公开(公告)号：US20030102210A1

公开(公告)日：2003-06-05

申请号：US10084962

申请日：2002-02-27

Applicant: Semitool, Inc.

Inventor： Daniel J. Woodruff ,  Kyle M. Hanson

IPC: C25D017/12

CPC classification number: C25D17/12 ,  C25D7/123 ,  C25D17/001

Abstract: An electroplating apparatus includes a reactor vessel having a segmented anode array positioned therein for effecting electroplating of an associated workpiece such as a semiconductor wafer. The anode array includes a plurality of ring-like anode segments which are preferably positioned in concentric, coplanar relationship with each other. The anode segments can be independently operated to create varying electrical potentials with the associated workpiece to promote uniform deposition of electroplated metal on the surface of the workpiece.