公开(公告)号：US06336842B1

公开(公告)日：2002-01-08

申请号：US09574285

申请日：2000-05-19

申请人： Shigeo Ootsuki ,  Shigeo Moriyama ,  Takashi Kugaya ,  Kenichi Togawa ,  Makoto Kajiwara ,  Shyuichi Oowada ,  Yukio Suzuki ,  Yoko Sugawa

发明人： Shigeo Ootsuki ,  Shigeo Moriyama ,  Takashi Kugaya ,  Kenichi Togawa ,  Makoto Kajiwara ,  Shyuichi Oowada ,  Yukio Suzuki ,  Yoko Sugawa

IPC分类号： B24B4900

CPC分类号： B24B53/017 ,  B24B49/16

摘要： An object of the present invention is to provide a polishing apparatus which is capable of configuring a surface of a polishing tool without damaging the polishing tool. In order to solve the above-mentioned problem, the present invention provide a rotary machining apparatus comprising a polishing tool for polishing a sample; a rotary disk for holding the polishing tool; a tool for configuring a surface of the polishing tool; and a position adjusting mechanism for adjusting a gap between the tool and the polishing tool, which comprises a rotating mechanism for rotating the tool; and a sensor for sensing a change in the rotation of the rotating mechanism, a height at starting to configure the polishing tool using the tool being determined based on the change in the rotation obtained by the sensor.

摘要翻译： 本发明的目的是提供一种能够构造抛光工具的表面而不损坏抛光工具的抛光装置。为了解决上述问题，本发明提供了一种旋转加工装置，其包括抛光 用于抛光样品的工具; 用于保持抛光工具的旋转盘; 用于配置抛光工具的表面的工具; 以及位置调节机构，用于调整所述工具和所述研磨工具之间的间隙，所述间隙包括用于旋转所述工具的旋转机构; 以及用于感测旋转机构的旋转变化的传感器，基于由传感器获得的旋转变化确定的，使用该工具来开始构造抛光工具的高度。