Method for Manufacturing Laminated Coil Devices
    1.
    发明申请
    Method for Manufacturing Laminated Coil Devices 有权
    制造层压线圈装置的方法

    公开(公告)号:US20150020378A1

    公开(公告)日:2015-01-22

    申请号:US13978542

    申请日:2012-03-23

    CPC classification number: H01F41/04 H01F17/0013 H01F41/042 Y10T29/4902

    Abstract: A method of manufacturing a laminated coil device includes conductors for forming coils and insulation stacking for forming laminated bodies, and further includes the steps of: (A) manufacturing ceramic insulating thin sheets; (B) forming ceramic insulating thin sheets with conductive through-holes; (C) manufacturing coil thin sheets with coil conductors so as to embed the coil conductors inside the ceramic insulating thin sheets; (D) orderly stacking and cutting ceramic insulating thin sheets and coil thin sheets with coil conductors into unit sizes in order to obtain laminated bodies; (E) heating the laminated bodies in order to remove the binder, and then sintering the laminated bodies; (F) coating the conductive paste on the two ends of the laminated bodies so as to fen external electrodes. Thus, the present invention is to provide a manufacturing method of producing a laminated coil power device with low direct current resistance, no delamination, no air space, and no lamination cracking.

    Abstract translation: 层叠线圈装置的制造方法包括用于形成层叠体的线圈用导体和绝缘层叠体,还包括以下工序:(A)制造陶瓷绝缘薄片; (B)形成具有导电通孔的陶瓷绝缘薄片; (C)制造具有线圈导体的线圈薄片,以将线圈导体嵌入陶瓷绝缘薄片内; (D)将具有线圈导体的陶瓷绝缘薄片和线圈薄片顺序堆叠切割成单位尺寸,以获得层压体; (E)加热层叠体以除去粘合剂,然后烧结层压体; (F)在层叠体的两端涂覆导电膏,以使外部电极变钝。 因此,本发明提供一种制造低直流电阻,无分层,没有空气空间,没有层压破裂的层叠线圈功率器件的制造方法。

Patent Agency Ranking