公开(公告)号：US20040240499A1

公开(公告)日：2004-12-02

申请号：US10845242

申请日：2004-05-14

申请人： Sharp Kabushiki Kaisha

发明人： Makoto Tsuji

IPC分类号： H01S003/04 ,  H01S005/00

CPC分类号： H01S5/02212 ,  H01S5/0222

摘要： A semiconductor laser device aimed to be reduced in size and that can maintain high position accuracy, and a fabrication method of such a semiconductor laser device are achieved. A semiconductor laser device includes a stem as a base member, and a cap member. The stem includes a main unit having a reference plane, and a heat sink platform as an element mount unit, located on the reference plane for mounting a laser element. The cap member is set on the reference plane of the stem so as to cover the heat sink platform. A hole is formed at the sidewall of the cap member facing the heat sink platform. Fixation between the cap member and the stem is established by fixedly attaching the portion at the inner side of the sidewall of the cap member adjacent the hole to the outer circumferential plane of a heat sink platform.

摘要翻译： 旨在减小尺寸并且可以保持高位置精度的半导体激光装置，并且实现了这种半导体激光装置的制造方法。 半导体激光装置包括作为基底构件的杆和帽构件。 杆包括具有参考平面的主单元和作为元件安装单元的散热平台，位于用于安装激光元件的参考平面上。 帽构件设置在杆的参考平面上，以覆盖散热器平台。 在帽构件的面向散热器平台的侧壁处形成有孔。 通过将帽构件的侧壁的内侧的部分邻近孔附接到散热器平台的外周平面来建立盖构件和杆之间的固定。

公开(公告)号：US20040013142A1

公开(公告)日：2004-01-22

申请号：US10618588

申请日：2003-07-15

申请人： SHARP KABUSHIKI KAISHA

发明人： Makoto Tsuji

IPC分类号： H01S003/04 ,  H01S005/00

CPC分类号： H01S5/02212 ,  H01L2224/48091 ,  H01S5/024 ,  H01S5/02469 ,  H01L2924/00014

摘要： There is provided a semiconductor laser device which allows a stem body and a heat radiation block to be integrally fabricated even in small-size packages and which is low in price. Portions of leads 3A, 3B protruding on a reference surface side are placed on one side surface side of the heat radiation block 2 on which the semiconductor laser chip is mounted. Further, a cover 6 made of resin which is opened on the beam-output side of the semiconductor laser chip 4 is fixed to the heat radiation block 2 so as to surround the semiconductor laser chip 4 and the portions of the leads 3A, 3B protruding on the reference-surface side in conjunction with the heat radiation block 2.

摘要翻译： 提供了一种半导体激光器件，其允许即使在小尺寸封装中也能够将茎体和散热块整体地制造并且价格低廉。 在参考表面侧突出的引线3A，3B的一部分放置在其上安装有半导体激光器芯片的散热块2的一个侧表面侧上。 此外，在半导体激光芯片4的光束输出侧开口的由树脂制成的盖6固定在散热块2上，以包围半导体激光芯片4，并且引线3A，3B的部分突出 与散热块2结合在基准表面侧。