公开(公告)号：US20040055895A1

公开(公告)日：2004-03-25

申请号：US10667802

申请日：2003-09-22

Applicant: Semitool, Inc.

Inventor： Zhongmin Hu ,  Thomas L. Ritzdorf ,  Lyndon W. Graham

IPC: C25D003/50 ,  C25D007/06 ,  C25D003/56

CPC classification number: C25D17/001 ,  C25D7/123

Abstract: The present invention is directed to methods and compositions for depositing a noble metal alloy onto a microelectronic workpiece. In one particular aspect of the invention, a platinum metal alloy is electrochemically deposited on a surface of the workpiece from an acidic plating composition. The plated compositions when combined with high-k dielectric material are useful in capacitor structures.

Abstract translation: 本发明涉及将贵金属合金沉积到微电子工件上的方法和组合物。 在本发明的一个特定方面，铂金属合金由酸性电镀组合物电化学沉积在工件的表面上。 当与高k电介质材料组合时，电镀组合物可用于电容器结构。