内部和外部电镀板屈曲。 没有与连接纵向构件相交的加强横向构件确保了自动焊接操作，并且效率大大提高。 由于由连接的纵向构件限定的空间用作流体通道，因此不需要提供另外的流体输送管道。

公开(公告)号：US08824902B2

公开(公告)日：2014-09-02

申请号：US13177644

申请日：2011-07-07

申请人： Takeshi Sakamoto ,  Kosuke Komaki

发明人： Takeshi Sakamoto ,  Kosuke Komaki

IPC分类号： H04B10/06 ,  H04B10/00 ,  H04B17/00 ,  H04B10/079 ,  H04B10/032 ,  H04B10/61

CPC分类号： H04B10/032 ,  H04B10/07951 ,  H04B10/07953 ,  H04B10/616

摘要： An optical receiver includes: an optical to electric converter that converts a received optical signal into an analog electric signal; an analog to digital converter that converts the analog electric signal obtained by the optical to electric converter into a digital signal; a digital signal processor that performs wave shaping on the digital signal; an information extract circuit that extracts information related to loss or deterioration of the optical signal from a signal propagating from the analog to digital converter to the digital signal processor or a signal in the digital signal processor; and a judging circuit that judges, based on the information extracted by the information extract circuit, whether the optical signal is lost or deteriorates.

摘要翻译： 一种光接收机包括：光接收电转换器，将接收到的光信号转换为模拟电信号; 将由光电转换器获得的模拟电信号转换为数字信号的模数转换器; 数字信号处理器，对数字信号进行波形整形; 信息提取电路，从从模数转换器传播到数字信号处理器的信号或数字信号处理器中的信号中提取与光信号的丢失或劣化有关的信息; 以及判断电路，其基于由信息提取电路提取的信息判断光信号是丢失还是劣化。

公开(公告)号：US20130003283A1

公开(公告)日：2013-01-03

申请号：US13525669

申请日：2012-06-18

申请人： Takeshi Sakamoto

发明人： Takeshi Sakamoto

IPC分类号： G06F1/16

CPC分类号： G02F1/133308 ,  G02F2001/133314 ,  G02F2201/46

摘要： A display device includes: a display panel; a rear housing covering a back face of the display panel, and including a plurality of first screw holes at a peripheral portion thereof; a frame including a front portion, a side portion, a rear portion, and a plurality of second screw holes provided in the rear portion, the front portion covering a peripheral portion of a front face of the display panel, the side portion covering a side face of the display panel, the rear portion covering the peripheral portion of the rear housing, and the second screw holes being arranged alternately with the first screw holes; and a back face plate covering the rear portion of the frame and the rear housing, and including third screw holes corresponding to the first screw holes and the second screw holes.

摘要翻译： 显示装置包括：显示面板; 后壳体，其覆盖所述显示面板的背面，并且在其周边部分包括多个第一螺钉孔; 包括前部，侧部，后部和设置在后部的多个第二螺钉孔的框架，所述前部覆盖所述显示面板的正面的周边部分，所述侧部覆盖所述侧部 所述后部覆盖所述后壳体的周边部分，并且所述第二螺钉孔与所述第一螺钉孔交替布置; 以及覆盖框架的后部和后壳体的背面板，并且包括对应于第一螺钉孔和第二螺钉孔的第三螺钉孔。

公开(公告)号：US20120327501A1

公开(公告)日：2012-12-27

申请号：US13575376

申请日：2011-01-05

申请人： Takeshi Sakamoto ,  Takafumi Ogiwara

发明人： Takeshi Sakamoto ,  Takafumi Ogiwara

IPC分类号： G02B26/00

CPC分类号： B23K26/40 ,  B23K26/53 ,  B23K2103/50

摘要： In a laser processing system 400, a plurality of element patterns for creating a modulation pattern are prepared, and the modulation pattern is created from the element patterns according to a condition for forming the modified region for an object to be processed in order to form the modified region corresponding thereto. Laser light is modulated according to thus created modulation pattern, and the modified region is formed in the object by irradiation with the modulated laser light. Thus, according to the condition for forming the modified region corresponding to the object, the modulation pattern is created from the element patterns prepared beforehand.

摘要翻译： 在激光处理系统400中，准备用于产生调制图案的多个元件图案，并且根据用于形成待处理对象的修改区域的条件从元件图案创建调制图案，以便形成 对应的修改区域。 根据这样产生的调制图案对激光进行调制，通过照射调制后的激光将被修饰区域形成在物体内。 因此，根据用于形成对象的修改区域的条件，根据预先准备的元素图案产生调制图案。

公开(公告)号：US08138450B2

公开(公告)日：2012-03-20

申请号：US11994581

申请日：2006-07-03

申请人： Takeshi Sakamoto ,  Kenichi Muramatsu

发明人： Takeshi Sakamoto ,  Kenichi Muramatsu

IPC分类号： H01L21/78

CPC分类号： B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011 ,  H01L21/78

摘要： A method of cutting an object to be processed is provided, which can accurately cut an object to be processed comprising a substrate and a multilayer part provided on the front face of the substrate while having a plurality of functional devices into the functional devices along a line to cut in a short time even when the substrate is thick. A substrate 4 is irradiated with laser light L from the multilayer part 16 side while locating a converging point P within the substrate 4, so as to form a first modified region 71 shifted from the center position CL in the thickness direction of the substrate 4 to the rear face 21 side of the substrate 4 and a second modified region 72 shifted from the center position CL in the thickness direction of the substrate 4 to the front face 3 side of the substrate 4 within the substrate 4 along a line to cut, and generate a fracture 24 from the second modified region 72 to the front face 3 of the substrate 4. Thereafter, while in a state where an expandable tape 23 attached to the rear face 21 of the substrate 4 is expanded, a stress is generated in an object to be processed 1 such as to open the fracture 24.

摘要翻译： 提供了一种切割待处理物体的方法，其可以精确地切割被加工物，其包括基板和设置在基板的正面上的多层部件，同时沿着线路具有多个功能元件进入功能元件 即使在基材较厚时也能在短时间内切割。 基板4从多层部16侧照射激光L，同时将会聚点P定位在基板4内，以形成从基板4的厚度方向的中心位置CL移位的第一改质区域71到 基板4的背面21侧和第二改质区域72沿着切断线在基板4的基板4的基板4的基板4的前面3侧沿基板4的厚度方向从中心位置CL移位， 产生从第二改质区域72到基板4的正面3的断裂线24.此后，在将基板4的背面21上附着的可扩张带23膨胀的状态下，产生应力 待处理物体1如打开骨折24。

公开(公告)号：US20120006799A1

公开(公告)日：2012-01-12

申请号：US13235936

申请日：2011-09-19

申请人： Ryuji SUGIURA ,  Takeshi Sakamoto

发明人： Ryuji SUGIURA ,  Takeshi Sakamoto

IPC分类号： B23K26/00

CPC分类号： H01L21/78 ,  B23K26/0622 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  C03B33/0222

摘要： An object to be processed can be cut highly accurately along a line to cut.An object to be processed 1 is irradiated with laser light while locating a converging point within a silicon wafer 11, and the converging point is relatively moved along a line to cut 5, so as to form modified regions M1, M2 positioned within the object 1 along the line to cut 5, and then a modified region M3 positioned between the modified regions M1, M2 within the object 1.

摘要翻译： 可以沿着切割线高精度地切割待处理的物体。 在将硅晶片11内的会聚点定位的同时用激光照射被处理体1，并且会聚点沿切割线5相对移动，以形成位于物体1内的改质区域M1，M2 沿着切割线5，然后是位于对象1内的修改区域M1，M2之间的修改区域M3。

公开(公告)号：US20110316200A1

公开(公告)日：2011-12-29

申请号：US13151877

申请日：2011-06-02

申请人： Hiroyuki IWAKI ,  Takafumi Ogiwara ,  Takeshi Sakamoto ,  Masaharu Hoshikawa ,  Kazuhiro Atsumi ,  Daisuke Kawaguchi ,  Takafumi Tsunematsu

发明人： Hiroyuki IWAKI ,  Takafumi Ogiwara ,  Takeshi Sakamoto ,  Masaharu Hoshikawa ,  Kazuhiro Atsumi ,  Daisuke Kawaguchi ,  Takafumi Tsunematsu

IPC分类号： B29C35/08

CPC分类号： B23K26/53 ,  B23K26/064 ,  B23K26/40 ,  B23K2103/50

摘要： A method of cutting an object to be processed comprises the steps of irradiating an object to be processed with a laser light which is an elliptically-polarized light having an ellipticity other than 1 such that a direction of polarization of the laser light intersects a line to cut the object and a thickness direction of the object, while locating a converging point of the laser light within the object, so as to form a modified region within the object along the line and generate a fracture from the modified region in the thickness direction of the object, and causing the fracture to reach front and rear faces of the object so as to cut the object along the line.

摘要翻译： 切割待处理物体的方法包括以下步骤：用激光照射被处理物体，所述激光是椭圆偏振光以外的椭圆偏振光以外的激光，使得激光的偏振方向与 切割物体和物体的厚度方向，同时将激光的会聚点定位在物体内，以沿着线形成在物体内的改质区域，并从该改质区域在厚度方向上产生断裂 并且使裂缝到达物体的前后面以沿着该线切割物体。

公开(公告)号：US07970527B2

公开(公告)日：2011-06-28

申请号：US11260109

申请日：2005-10-28

申请人： Masahumi Nishi ,  Itsuki Hamaue ,  Yasuomi Kimura ,  Norio Tsuruta ,  Takeshi Sakamoto ,  Yasuo Ono

发明人： Masahumi Nishi ,  Itsuki Hamaue ,  Yasuomi Kimura ,  Norio Tsuruta ,  Takeshi Sakamoto ,  Yasuo Ono

IPC分类号： G06F19/00 ,  G06G7/70

CPC分类号： F02N11/10 ,  F02N11/0807

摘要： An engine start control apparatus enables a user to start an engine of a vehicle irrespective of a user's operation of ignition key. The engine start control apparatus includes a controller that performs engine start control and a storage unit. When the engine abnormally stops during a period in which the controller performs the engine start control, the storage unit stores at least one of a cause of the abnormal stop and a timing of the abnormal stop.

摘要翻译： 发动机启动控制装置使得用户能够启动车辆的发动机，而与使用者的点火钥匙的操作无关。 发动机起动控制装置包括执行发动机起动控制的控制器和存储单元。 当发动机在控制器执行发动机起动控制的期间发动机异常停止时，存储单元存储异常停止的原因和异常停止的定时中的至少一个。

公开(公告)号：US07947574B2

公开(公告)日：2011-05-24

申请号：US12748077

申请日：2010-03-26

申请人： Takeshi Sakamoto ,  Kenshi Fukumitsu

发明人： Takeshi Sakamoto ,  Kenshi Fukumitsu

IPC分类号： H01L21/00

CPC分类号： B28D5/0011 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/172 ,  B23K2103/50

摘要： A laser processing method is provided, which, even when a substrate formed with a laminate part including a plurality of functional devices is thick, can cut the substrate and laminate part with a high precision.This laser processing method irradiates a substrate 4 with laser light L while using a rear face 21 as a laser light entrance surface and locating a light-converging point P within the substrate 4, so as to form modified regions 71, 72, 73 within the substrate 4. Here, the quality modified region 71 is formed at a position where the distance between the front face 3 of the substrate 4 and the end part of the quality modified region 71 on the front face side is 5 μm to 15 μm. When the quality modified region 71 is formed at such a position, a laminate part 16 (constituted by interlayer insulating films 17a, 17b here) formed on the front face 3 of the substrate 4 is also cut along a line to cut with a high precision together with the substrate 4.

摘要翻译： 提供了一种激光加工方法，即使当形成有包括多个功能元件的层叠部件的基板较厚时，也可以高精度地切割基板并层压部件。 该激光加工方法使用背面21作为激光入射面，用激光L照射基板4，并且将聚光点P定位在基板4内，以在其内部形成改质区域71,72,73 这里，质量改质区域71形成在基板4的正面3与正面侧的质量改质区域71的端部之间的距离为5μm〜15μm的位置。 当在这样的位置形成质量改良区域71时，也形成在基板4的正面3上形成的层叠体部16（由这里的层间绝缘膜17a，17b构成），沿着切割线切割高精度 与基板4一起。