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公开(公告)号:US6151203A
公开(公告)日:2000-11-21
申请号:US212000
申请日:1998-12-14
申请人: Shamouil Shamouilian , Ananda Kumar , Arnold Kholodenko , Dennis S. Grimard , Liang Guo Wang , Gerhard Schneider , Michael G. Chafin , Semyon Kats , Alexander Veytser , Senh Thach
发明人: Shamouil Shamouilian , Ananda Kumar , Arnold Kholodenko , Dennis S. Grimard , Liang Guo Wang , Gerhard Schneider , Michael G. Chafin , Semyon Kats , Alexander Veytser , Senh Thach
IPC分类号: H01L21/68 , H01L21/683 , H01R13/05 , H02N13/00
CPC分类号: H01L21/6833 , H02N13/00 , H01R13/052
摘要: A semiconductor wafer chuck for retaining a semiconductor wafer during semiconductor wafer processing in a semiconductor wafer processing system including a connector connecting DC chucking voltage and RF biasing power to an electrode embedded in the body of the chuck. The connector for the chuck includes two or more members joined by resilient banana connections. The connector may be adapted for use as a high temperature connector for an electrostatic chuck operated at an elevated temperature and such connector includes a thermal impedance for reducing the heat transferred from the chuck to the bottom of the connector.
摘要翻译: 一种用于在半导体晶片处理系统中保持半导体晶片的半导体晶片卡盘,该半导体晶片处理系统包括将DC夹持电压和RF偏压功率连接到嵌入在卡盘的主体中的电极的连接器。 用于卡盘的连接器包括通过弹性香蕉连接件连接的两个或多个构件。 连接器可以适用于用于在高温下操作的静电卡盘的高温连接器,并且这种连接器包括用于减少从卡盘传递到连接器底部的热量的热阻抗。