公开(公告)号：US20230213283A1

公开(公告)日：2023-07-06

申请号：US18147524

申请日：2022-12-28

Applicant: Semes Co., Ltd.

Inventor： Juyeon CHO ,  Youngjun Lee ,  Kwangsoo Kim ,  Kisang Eum ,  Wooram Lee ,  Jongwha Kang ,  Younghun Jung ,  Junghyun Lee ,  Dongwoon Park ,  Sunwook Jung

IPC: F27B17/00 ,  H01L21/67 ,  F27D5/00 ,  F27D1/18 ,  F27D17/00 ,  F27D9/00

CPC classification number: F27B17/0025 ,  H01L21/67103 ,  F27D5/0037 ,  F27D1/1858 ,  F27D17/001 ,  F27D9/00 ,  F27D2009/007

Abstract: A substrate processing apparatus includes a bake chamber, a chamber door that opens and closes an opening of the bake chamber, a first support plate in the bake chamber, a first partition wall, which partitions a space provided on the first support plate into first heat treatment spaces spaced apart from each other in a first horizontal direction, and extends in a second horizontal direction and a vertical direction, first heat treatment modules arranged in the first heat treatment spaces, a first exhaust duct extending in the first horizontal direction across the first heat treatment spaces, a first sealing bracket coupled to the first exhaust duct, a first horizontal packing configured to seal a gap between the first sealing bracket and the chamber door, and a first vertical packing configured to seal a gap between the first partition wall and the chamber door.