公开(公告)号：US20100055605A1

公开(公告)日：2010-03-04

申请号：US12435002

申请日：2009-05-04

申请人： Shang-Hoon SEO ,  Jae-Woo Joung ,  Kyoung-Jin Jeong ,  Kwan-Soo Yun

发明人： Shang-Hoon SEO ,  Jae-Woo Joung ,  Kyoung-Jin Jeong ,  Kwan-Soo Yun

IPC分类号： G03F7/004 ,  G03F7/20

CPC分类号： H05K3/28 ,  G03F7/2018 ,  H05K3/0023 ,  H05K3/0082 ,  H05K3/1241 ,  H05K2201/0108 ,  H05K2203/0551

摘要： A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The method of manufacturing the printed circuit board in accordance with an embodiment of the present invention can include: forming an opaque conductive pattern on one side of a transparent insulation layer; forming a photosensitive insulation layer on the transparent insulation layer such that the conductive pattern is covered; hardening the photosensitive insulation layer excluding an area covering the conductive pattern by irradiating light on the other side of the transparent insulation layer; and forming an opening on the photosensitive insulation layer by removing the area of the photosensitive insulation layer covering the conductive pattern such that the conductive pattern is exposed.

摘要翻译： 公开了印刷电路板和印刷电路板的制造方法。 根据本发明的实施例的制造印刷电路板的方法可以包括：在透明绝缘层的一侧上形成不透明导电图案; 在所述透明绝缘层上形成感光绝缘层，使得所述导电图案被覆盖; 通过在透明绝缘层的另一侧上照射光而使覆盖导电图案的区域除去感光绝缘层; 以及通过去除覆盖导电图案的感光绝缘层的面积使得导电图案露出而在感光绝缘层上形成开口。