公开(公告)号：US11825605B2

公开(公告)日：2023-11-21

申请号：US16649427

申请日：2018-07-24

申请人： Sensor Holdings Limited

发明人： Todd Alan Gisby ,  Llewellyn Adair Sims Johns ,  Andrew Thomas Wong ,  Felix Qing-Song Lun ,  Paul Malcolm Guininbert ,  Jeremy Labrado ,  Lewis Freeth Harpham ,  Elodie Lyath Bouzbib

IPC分类号： H05K1/18 ,  H05K1/14 ,  H01R12/70 ,  H01R12/62 ,  H01R12/79 ,  H01R43/00 ,  H05K3/32 ,  G01D5/24 ,  G01L1/14

CPC分类号： H05K1/18 ,  G01D5/24 ,  G01L1/142 ,  H01R12/62 ,  H01R12/7076 ,  H01R12/79 ,  H01R43/00 ,  H05K1/147 ,  H05K3/321 ,  H05K3/326 ,  H05K2201/10151

摘要： One aspect of the invention provides an interconnect between a stretchable electronic element and a circuit on a rigid or flexible printed circuit board (PCB Circuit), the stretchable electronic element is operable to be mechanically coupled to a substrate which deforms, and the stretchable electronic element will deform with the substrate and may or may not change an electrical characteristic as a result, the stretchable electronic element comprising one or more electrical pathways; the PCB Circuit configured to communicate electronically with the stretchable electronic element and comprising at least one circuit board extending from the stretchable electronic element to an electrical circuit on the PCB Circuit; wherein the interconnect comprises an electrical coupling between the electrical pathways of the stretchable electronic element and the PCB Circuit; and wherein the interconnect simultaneously prevents the connection between the stretchable electronic element from failing when the stretchable substrate is stretched in normal operation, minimizes the bulk of support material required to support the interconnect, and minimizes any reduction in the stretch capabilities of the stretchable substrate.