Rotor of induction motor and method for manufacturing the same
    1.
    发明授权
    Rotor of induction motor and method for manufacturing the same 有权
    感应电动机转子及其制造方法

    公开(公告)号:US09570968B1

    公开(公告)日:2017-02-14

    申请号:US15271235

    申请日:2016-09-21

    摘要: A rotor of an induction motor includes a core assembly including a plurality of core discs formed with a plurality of slots; a plurality of conductive bars passing through the slots, each of the conductive bars having a first end and a second end respectively extended out of a first end surface and a second end surface of the core assembly; a first end ring assembly including a plurality of first conductive rings stacked on each other and penetrated by the first ends of the conductive bars; and a second end ring assembly including a plurality of second conductive rings stacked on each other and penetrated by the second ends of the conductive bars; wherein the first conductive rings and the second conductive rings are respectively welded to the first ends and the second ends of the conductive bars by electron beam welding or laser welding.

    摘要翻译: 感应电动机的转子包括:芯组件,其包括形成有多个槽的多个芯盘; 穿过所述槽的多个导电棒,每个所述导电棒具有分别延伸出所述芯组件的第一端表面和第二端表面的第一端和第二端; 第一端环组件,其包括彼此堆叠并被导电棒的第一端穿透的多个第一导电环; 以及第二端环组件,其包括彼此堆叠并被导电棒的第二端穿透的多个第二导电环; 其中通过电子束焊接或激光焊接将第一导电环和第二导电环分别焊接到导电棒的第一端和第二端。

    Method of encapsulating induction motor stator

    公开(公告)号:US10483820B2

    公开(公告)日:2019-11-19

    申请号:US15992156

    申请日:2018-05-29

    摘要: An induction motor stator encapsulate method, including arranging a stator of an induction motor in a case of the induction motor, wherein the stator comprises a stator core and a stator winding surrounding the stator core; filling a first encapsulating material into the case for forming a first insulation layer, wherein the first insulation layer directly covers the stator winding; and filling a second encapsulating material into the case for forming a second insulation layer, wherein the second insulation layer covers the first insulation layer; wherein a shrink rate of the first encapsulating material is smaller than a shrink rate of the second encapsulating material.