公开(公告)号：US12148564B2

公开(公告)日：2024-11-19

申请号：US17322920

申请日：2021-05-18

Applicant: Shenzhen Sunlord Electronics Co., Ltd.

Inventor： Xinshu Yu ,  Youyun Li ,  Shengcheng Xia ,  Zehong Yao ,  Yupeng Hong ,  Yingying Wang ,  Qiang Su ,  Wanhe Yi ,  Xin Che

IPC: H01F7/06 ,  H01F1/24 ,  H01F17/04 ,  H01F27/255 ,  H01F27/29 ,  H01F41/02

Abstract: A manufacturing method of an integrally formed inductor, comprises: sintering a soft magnetic material to prepare a magnetic core plate with a plurality of grooves; respectively putting hollow coils into the plurality of grooves; putting a magnetic core plate provided with coils into a forming die, adding a soft magnetic material in a fluid state, and integrally forming the soft magnetic material in the fluid state on the magnetic core plate through pressing; coating semi-finished inductors with an insulating material to form an insulating coating layer, and exposing only two terminals of the coils; areas where the coil terminals are exposed on a surface of the insulating coating layer being metallized to form electrodes of the integrally formed inductor. Therefore, the disclosure provides a manufacturing method of an integrally formed inductor which is subminiature in size, ultra-thin and high in reliability.

公开(公告)号：US10679780B2

公开(公告)日：2020-06-09

申请号：US15865200

申请日：2018-01-08

Applicant: Shenzhen Sunlord Electronics Co., Ltd.

Inventor： Min Tan ,  Min Nie ,  Youyun Li

IPC: H01F1/22 ,  C22C33/02 ,  H01F41/02 ,  B22F1/00 ,  H01F1/36 ,  C22C38/02 ,  C22C38/18 ,  C22C38/00

Abstract: A composite soft magnetic material includes the following components: 67.9 to 95.54 wt % of FeSiCr, 0.1 to 0.3 wt % of TiO2, 0.15 to 0.75 wt % of SiO2, 0.1 to 0.5 wt % of Mn3O4, 0.1 to 0.5 wt % of ZnO, 3.4 to 25.9 wt % of BaO, 0.4 to 3 wt % of B2O3, 0.2 to 0.85 wt % of CaO, and 0.01 to 0.3 wt % of CuO. The composite soft magnetic material has high initial permeability and high Bs, excellent temperature stability, and low temperature coefficient.

公开(公告)号：US12224106B2

公开(公告)日：2025-02-11

申请号：US17211789

申请日：2021-03-24

Applicant: Shenzhen Sunlord Electronics Co., Ltd.

Inventor： Yingying Wang ,  Xinshu Yu ,  Shengcheng Xia ,  Youyun Li

IPC: H01F27/28 ,  H01F27/02 ,  H01F27/29 ,  H01F41/02 ,  H01F41/10

Abstract: An inductive component comprises a hollow coil wound by Litz wire, a magnetic plastic packaging layer covering the coil, and a first electrode and a second electrode of the coil. The first electrode and the second electrode are exposed outside the magnetic plastic packaging layer. A manufacturing method for the inductive component comprises: winding a hollow coil by using Litz wire; connecting two leading-out terminals of the coil to portions of a leadframe to be formed into two electrodes; manufacturing a formed magnetic plastic packaging layer on the periphery of the coil; curing the magnetic plastic packaging layer through heat treatment; and carrying out leadframe cutting on the cured semi-finished product to form the two electrodes exposed outside the magnetic plastic packaging layer, and bending the two electrodes to flatly extend to the surface of the magnetic plastic packaging layer.

公开(公告)号：US12100543B2

公开(公告)日：2024-09-24

申请号：US17238224

申请日：2021-04-23

Applicant: Shenzhen Sunlord Electronics Co., Ltd.

Inventor： Yingying Wang ,  Xinshu Yu ,  Shengcheng Xia ,  Youyun Li ,  Xin Che

IPC: H01F27/28 ,  H01F27/24 ,  H01F27/29 ,  H01F27/33 ,  H01F27/34 ,  H01F41/02 ,  H01F41/04

CPC classification number: H01F27/346 ,  H01F27/24 ,  H01F27/29 ,  H01F27/33 ,  H01F41/0246 ,  H01F41/04

Abstract: A molded-forming power inductor comprises a conductor, a magnetic core and a magnetic molding package layer, wherein the conductor comprises an integrally formed insulation-processed base part, an insulation-processed side enclosing part and an electrode part, the base part and the side enclosing part are assembled with the magnetic core in a gapless fit mode, and the magnetic molding package layer is gaplessly wrapped outside the conductor and the magnetic core. A method is provided for manufacturing the molded-forming power inductor. The molding package layer completely covers the prefabricated magnetic core and a part of the conductor except the electrode, the structure is integrally formed, and the leakage magnetic flux is less; when the equivalent magnetic permeability is 60 or more, the equivalent saturation magnetic flux density can be 0.55 T or higher; and the space utilization rate is high to facilitate miniaturization of an inductor design.

公开(公告)号：US11854735B2

公开(公告)日：2023-12-26

申请号：US17200887

申请日：2021-03-14

Applicant: Shenzhen Sunlord Electronics Co., Ltd.

Inventor： Qiang Su ,  Youyun Li ,  Shengcheng Xia ,  Xinshu Yu

IPC: H01F27/29 ,  H01F27/30 ,  H01F41/061 ,  H01F27/24 ,  H01F27/28

CPC classification number: H01F27/306 ,  H01F27/24 ,  H01F27/2823 ,  H01F27/29 ,  H01F41/061

Abstract: A winding structure includes a coil having a wire wrap and two wire tails, and a magnetic core having a center column, a flange, four wire-hanging parts and two bosses; the center column is connected at a top surface of the flange, the first boss is disposed in the middle of a first side of the flange, and the second boss is symmetrical to the first boss; transition surfaces of wire-hanging parts to a bottom surface of the flange are chamfered surfaces; first to fourth sections of the first wire tail are sequentially attached to the first wire-hanging part and the first chamfered surface, the bottom surface of the flange, the third chamfered surface, the third wire-hanging part, and the top surface of the flange; first to fourth sections of the second wire tail are symmetrical to first to fourth sections of the first wire tail, respectively.

公开(公告)号：US10811188B2

公开(公告)日：2020-10-20

申请号：US15865291

申请日：2018-01-09

Applicant: Shenzhen Sunlord Electronics Co., Ltd.

Inventor： Shengcheng Xia ,  Youyun Li

IPC: H01F41/076 ,  H01B13/06 ,  H01F41/064 ,  H01F41/02 ,  C03C14/00 ,  H01F41/12 ,  H01B3/08 ,  H01F27/255 ,  B05D3/02 ,  B05D3/12 ,  C03C8/16 ,  H01B7/02 ,  H01F27/28 ,  H01F27/29 ,  H01F41/06

Abstract: A preparation method for a metal matrix composite wire includes the following steps: 1) preparing a metal inner core; 2) preparing a glass-resin mixture; 3) dissolving self-adhesive resin in a solvent to prepare a self-adhesive resin solution; 4) uniformly coating the glass-resin mixture on a surface of the metal inner core, then coating the self-adhesive resin solution on a surface of the glass-resin mixture, and performing drying at a temperature of 80° C. to 150° C.; and 5) repeating the step 4) until a thickness of the glass-resin mixture plus the self-adhesive resin reaches 2 to 10 μm. When an inductor is prepared by using the composite wire, the inductor may have relatively good weather resistance, a relatively good dielectric voltage-withstand capability, as well as relatively good high-temperature resistance and electrical performance.

公开(公告)号：US12040120B2

公开(公告)日：2024-07-16

申请号：US17211811

申请日：2021-03-24

Applicant: Shenzhen Sunlord Electronics Co., Ltd.

Inventor： Qiang Su ,  Xinshu Yu ,  Shengcheng Xia ,  Youyun Li

IPC: H01F7/06 ,  H01F27/24 ,  H01F27/28 ,  H01F41/02 ,  H01F41/04

CPC classification number: H01F27/2823 ,  H01F27/24 ,  H01F41/0206 ,  H01F41/04

Abstract: A preparation method for an inductance component, comprising: prefabricating a continuous coil row containing a plurality of hollow coils with the connections of every two adjacent hollow coils being bent feet; placing the continuous coil row into a cavity of a prefabricated mold, the cavity comprising a plurality of sub-chambers and one sub-chamber being used for placing a hollow coil; injecting the prepared soft-magnetic magnetic glue into the cavity to enable the soft-magnetic magnetic glue to coat the hollow coil, and simultaneously exposing the bent feet to the outside to perform magnet forming; cutting the formed semi-finished product; and peeling the exposed bent foot copper wire, and performing metallization to form an electrode to obtain a finished product of the inductance component. The invention has high inductance preparation efficiency, and the obtained product electrode has no risks of a dry joint, poor contact, and the like.

公开(公告)号：US11309117B2

公开(公告)日：2022-04-19

申请号：US15973516

申请日：2018-05-07

Applicant: Shenzhen Sunlord Electronics Co., Ltd.

Inventor： Shengcheng Xia ,  Youyun Li ,  Xinshu Yu ,  Gengxin Xiao

IPC: H01F27/24 ,  H01F27/02 ,  H01F27/28 ,  H01F41/02 ,  H01F1/147 ,  H01F41/061 ,  H01F27/29

Abstract: An inductive element includes a magnetic core, a flat coil wound on a middle column of the magnetic core, and a magnetic plastic package layer covering the magnetic core and the flat coil. Two electrodes connected to two pigtails of the flat coil are exposed outside of the magnetic plastic package layer. The flat coil is configured to enable a width direction of a flat wire of the flat coil to be perpendicular to an axial direction of the middle column of the magnetic core, and the flat wire is stacked layer by layer in the axial direction of the middle column. A manufacturing method for the inductive element is also disclosed herein. By using the wounding method of the flat coil of the inductive element, a height of a product may be reduced while obtaining a same DCR, so that the product is thinner.

公开(公告)号：US20180130588A1

公开(公告)日：2018-05-10

申请号：US15861698

申请日：2018-01-04

Applicant: Shenzhen Sunlord Electronics Co., Ltd.

Inventor： Youyun Li ,  Dafu Lu

IPC: H01F17/06 ,  H01F27/32 ,  H01F41/12

CPC classification number: H01F17/062 ,  H01F17/04 ,  H01F27/324 ,  H01F41/125 ,  H01F2017/048

Abstract: An inductor and a method for manufacturing the same are disclosed. The inductor includes a magnetic body and a conductor coil, where the conductor coil is inside the magnetic body; and further includes an inorganic insulation layer, where the inorganic insulation layer is wrapped on a surface of the conductor coil, and the inorganic insulation layer is inside the magnetic body. According to the present application, an inductor having a higher inductance or an inductor having a lower direct current resistance may be manufactured.

公开(公告)号：US20150020378A1

公开(公告)日：2015-01-22

申请号：US13978542

申请日：2012-03-23

Applicant: Shenzhen Sunlord Electronics Co., Ltd.

Inventor： Youyun Li ,  Dafu Lu ,  Yang Zhang ,  Cong Yuan

IPC: H01F41/04

CPC classification number: H01F41/04 ,  H01F17/0013 ,  H01F41/042 ,  Y10T29/4902

Abstract: A method of manufacturing a laminated coil device includes conductors for forming coils and insulation stacking for forming laminated bodies, and further includes the steps of: (A) manufacturing ceramic insulating thin sheets; (B) forming ceramic insulating thin sheets with conductive through-holes; (C) manufacturing coil thin sheets with coil conductors so as to embed the coil conductors inside the ceramic insulating thin sheets; (D) orderly stacking and cutting ceramic insulating thin sheets and coil thin sheets with coil conductors into unit sizes in order to obtain laminated bodies; (E) heating the laminated bodies in order to remove the binder, and then sintering the laminated bodies; (F) coating the conductive paste on the two ends of the laminated bodies so as to fen external electrodes. Thus, the present invention is to provide a manufacturing method of producing a laminated coil power device with low direct current resistance, no delamination, no air space, and no lamination cracking.

Abstract translation: 层叠线圈装置的制造方法包括用于形成层叠体的线圈用导体和绝缘层叠体，还包括以下工序：（A）制造陶瓷绝缘薄片; （B）形成具有导电通孔的陶瓷绝缘薄片; （C）制造具有线圈导体的线圈薄片，以将线圈导体嵌入陶瓷绝缘薄片内; （D）将具有线圈导体的陶瓷绝缘薄片和线圈薄片顺序堆叠切割成单位尺寸，以获得层压体; （E）加热层叠体以除去粘合剂，然后烧结层压体; （F）在层叠体的两端涂覆导电膏，以使外部电极变钝。 因此，本发明提供一种制造低直流电阻，无分层，没有空气空间，没有层压破裂的层叠线圈功率器件的制造方法。