公开(公告)号：US20030102019A1

公开(公告)日：2003-06-05

申请号：US10199998

申请日：2002-07-19

Applicant: Semitool, Inc.

Inventor： Trevor Henke ,  Craig Meuchel ,  Marvin Bernt

IPC: B08B003/00

CPC classification number: H01L21/67313 ,  B08B3/02 ,  Y10S134/901 ,  Y10S134/902 ,  Y10S414/14

Abstract: A centrifugal spray processor for processing semiconductor wafers uses larger numbers of spray nozzles. Each spray nozzle delivers a reduced volume of liquid, to reduce consumption of liquid process chemicals. The nozzles operate at a higher back pressure. The increased number of nozzles, offset nozzle patterns and groupings of nozzles, lower nozzle flow rates, and higher nozzle back pressures, provide improved processing results. The improved spray system may be provided as a retrofit kit.

Abstract translation: 用于处理半导体晶片的离心喷雾处理器使用更大数量的喷嘴。 每个喷嘴可以减少液体的体积，以减少液态工艺化学品的消耗。 喷嘴在较高的背压下工作。 喷嘴数量的增加，喷嘴图案的偏移以及喷嘴的分组，喷嘴流速的降低以及喷嘴背压的提高提供了改进的处理结果。 改进的喷雾系统可以作为改装套件提供。