Electroplating apparatus with segmented anode array

    公开(公告)号:US20030102210A1

    公开(公告)日:2003-06-05

    申请号:US10084962

    申请日:2002-02-27

    Applicant: Semitool, Inc.

    CPC classification number: C25D17/12 C25D7/123 C25D17/001

    Abstract: An electroplating apparatus includes a reactor vessel having a segmented anode array positioned therein for effecting electroplating of an associated workpiece such as a semiconductor wafer. The anode array includes a plurality of ring-like anode segments which are preferably positioned in concentric, coplanar relationship with each other. The anode segments can be independently operated to create varying electrical potentials with the associated workpiece to promote uniform deposition of electroplated metal on the surface of the workpiece.

    Semiconductor processing apparatus having lift and tilt mechanism
    2.
    发明申请
    Semiconductor processing apparatus having lift and tilt mechanism 失效
    具有升降机构的半导体处理装置

    公开(公告)号:US20040226510A1

    公开(公告)日:2004-11-18

    申请号:US10721057

    申请日:2003-11-24

    Applicant: Semitool. Inc.

    Abstract: A lift/tilt assembly for use in a semiconductor wafer processing device is set forth. The lift/tilt assembly includes a linear way comprising a fixed frame and a moveable frame. A nest for accepting a plurality of semiconductor wafers is rotatably connected to the moveable frame. The nest rotates between a wafer-horizontal orientation and a wafer-vertical orientation as it is driven with the movable frame by a motor that is coupled to the linear way. A lever connected to the nest provides an offset from true vertical for the nest when the nest is in the wafer-vertical orientation.

    Abstract translation: 阐述了用于半导体晶片处理装置的提升/倾斜组件。 提升/倾斜组件包括包括固定框架和可移动框架的线性方式。 用于接收多个半导体晶片的嵌座可旋转地连接到可移动框架。 当它由与可线性方式耦合的电动机用可移动框架驱动时,嵌套在晶片水平取向和晶片垂直取向之间旋转。 当嵌套处于晶片垂直方向时,连接到嵌套的杠杆提供与巢的真垂直的偏移。

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