摘要:
External cavity optical transmitters are disclosed which include a gain chip and a mirror that define an optical cavity. The transmitters further include a modulator operated at or near the same temperature as the gain chip. In some examples, the optical transmitters are temperature controlled to optimize the efficiency and wavelength stability thereof, while maintaining acceptable chirp performance of the modulator. In some examples, the optical transmitters include an electro-optic module disposed within the optical cavity to change the path length thereof so that the efficiency and wavelength stability of the transmitter is optimized.
摘要:
A VCSEL structure having thermal management. The structure may be designed for conveyance of heat from the active layer primarily through one of the mirrors to a material that removes heat externally away from the structure. Thermal management may involve various configurations of heat removal for various VCSEL structures. The structures may be designed to effect such respective configurations for heat removal.
摘要:
A cooling system for an imaging device having a light source for exposing a media in which the cooling system comprises a filter for purifying coolant flowing through the cooling system and a filter bypass for limiting the purity of the coolant. In this way, the coolant, such as water, is prevented from becoming too pure, such that it begins to attack or etch the metal components in the coolant loop in the cooling system. This problem typically arises in the closed loop DI-filtered systems is that the water coolant becomes too pure. It is known that if water becomes more pure than approximately 10 MegaOhms (Mnull), referring to the water's resistance to electrical current which increases with increasing purity, the water can actually begin to etch metal such as copper in copper pipes of the loop.
摘要:
Provided is a laser diode driving circuit which prevents low optical output power of a laser diode at high ambient temperature, and prevents damage to the laser diode at low ambient temperature by adjusting the limit of a laser diode driving current, which is input to a laser diode, based on an optical output power characteristic that decreases optical output power as the ambient temperature decreases. Such a laser diode driving circuit includes a laser diode driving unit, which outputs a laser diode driving current and a laser diode protection unit, which sets the limit of the laser diode driving current output from the laser diode driving unit and increases the limit of the laser diode driving current as the ambient temperature of the laser diode increases.
摘要:
A planar wafer-level packaging method is provided for a laser and a microlens. Light from the laser is directed and shaped by the microlens to couple into an external light guide. A plurality of such assemblies, each comprising a laser and a microlens may be assembled on a single planar substrate. A tapered surface is formed on the microlens. The microlens may be formed from a silicon substrate. The angle of the tapered surface causes an accurate cone or pyramid shape. The tapered surface is formed such that the axis of the cone or pyramid is aligned with the optical axis of the lens. The lens may then be aligned with the optical axis of the laser. A light guide receptacle is formed with a tapered surface that matches the tapered surface of the microlens. The tapered surface of the receptacle is formed such that the axis of the cone or pyramid is aligned with the optical axis of the receptacle. The receptacle may then be passively aligned with the microlens by mating the tapered surfaces.
摘要:
An optical element module package with a TO-can structure is disclosed. The module includes a laser diode for projecting optical signals and a photo diode for monitoring the optical signals projected from the laser diode. The package includes a stem having a first through-hole formed in a long-hole shape parallel to the diametrical direction of the stem, the first through-hole extending through the stem from one side to the other; and a plurality of leads arranged in a row through the first through-hole. The first through-hole is filled with a sealant of a glass material so that the stem and the leads are fixed.
摘要:
A laser apparatus includes pumping means to emit pumping radiation, a gain medium to absorb the radiation and emit a laser light, and cooling means to cool the gain medium. The cooling means includes a coolant comprising of D2O.
摘要:
A semiconductor laser device aimed to be reduced in size and that can maintain high position accuracy, and a fabrication method of such a semiconductor laser device are achieved. A semiconductor laser device includes a stem as a base member, and a cap member. The stem includes a main unit having a reference plane, and a heat sink platform as an element mount unit, located on the reference plane for mounting a laser element. The cap member is set on the reference plane of the stem so as to cover the heat sink platform. A hole is formed at the sidewall of the cap member facing the heat sink platform. Fixation between the cap member and the stem is established by fixedly attaching the portion at the inner side of the sidewall of the cap member adjacent the hole to the outer circumferential plane of a heat sink platform.
摘要:
A video display unit according to the present invention uses a plurality of semiconductor lasers as one light source. The unit lowers all laser outputs when lowering the brightness of the semiconductor lasers and realizes a long life, and stops one of the semiconductor lasers when realizing a low power consumption mode. Thus, a long life is realized when lowering all laser outputs, and a low power consumption is realized when stopping some semiconductor lasers.
摘要:
The laser diode of the present invention is mounted on the heat sink made of insulating material such as aluminum nitride (AlN). On the heat sink, a metal film, evaporated gold film, is provided and the laser diode is mounted on the heat sink such that the anode electrode of the laser diode faces and is in contact with the metal film. The heat sink is mounted on the grounded metal member, thus the metal member, the heat sink and the metal film forms an capacitor. The bias for the laser diode is provided via the metal film, thereby stabilizing the bias supply even when the operational frequency for the laser diode is over 10 Gbps.