公开(公告)号：US20020074233A1

公开(公告)日：2002-06-20

申请号：US09885451

申请日：2001-06-20

Applicant: Semitool, Inc.

Inventor： Thomas L. Ritzdorf ,  E. Henry Stevens ,  Linlin Chen ,  Lyndon W. Graham ,  Curt Dundas

IPC: C25D005/18 ,  C25D007/12 ,  C25D011/32 ,  C25D005/50 ,  C25D017/00

CPC classification number: H01L21/67173 ,  C25D5/022 ,  C25D5/50 ,  C25D7/123 ,  C25D17/001 ,  H01L21/2885 ,  H01L21/6723 ,  H01L21/76838 ,  H01L21/76877 ,  H01L21/76883

Abstract: A method for filling recessed microstructures at a surface of a microelectronic workpiece, such as a semiconductor wafer, with metallization is set forth. In accordance with the method, a metal layer is deposited into the microstructures with a process, such as an electroplating process, that generates metal grains that are sufficiently small so as to substantially fill the recessed microstructures. The deposited metal is subsequently subjected to an annealing process at a temperature below about 100 degrees Celsius, and may even take place at ambient room temperature to allow grain growth which provides optimal electrical properties. Various novel apparatus for executing unique annealing processes are also set forth.

Abstract translation: 阐述了在金属化的微电子工件（例如半导体晶片）的表面处填充凹陷微结构的方法。 根据该方法，金属层通过诸如电镀工艺的工艺沉积到微结构中，该工艺产生足够小的金属颗粒，以便基本上填充凹陷的微结构。 沉积的金属随后在低于约100摄氏度的温度下进行退火处理，并且甚至可以在环境室温下进行，以允许提供最佳电性能的晶粒生长。 还提出了用于执行独特退火工艺的各种新型装置。

公开(公告)号：US20020004301A1

公开(公告)日：2002-01-10

申请号：US09815931

申请日：2001-03-23

Applicant: Semitool, Inc.

Inventor： Linlin Chen ,  Lyndon W. Graham ,  Thomas L. Ritzdorf ,  Dakin Fulton ,  Robert W. Batz JR.

IPC: H01L021/44

CPC classification number: H01L21/2885 ,  C25D5/02 ,  C25D5/10 ,  C25D5/18 ,  C25D5/50 ,  C25D7/123 ,  H01L21/76877 ,  H01L21/76883

Abstract: Methods for depositing a metal into a micro-recessed structure in the surface of a microelectronic workpiece are disclosed. The methods are suitable for use in connection with additive free as well as additive containing electroplating solutions. In accordance with one embodiment, the method includes making contact between the surface of the microelectronic workpiece and an electroplating solution in an electroplating cell that includes a cathode formed by the surface of the microelectronic workpiece and an anode disposed in electrical contact with the electroplating solution. Next, an initial film of the metal is deposited into the micro-recessed structure using at least a first electroplating waveform having a first current density. The first current density of the first electroplating waveform is provided to enhance the deposition of the metal at a bottom of the micro-recessed structure. After this initial plating, deposition of the metal is continued using at least a second electroplating waveform having a second current density. The second current density of the second electroplating waveform is provided to assist in reducing the time required to substantially complete filling of the micro-recessed structure.

Abstract translation: 公开了在微电子工件的表面中将金属沉积到微凹陷结构中的方法。 该方法适合与无添加剂结合使用，以及含有电镀溶液的添加剂。 根据一个实施例，该方法包括使微电子工件的表面与电镀电池中的电镀液接触，该电镀槽包括由微电子工件的表面形成的阴极和与电镀溶液电接触的阳极。 接下来，使用至少具有第一电流密度的第一电镀波形将金属的初始膜沉积到微凹陷结构中。 提供第一电镀波形的第一电流密度以增强金属在微凹陷结构底部的沉积。 在该初始电镀之后，使用具有第二电流密度的至少第二电镀波形继续沉积金属。 提供第二电镀波形的第二电流密度以帮助减少基本上完成微凹陷结构填充所需的时间。

公开(公告)号：US20040055895A1

公开(公告)日：2004-03-25

申请号：US10667802

申请日：2003-09-22

Applicant: Semitool, Inc.

Inventor： Zhongmin Hu ,  Thomas L. Ritzdorf ,  Lyndon W. Graham

IPC: C25D003/50 ,  C25D007/06 ,  C25D003/56

CPC classification number: C25D17/001 ,  C25D7/123

Abstract: The present invention is directed to methods and compositions for depositing a noble metal alloy onto a microelectronic workpiece. In one particular aspect of the invention, a platinum metal alloy is electrochemically deposited on a surface of the workpiece from an acidic plating composition. The plated compositions when combined with high-k dielectric material are useful in capacitor structures.

Abstract translation: 本发明涉及将贵金属合金沉积到微电子工件上的方法和组合物。 在本发明的一个特定方面，铂金属合金由酸性电镀组合物电化学沉积在工件的表面上。 当与高k电介质材料组合时，电镀组合物可用于电容器结构。

公开(公告)号：US20030045095A1

公开(公告)日：2003-03-06

申请号：US09880715

申请日：2001-06-12

Applicant: Semitool, Inc.

Inventor： Thomas L. Ritzdorf ,  Lyndon W. Graham ,  Robert W. Batz JR.

IPC: H01L021/44 ,  H01L021/4763

CPC classification number: H01L21/2885 ,  C25D5/02 ,  C25D5/10 ,  C25D5/18 ,  C25D5/50 ,  C25D7/123 ,  H01L21/76877 ,  H01L21/76883

Abstract: A method for filling recessed micro-structures at a surface of a semiconductor wafer with metallization is set forth. In accordance with the method, a metal layer is deposited into the micro-structures with a process, such as an electroplating process, that generates metal grains that are sufficiently small so as to substantially fill the recessed micro-structures. The deposited metal is subsequently subjected to an annealing process at a temperature below about 100 degrees Celsius, and may even take place at ambient room temperature to allow grain growth which provides optimal electrical properties.

公开(公告)号：US20020000378A1

公开(公告)日：2002-01-03

申请号：US09884003

申请日：2001-06-18

Applicant: Semitool, Inc.

Inventor： Robert W. Batz, JR. ,  Scot Conrady ,  Thomas L. Ritzdorf

IPC: C25D003/60 ,  C25D021/12

CPC classification number: C25D3/30 ,  C25D3/34 ,  C25D7/123 ,  C25D17/001

Abstract: The present invention is directed to an improved electroplating method, chemistry, and apparatus for selectively depositing tin/lead solder bumps and other structures at a high deposition rate pursuant to manufacturing a microelectronic device from a workpiece, such as a semiconductor wafer. An apparatus for plating solder on a microelectronic workpiece in accordance with one aspect of the present invention comprises a reactor chamber containing an electroplating solution having free ions of tin and lead for plating onto the workpiece. A chemical delivery system is used to deliver the electroplating solution to the reactor chamber at a high flow rate. A workpiece support is used that includes a contact assembly for providing electroplating power to a surface at a side of the workpiece that is to be plated. The contact contacts the workpiece at a large plurality of discrete contact points that isolated from exposure to the electroplating solution. An anode, preferably a consumable anode, is spaced from the workpiece support within the reaction chamber and is in contact with the electroplating solution. In accordance with one embodiment the electroplating solution comprises a concentration of a lead compound, a concentration of a tin compound, water and methane sulfonic acid.

Abstract translation: 本发明涉及一种改进的电镀方法，化学和装置，用于根据从诸如半导体晶片的工件制造微电子器件，以高沉积速率选择性地沉积锡/铅焊料凸块和其它结构。 根据本发明的一个方面的用于在微电子工件上电镀焊料的装置包括反应室，该反应室含有具有锡和铅的游离离子的电镀溶液，用于电镀到工件上。 化学输送系统用于以高流速将电镀溶液输送到反应室。 使用工件支撑件，其包括用于向要被电镀的工件的一侧的表面提供电镀功率的接触组件。 触点在与暴露于电镀溶液中分离的大量离散接触点处接触工件。 阳极，优选是可消耗阳极，与反应室内的工件支撑件间隔开并与电镀溶液接触。 根据一个实施例，电镀溶液包含铅化合物的浓度，锡化合物的浓度，水和甲烷磺酸。

公开(公告)号：US20030015417A1

公开(公告)日：2003-01-23

申请号：US09683597

申请日：2002-01-23

Applicant: Semitool, Inc.

Inventor： Dakin Fulton ,  Thomas L. Ritzdorf

IPC: B23H007/04 ,  B23H003/02 ,  B23H007/14 ,  C25B009/00 ,  C25B009/04 ,  C25B015/00 ,  C25C003/16 ,  C25C003/20 ,  C25D017/00 ,  C25D021/12 ,  C25F007/00 ,  G01N001/00 ,  G01N021/00 ,  G01N031/00 ,  G01N033/00 ,  G01N015/06 ,  G01N033/48 ,  G04C023/00

CPC classification number: C25D21/14 ,  G05D11/133 ,  Y10T436/11

Abstract: An automated chemical management system for managing the chemical content of an electrochemical bath used to deposit a material on the surface of a microelectronic workpiece is set forth. The automated chemical management system includes a dosing system that is adapted to dose an amount of one or more chemicals to replenish a given electrochemical bath constituent in accordance with a predetermined dosing equation. The chemical management system also includes an analytical measurement system that is adapted to provide a measurement result indicative of the amount of the given constituent in the electrochemical bath at predetermined time intervals. The chemical management system uses the measurement results to modify the dosing equation of the dosing system. In this manner, the replenishment operations executed by the chemical management system are effectively refined over time thereby providing more accurate control of the amount of the target constituent in the electrochemical bath.