公开(公告)号：US20040013797A1

公开(公告)日：2004-01-22

申请号：US10200072

申请日：2002-07-19

Applicant: Semitool,Inc.

Inventor： Raymon Thompson ,  Gordon Nelson

IPC: B05D003/12

CPC classification number: H01L21/6708 ,  H01L21/67051

Abstract: A machine for processing a flat workpiece or wafer has a head, which spins the wafer between upper and lower weirs in a base. The head is spaced apart from the base by an air gap. A vacuum source attached to an exhaust opening in the base draw air through the air gap, to reduce or eliminate movement of process chemicals into the head. Corrosion of head components by process chemicals is reduced. The disadvantages of having a mechanical seal between the base and the head are also eliminated.

Abstract translation: 用于处理平坦工件或晶片的机器具有头部，其在基部中的上堰和下堰之间旋转晶片。 头部与基座间隔开一个气隙。 附着在底座中的排气口的真空源通过气隙吸引空气，以减少或消除过程化学物质进入头部的运动。 头部组分由工艺化学品腐蚀减少。 也消除了在基座和头部之间具有机械密封的缺点。