公开(公告)号：US20020083614A1

公开(公告)日：2002-07-04

申请号：US10097074

申请日：2002-03-12

Applicant: Semitool, Inc.

Inventor： Robert Weaver ,  Ronald Schlagenhaufer

IPC: F26B017/24 ,  F26B017/30 ,  F26B011/02 ,  D06F058/00 ,  G05G001/00 ,  G05G003/00

CPC classification number: H01L21/67313 ,  H01L21/67316 ,  Y10S414/141

Abstract: A rotor that may be used by itself or in a processing machine for processing semiconductor wafers includes two pairs of combs. A lock down mechanism has a lock bar, temporarily engaged and moved by a loading/unloading robot, drives a retainer against the edges of the wafers, to better hold them in place during processing. Contamination via generation of particles is reduced. Combs on the rotor have a resilient strip. The lower edges of the wafers compress slightly into or deflect the resilient strip, when urged into place by the lock down mechanism.

Abstract translation: 可以单独使用或用于处理半导体晶圆的处理机中的转子包括两对梳子。 锁定机构具有通过装载/卸载机器人临时接合和移动的锁定杆，将保持器驱动抵靠晶片的边缘，以在加工期间更好地将其保持在适当位置。 通过产生颗粒的污染减少。 转子上的梳子有一个弹性条。 当被锁定机构推动就位时，晶片的下边缘稍微压入或偏转弹性带。