摘要:
A compound that increases the photocuring rate of a photocurable composition and reduces the force for releasing a cured product from a mold is provided.A compound is represented by general formula (1): where Rf represents an alkyl group at least part of which is substituted with fluorine, RO represents an oxyalkylene group or a repeated structure of an oxyalkylene group, N represents a nitrogen atom, RA represents an alkyl group, and RB represents an alkyl group or a hydrogen atom.
摘要:
A compound that increases the photocuring rate of a photocurable composition and reduces the force for releasing a cured product from a mold is provided.A compound is represented by general formula (1): where Rf represents an alkyl group at least part of which is substituted with fluorine, RO represents an oxyalkylene group or a repeated structure of an oxyalkylene group, N represents a nitrogen atom, RA represents an alkyl group, and RB represents an alkyl group or a hydrogen atom.
摘要:
The present invention provides an interposer including multiple circuit designs and an uppermost circuit design disposed on the circuit designs. A maximum exposure region is defined as a maximum size which can be defined by a single shot of a lithographic scanner. The sizes of the circuit designs below the uppermost circuit design are smaller than the size of the maximum exposure region. Therefore, the circuit designs are respectively formed by only a single shot of the lithographic scanner. The uppermost circuit design has a length greater than the length of the maximum exposure region, so that the circuit design is formed by stitching two photomasks lithographically.
摘要:
There is herein described a method and apparatus for photoimaging. More particularly, there is described a method and apparatus for photoimaging a substrate (e.g. a web) covered with a wet curable photopolymer wherein a rotatable phototool is pressed and rotated against the substrate to create an imaged substrate which is used to form images suitable for forming electrical circuits such as for printed circuit boards (PCBs), flat panel displays and flexible circuits. There is also described a method and apparatus for directly photoimaging a substrate covered with a wet curable photopolymer, wherein the photoimaged substrate is used to form images such as electrical circuits and a method and apparatus for exposing at least part of a solder mask on a printed circuit board (PCB) using a wet curable photopolymer wherein an imaging process may thereafter occur on the area above the solder mask.
摘要:
Fiducials having substantially continuous portions made on a substrate allow the position of the substrate to be determined. An approach for making fiducials involves moving first and second fiducial devices together back and forth across the substrate along a trajectory having a component along the lateral axis of the substrate while the substrate and the first and second fiducial devices are in relative motion along the longitudinal axis of the substrate. The first fiducial device operates to make one fiducial on the substrate during the movement along the trajectory and the relative motion. The second fiducial device operates to make another fiducial on the substrate during the movement along the trajectory and the relative motion. The fiducials may be formed so that they have a constant spatial frequency with the first fiducial being out of phase with respect to the second fiducial.
摘要:
A wired circuit board includes a metal supporting layer, a first insulating layer, a conductive pattern, and a second insulating layer. The first and second insulating layers include first and second openings which expose both surfaces of the conductive pattern. The conductive pattern has the surface on the other side thereof in a thickness direction which is exposed through the first opening and configured as a first terminal portion, and the surface on one side thereof in the thickness direction which is exposed through the second opening and configured as a second terminal portion. The metal supporting layer includes a third opening which exposes the first terminal portion and a covering portion of the first insulating layer which covers the conductive pattern continued to the first terminal portion, and a reinforcing portion located on a surface on the other side of the covering portion in the thickness direction.
摘要:
A large-area transparent conductive element easy to form a fine pattern includes a substrate having a surface, and transparent conductive portions and transparent insulating portions that are alternately provided on the surface in a planar manner. At least one type of unit section including a random pattern is repeated in at least either the transparent conductive portions or the transparent insulating portions.
摘要:
A method for producing an electrical circuit includes providing a substrate having a first pattern of features and defining a second pattern comprising a net of interconnected circuit elements. Different respective transformation rules are specified for different ones of the circuit elements. The second pattern is modified by applying the respective transformation rules to the circuit elements so as to align the circuit elements with the features in the first pattern, and the modified second pattern is applied to the substrate.
摘要:
The technology disclosed relates to accommodating embedded substrates during direct writing onto a printed circuit board and to other patterning problems that benefit from an extended depth of focus. In particular, it relates to multi-focus direct writing of a workpiece by the continuous or step-wise movement of the workpiece during the sequence of exposures having different focus planes. In one implementation, a multi-arm rotating direct writer is configured for interleaved writing focused on two or more focal planes that generally correspond to two or more surface heights of a radiation sensitive layer that overlays the uneven workpiece. Alternating arms can produce interleaved writing to the two or more focal planes.
摘要:
A system for making flexible circuit films includes an inelastic conveyor, a web handling apparatus configured to pass a flexible substrate around the inelastic conveyor, an image acquisition apparatus configured to measure positions of a first set of alignment marks on the flexible substrate at a first conveyor location, an exposure apparatus configured to patternwise expose a photosensitive material on the flexible substrate at a second conveyor location, and an image processor configured to receive the measured positions of the first set of alignment marks, and to compare the measured positions with reference positions of the first set of alignment marks. The exposure apparatus is configured to patternwise expose the photosensitive material based on the comparison between the measured positions and the reference positions.