Touch panel and fabrication method thereof
    1.
    发明授权
    Touch panel and fabrication method thereof 有权
    触控面板及其制作方法

    公开(公告)号:US08986485B2

    公开(公告)日:2015-03-24

    申请号:US13084542

    申请日:2011-04-11

    IPC分类号: G06F3/044 G06F3/045

    摘要: A fabrication method of a touch panel is provided. In the fabrication method, the two substrates are provided, and a plurality of touch units are formed on each of the substrates. A sealant and a plurality of first spacers are provided between the substrates, and the substrates are bonded through the sealant, so that the touch units are sealed between the substrates. The touch units and the first spacers are surrounded by the sealant. The substrates are thinned. The thinned substrates are cut into a plurality of sub-mounts separated from one another. Each of the sub-mounts has one of the touch units thereon.

    摘要翻译: 提供了触摸面板的制造方法。 在制造方法中,设置两个基板,并且在每个基板上形成多个触摸单元。 在基板之间设置密封剂和多个第一间隔件,并且通过密封剂粘合基板,使得触摸单元被密封在基板之间。 触摸单元和第一间隔件被密封剂包围。 基板变薄。 将薄化的基板切割成彼此分离的多个副安装座。 每个子安装座具有其中一个触摸单元。

    TOUCH PANEL AND FABRICATION METHOD THEREOF
    2.
    发明申请
    TOUCH PANEL AND FABRICATION METHOD THEREOF 有权
    触控面板及其制造方法

    公开(公告)号:US20120169625A1

    公开(公告)日:2012-07-05

    申请号:US13084542

    申请日:2011-04-11

    IPC分类号: G06F3/041 H05K3/36

    摘要: A fabrication method of a touch panel is provided. In the fabrication method, the two substrates are provided, and a plurality of touch units are formed on each of the substrates. A sealant and a plurality of first spacers are provided between the substrates, and the substrates are bonded through the sealant, so that the touch units are sealed between the substrates. The touch units and the first spacers are surrounded by the sealant. The substrates are thinned. The thinned substrates are cut into a plurality of sub-mounts separated from one another. Each of the sub-mounts has one of the touch units thereon.

    摘要翻译: 提供了触摸面板的制造方法。 在制造方法中,设置两个基板,并且在每个基板上形成多个触摸单元。 在基板之间设置密封剂和多个第一间隔件,并且通过密封剂粘合基板,使得触摸单元被密封在基板之间。 触摸单元和第一间隔件被密封剂包围。 基板变薄。 将薄化的基板切割成彼此分离的多个副安装座。 每个子安装座具有其中一个触摸单元。