公开(公告)号：US20120262385A1

公开(公告)日：2012-10-18

申请号：US13308282

申请日：2011-11-30

申请人： Seung-Hyun KIM ,  Hyung-Chul Kim ,  Tae-Yeon Yoo

发明人： Seung-Hyun KIM ,  Hyung-Chul Kim ,  Tae-Yeon Yoo

IPC分类号： G06F3/041 ,  H05K3/10 ,  H05K3/06 ,  B05D5/12

CPC分类号： G06F3/044 ,  G06F2203/04103

摘要： A touch panel is made by forming a routing and pad pattern group on a substrate to include first and second routing lines, first pad electrodes connected to the first routing line, and second pad electrodes connected to the second routing line, by using a first mask; forming a sensor electrode pattern group on the substrate having the routing and pad pattern group formed thereon to include first sensor electrodes formed in a first direction, second sensor electrodes formed in a second direction, and connection portions that each connects adjacent first sensor electrodes, by using a second mask; forming a first insulating layer to include contact holes to expose portions of the second sensor electrodes, respectively, by using a third mask; and forming bridges that each connects adjacent second sensor electrodes through the contact holes and a second insulating layer on the bridges, by using a fourth mask.

摘要翻译： 通过在衬底上形成布线和焊盘图案组以包括第一和第二布线线，连接到第一布线线的第一焊盘电极和连接到第二布线线的第二焊盘电极，通过使用第一掩模 ; 在其上形成有路由和焊盘图案组的基板上形成传感器电极图案组，以包括沿第一方向形成的第一传感器电极，在第二方向上形成的第二传感器电极和连接相邻的第一传感器电极的连接部分， 使用第二个掩模; 形成第一绝缘层，以分别包括通过使用第三掩模来暴露第二传感器电极的部分的接触孔; 以及通过使用第四掩模形成每个通过接触孔连接邻近的第二传感器电极的桥和桥上的第二绝缘层。

公开(公告)号：US09262018B2

公开(公告)日：2016-02-16

申请号：US13308282

申请日：2011-11-30

申请人： Seung-Hyun Kim ,  Hyung-Chul Kim ,  Tae-Yeon Yoo

发明人： Seung-Hyun Kim ,  Hyung-Chul Kim ,  Tae-Yeon Yoo

IPC分类号： G06F3/044

CPC分类号： G06F3/044 ,  G06F2203/04103

摘要： A touch panel is made by forming a routing and pad pattern group on a substrate to include first and second routing lines, first pad electrodes connected to the first routing line, and second pad electrodes connected to the second routing line, by using a first mask; forming a sensor electrode pattern group on the substrate having the routing and pad pattern group formed thereon to include first sensor electrodes formed in a first direction, second sensor electrodes formed in a second direction, and connection portions that each connects adjacent first sensor electrodes, by using a second mask; forming a first insulating layer to include contact holes to expose portions of the second sensor electrodes, respectively, by using a third mask; and forming bridges that each connects adjacent second sensor electrodes through the contact holes and a second insulating layer on the bridges, by using a fourth mask.

摘要翻译： 通过在衬底上形成布线和焊盘图案组以包括第一和第二布线线，连接到第一布线线的第一焊盘电极和连接到第二布线线的第二焊盘电极，通过使用第一掩模 ; 在其上形成有路由和焊盘图案组的基板上形成传感器电极图案组，以包括沿第一方向形成的第一传感器电极，在第二方向上形成的第二传感器电极和连接相邻的第一传感器电极的连接部分， 使用第二个掩模; 形成第一绝缘层，以分别包括通过使用第三掩模来暴露第二传感器电极的部分的接触孔; 以及通过使用第四掩模形成每个通过接触孔连接邻近的第二传感器电极的桥和桥上的第二绝缘层。

公开(公告)号：US08319418B2

公开(公告)日：2012-11-27

申请号：US12647949

申请日：2009-12-28

申请人： Jae-Young Lee ,  Tae-Yeon Yoo

发明人： Jae-Young Lee ,  Tae-Yeon Yoo

IPC分类号： H01J1/62 ,  H01J63/04

CPC分类号： H01L27/3276

摘要： The present invention relates to an organic electro-luminescence display device and a method for fabricating the same, in which damage to a pad portion is prevented for improving yield.The organic electro-luminescence display device includes a thin film transistor array unit formed on a front surface of a lower substrate and a pad portion extended from the thin film transistor array unit, an organic EL array unit on the thin film transistor array unit having a matrix of organic EL cells, and a protective member for protecting the organic EL array unit and the thin film transistor array unit and exposing the pad portion to an outside, wherein the lower substrate has a thickness of a first region overlapped with the pad portion thicker than a thickness of a second region overlapped with the thin film transistor array unit.

摘要翻译： 有机电致发光显示装置及其制造方法技术领域本发明涉及一种有机电致发光显示装置及其制造方法，其中防止了对焊盘部分的损伤以提高产量。 有机电致发光显示装置包括形成在下基板的前表面上的薄膜晶体管阵列单元和从薄膜晶体管阵列单元延伸的焊盘部分，薄膜晶体管阵列单元上的有机EL阵列单元具有 有机EL单元的矩阵，以及用于保护有机EL阵列单元和薄膜晶体管阵列单元的保护构件，并且将该焊盘部分暴露于外部，其中下基板具有与焊盘部分重叠的第一区域的厚度更厚 而不是与薄膜晶体管阵列单元重叠的第二区域的厚度。