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公开(公告)号:US10925169B2
公开(公告)日:2021-02-16
申请号:US16475663
申请日:2017-12-29
申请人: Seung Hwan Park , Dong Jun Lee
发明人: Seung Hwan Park , Dong Jun Lee , Kyung Do Kim , Kwang Ho Lee
摘要: The present invention relates to: a method for manufacturing a transparent light emitting device, which can minimize the manufacturing time of a large-area high-resolution transparent light emitting device and maximize the productivity thereof by forming an integrated metal mesh circuit pattern through a UV imprinting technology; and a transparent light emitting device manufactured thereby.