Heat dissipating assembly
    2.
    发明授权
    Heat dissipating assembly 有权
    散热组件

    公开(公告)号:US06865082B2

    公开(公告)日:2005-03-08

    申请号:US10339018

    申请日:2003-01-08

    IPC分类号: H01L23/367 H01L23/40 H05K7/20

    摘要: In a heat dissipating assembly, a base frame is disposed underneath a circuit board and includes a bottom part with opposite first and second sides that are formed with first and second engaging units, respectively. The first and second engaging units extend upwardly through a set of through holes in the circuit board. A heat-dissipating module is mounted on the circuit board and includes a heat transfer plate to establish heat-conductive contact with an electronic component on the circuit board. An anchoring device includes a first anchoring unit that engages the first engaging unit, a second anchoring unit that engages the second engaging unit, and an abutting unit connected to the first and second anchoring units. The anchoring device biases the heat transfer plate toward the electronic component when the first and second anchoring units engage the first and second engaging units.

    摘要翻译: 在散热组件中,基座框架设置在电路板的下方,并且包括底部,该底部分别具有分别由第一和第二接合单元形成的相对的第一和第二侧。 第一和第二接合单元向上延伸穿过电路板中的一组通孔。 散热模块安装在电路板上,并且包括传热板,以与电路板上的电子部件建立导热接触。 锚定装置包括接合第一接合单元的第一锚定单元,接合第二接合单元的第二锚定单元和连接到第一和第二锚定单元的邻接单元。 当第一和第二锚固单元接合第一和第二接合单元时,锚定装置将传热板朝向电子部件偏压。