公开(公告)号：US20040178065A1

公开(公告)日：2004-09-16

申请号：US10811710

申请日：2004-03-29

Applicant: Semitool, Inc.

Inventor： Martin Bleck ,  Kenneth C. Haugan ,  Larry R. Radloff ,  Harry Geyer

IPC: C25D017/06

CPC classification number: H01L21/68728 ,  C25D17/06

Abstract: A semiconductor workpiece holder for use in processing a semiconductor workpiece includes a workpiece support operatively mounted to support a workpiece in position for processing. A finger assembly is operatively mounted upon the workpiece support and includes a finger tip. The finger assembly is movable between an engaged position in which the finger tip is engaged against the workpiece, and a disengaged position in which the finger tip is moved away from the workpiece. Preferably, at least one electrode forms part of the finger assembly and includes an electrode contact for contacting a surface of said workpiece. At least one protective sheath covers at least some of the electrode contact. According to one aspect of the invention, a sheathed electrode having a sheathed electrode tip is positioned against a semiconductor workpiece surface in a manner engaging the workpiece surface with said sheathed electrode tip. A seal is formed about the periphery of the electrode tip, and with the electrode tip engaging the workpiece, a desired electrical contact is made to the workpiece. Thereafter, the workpiece is exposed to desired semiconductor processing conditions.

Abstract translation: 用于处理半导体工件的半导体工件保持件包括可操作地安装以将工件支撑在适于处理的工件的工件支撑件。 手指组件可操作地安装在工件支撑件上并且包括指尖。 手指组件可在指尖接合工件的接合位置和指尖从工件移开的脱离位置之间移动。 优选地，至少一个电极形成指状组件的一部分，并且包括用于接触所述工件的表面的电极接触。 至少一个护套覆盖至少一些电极接触。 根据本发明的一个方面，具有护套电极末端的护套电极以与所述护套电极末端接合工件表面的方式抵靠半导体工件表面定位。 围绕电极末端的周边形成密封，并且电极末端与工件接合，对工件进行所需的电接触。 此后，将工件暴露于期望的半导体加工条件。