公开(公告)号：US20040025901A1

公开(公告)日：2004-02-12

申请号：US10631378

申请日：2003-07-30

Applicant: Semitool, Inc.

Inventor： Eric J. Bergman ,  Jeffrey J. Dennison ,  David P. Surdock

IPC: B08B003/12

CPC classification number: H01L21/67057 ,  B08B3/045 ,  B08B3/12

Abstract: A system and method for processing a workpiece, such as a semiconductor wafer, includes a spray mechanism that rotates around the workpiece while the workpiece rests on a stationary workpiece support in a process chamber. The spray mechanism preferably includes one or more spray arms attached to a motorized rotary union via hollow elbow sections. The rotary union is attached to a fluid supply valve and preferably includes a hollow shaft through which process fluid may travel from the fluid supply valve to the spray arms. The process chamber includes a drain through which process fluid may be removed from the process chamber. A process gas and/or vapor manifold, a sonic transducer, and/or a rinsing liquid manifold may be included in the process chamber for delivering a process gas or vapor, sonic energy, and/or a rinsing liquid into the process chamber in order to enhance processing of the workpiece.

Abstract translation: 用于处理诸如半导体晶片的工件的系统和方法包括在工件搁置在处理室中的固定工件支撑件上的情况下围绕工件旋转的喷射机构。 喷雾机构优选地包括通过空心弯头部分附接到电动旋转联接器的一个或多个喷射臂。 旋转联接器附接到流体供应阀，并且优选地包括中空轴，过程流体可以通过空心轴从流体供应阀行进到喷射臂。 处理室包括排出物，工序流体可以通过该排出物从处理室移除。 处理气体和/或蒸汽歧管，声音换能器和/或冲洗液体歧管可以包括在处理室中，用于将处理气体或蒸气，声能和/或冲洗液体按顺序输送到处理室 以加强工件的加工。