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公开(公告)号：US06336842B1
公开(公告)日：2002-01-08
申请号：US09574285
申请日：2000-05-19
申请人： Shigeo Ootsuki , Shigeo Moriyama , Takashi Kugaya , Kenichi Togawa , Makoto Kajiwara , Shyuichi Oowada , Yukio Suzuki , Yoko Sugawa
发明人： Shigeo Ootsuki , Shigeo Moriyama , Takashi Kugaya , Kenichi Togawa , Makoto Kajiwara , Shyuichi Oowada , Yukio Suzuki , Yoko Sugawa
IPC分类号： B24B4900
CPC分类号： B24B53/017 , B24B49/16
摘要： An object of the present invention is to provide a polishing apparatus which is capable of configuring a surface of a polishing tool without damaging the polishing tool. In order to solve the above-mentioned problem, the present invention provide a rotary machining apparatus comprising a polishing tool for polishing a sample; a rotary disk for holding the polishing tool; a tool for configuring a surface of the polishing tool; and a position adjusting mechanism for adjusting a gap between the tool and the polishing tool, which comprises a rotating mechanism for rotating the tool; and a sensor for sensing a change in the rotation of the rotating mechanism, a height at starting to configure the polishing tool using the tool being determined based on the change in the rotation obtained by the sensor.
摘要翻译： 本发明的目的是提供一种能够构造抛光工具的表面而不损坏抛光工具的抛光装置。为了解决上述问题，本发明提供了一种旋转加工装置，其包括抛光 用于抛光样品的工具; 用于保持抛光工具的旋转盘; 用于配置抛光工具的表面的工具; 以及位置调节机构，用于调整所述工具和所述研磨工具之间的间隙，所述间隙包括用于旋转所述工具的旋转机构; 以及用于感测旋转机构的旋转变化的传感器，基于由传感器获得的旋转变化确定的，使用该工具来开始构造抛光工具的高度。
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公开(公告)号：US07137866B2
公开(公告)日：2006-11-21
申请号：US11267306
申请日：2005-11-07
申请人： Shigeo Moriyama , Yoshihiro Ishida , Takashi Kugaya , Shigeo Ootsuki , Soichi Katagiri , Sadayuki Nishimura , Ryosei Kawai , Kan Yasui
发明人： Shigeo Moriyama , Yoshihiro Ishida , Takashi Kugaya , Shigeo Ootsuki , Soichi Katagiri , Sadayuki Nishimura , Ryosei Kawai , Kan Yasui
IPC分类号： B24B49/00
CPC分类号： B24B53/017 , B24B37/042 , B24B41/04 , B24B53/02 , B24B53/12
摘要： The present invention relates to a polishing apparatus, and a semiconductor manufacturing method using the apparatus. Dressing of a grindstone surface is ground by sizing processing whereby dressing of a tool surface can be done while preventing occurrence of cracks on the grindstone surface which is the cause for occurrence of scratches. Further, flatness of the surface of a dressing tool can be guaranteed because of sizing cutting-in; even if a thick grindstone of a few centimeters is used, the flatness can be maintained to the end; and processing with less in-face unevenness can be always carried out. Therefore, the life of the dressing tool can be greatly extended.Further, the present sizing-dressing is carried out jointly with processing of a wafer to thereby enable improvement of throughput of the apparatus as well as maintenance of a processing rate.The present apparatus and method are effective for planarization of various substrate surfaces having irregularities.
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3.发明申请公开(公告)号：US20050095960A1
公开(公告)日：2005-05-05
申请号：US11004991
申请日：2004-12-07
申请人： Shigeo Moriyama , Yoshihiro Ishida , Takashi Kugaya , Shigeo Ootsuki , Soichi Katagiri , Sadayuki Nishimura , Ryosei Kawai , Kan Yasui
发明人： Shigeo Moriyama , Yoshihiro Ishida , Takashi Kugaya , Shigeo Ootsuki , Soichi Katagiri , Sadayuki Nishimura , Ryosei Kawai , Kan Yasui
CPC分类号： B24B53/017 , B24B37/042 , B24B41/04 , B24B53/12
摘要： The present invention relates to a polishing apparatus, and a semiconductor manufacturing method using the apparatus. Dressing of a grindstone surface is ground by sizing processing whereby dressing of a tool surface can be done while preventing occurrence of cracks on the grindstone surface which is the cause for occurrence of scratches. Further, flatness of the surface of a dressing tool can be guaranteed because of sizing cutting-in; even if a thick grindstone of a few centimeters is used, the flatness can be maintained to the end; and processing with less in-face unevenness can be always carried out. Therefore, the life of the dressing tool can be greatly extended. Further, the present sizing-dressing is carried out jointly with processing of a wafer to thereby enable improvement of throughput of the apparatus as well as maintenance of a processing rate. The present apparatus and method are effective for planarization of various substrate surfaces having irregularities.
摘要翻译： 本发明涉及一种抛光装置以及使用该装置的半导体制造方法。 磨石表面的磨合通过施胶处理进行研磨，由此可以进行工具表面的修整，同时防止在磨石表面产生裂纹，这是产生划痕的原因。 此外，可以保证修整工具的表面的平整度，因为切割的尺寸大小; 即使使用了几厘米厚的砂轮，也可以保持平坦度， 并且可以总是执行具有较少的面内不均匀性的处理。 因此，修整工具的寿命可以大大延长。 此外，与晶片的处理联合进行本施胶修整，从而能够提高装置的生产量以及维持处理速度。 本装置和方法对于具有不规则性的各种衬底表面的平坦化是有效的。
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4.发明授权公开(公告)号：US07166013B2
公开(公告)日：2007-01-23
申请号：US11004991
申请日：2004-12-07
申请人： Shigeo Moriyama , Yoshihiro Ishida , Takashi Kugaya , Shigeo Ootsuki , Soichi Katagiri , Sadayuki Nishimura , Ryosei Kawai , Kan Yasui
发明人： Shigeo Moriyama , Yoshihiro Ishida , Takashi Kugaya , Shigeo Ootsuki , Soichi Katagiri , Sadayuki Nishimura , Ryosei Kawai , Kan Yasui
CPC分类号： B24B53/017 , B24B37/042 , B24B41/04 , B24B53/12
摘要： The present invention relates to a polishing apparatus, and a semiconductor manufacturing method using the apparatus. Dressing of a grindstone surface is ground by sizing processing whereby dressing of a tool surface can be done while preventing occurrence of cracks on the grindstone surface which is the cause for occurrence of scratches. Further, flatness of the surface of a dressing tool can be guaranteed because of sizing cutting-in; even if a thick grindstone of a few centimeters is used, the flatness can be maintained to the end; and processing with less in-face unevenness can be always carried out. Therefore, the life of the dressing tool can be greatly extended.Further, the present sizing-dressing is carried out jointly with processing of a wafer to thereby enable improvement of throughput of the apparatus as well as maintenance of a processing rate.The present apparatus and method are effective for planarization of various substrate surfaces having irregularities.
摘要翻译： 本发明涉及一种抛光装置以及使用该装置的半导体制造方法。 磨石表面的磨合通过施胶处理进行研磨，由此可以进行工具表面的修整，同时防止在磨石表面产生裂纹，这是产生划痕的原因。 此外，可以保证修整工具的表面的平整度，因为切割的尺寸大小; 即使使用了几厘米厚的砂轮，也可以保持平坦度， 并且可以总是执行具有较少的面内不均匀性的处理。 因此，修整工具的寿命可以大大延长。 此外，与晶片的处理联合进行本施胶修整，从而能够提高装置的生产量以及维持处理速度。 本装置和方法对于具有不规则性的各种衬底表面的平坦化是有效的。
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公开(公告)号：US20060057940A1
公开(公告)日：2006-03-16
申请号：US11267306
申请日：2005-11-07
申请人： Shigeo Moriyama , Yoshihiro Ishida , Takashi Kugaya , Shigeo Ootsuki , Soichi Katagiri , Sadayuki Nishimura , Ryosei Kawai , Kan Yasui
发明人： Shigeo Moriyama , Yoshihiro Ishida , Takashi Kugaya , Shigeo Ootsuki , Soichi Katagiri , Sadayuki Nishimura , Ryosei Kawai , Kan Yasui
CPC分类号： B24B53/017 , B24B37/042 , B24B41/04 , B24B53/02 , B24B53/12
摘要： The present invention relates to a polishing apparatus, and a semiconductor manufacturing method using the apparatus. Dressing of a grindstone surface is ground by sizing processing whereby dressing of a tool surface can be done while preventing occurrence of cracks on the grindstone surface which is the cause for occurrence of scratches. Further, flatness of the surface of a dressing tool can be guaranteed because of sizing cutting-in; even if a thick grindstone of a few centimeters is used, the flatness can be maintained to the end; and processing with less in-face unevenness can be always carried out. Therefore, the life of the dressing tool can be greatly extended. Further, the present sizing-dressing is carried out jointly with processing of a wafer to thereby enable improvement of throughput of the apparatus as well as maintenance of a processing rate. The present apparatus and method are effective for planarization of various substrate surfaces having irregularities.
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6.发明授权Method for fabricating semiconductor device and processing apparatus for processing semiconductor device 失效半导体装置的制造方法以及半导体装置的处理装置公开(公告)号：US06612912B2
公开(公告)日：2003-09-02
申请号：US09371003
申请日：1999-08-10
申请人： Kan Yasui , Souichi Katagiri , Shigeo Moriyama , Yoshio Kawamura , Ryousei Kawai , Sadayuki Nishimura , Masahiko Sato
发明人： Kan Yasui , Souichi Katagiri , Shigeo Moriyama , Yoshio Kawamura , Ryousei Kawai , Sadayuki Nishimura , Masahiko Sato
IPC分类号： B24B100
CPC分类号： B24B53/017 , B24B1/04 , B24B37/042 , B24B53/12
摘要： A method for fabricating a semiconductor device includes grindstone surface activation treatment by means of a brush or ultrasonic wave carried out when a concave/convex pattern of a semiconductor wafer is planarized by polishing a semiconductor wafer held by a wafer holder by using a grindstone constituted of abrasive grains and material for holding the abrasive grains onto which the semiconductor wafer is pressed with relative motion. The semiconductor wafer is processed with high removal rate and the polishing thickness is controlled accurately.
摘要翻译： 一种制造半导体器件的方法包括：当半导体晶片的凹凸图案通过使用由晶片保持器保持的半导体晶片进行平面化而进行的刷子或超声波的磨石表面激活处理， 磨料颗粒和用于保持磨料颗粒的材料，半导体晶片被相对运动地压在其上。 半导体晶片以高去除率进行处理，并且精确地控制抛光厚度。
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公开(公告)号：US5025268A
公开(公告)日：1991-06-18
申请号：US377325
申请日：1989-07-10
CPC分类号： G02B26/125 , B41J2/471 , G02B13/0005 , G02B27/0031 , G02B3/02
摘要： An optical scanning apparatus has a scanning lens with a rotationally asymmetric aspheric surface having individual curvature radii in the main scanning direction and in the sub-scanning direction. The curvature radius in the sub-scanning direction is asymmetrically increased in the lateral direction with the distance from the optical axis. A field curvature aberration which may be generated in the sub-scanning direction on the scanning surface due to an oblique incident of optical beams on the rotating polygonal mirror or the movement of the reflective surface caused by rotation of the rotating polygonal mirror is compensated for by the scanning lens and the focusing properties of the system can be kept at a level of high resolving power.
摘要翻译： 光学扫描装置具有在主扫描方向和副扫描方向上具有单独曲率半径的旋转非对称非球面的扫描透镜。 副扫描方向的曲率半径与光轴的距离在横向方向上不对称地增加。 可以由旋转多面镜上的光束的倾斜入射引起的扫描面上的副扫描方向产生的场曲率像差或由旋转多面镜的旋转引起的反射面的移动而补偿 扫描透镜和系统的聚焦属性可以保持在高分辨率的水平。
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公开(公告)号：US4984259A
公开(公告)日：1991-01-08
申请号：US481682
申请日：1990-02-20
申请人： Masaaki Itou , Shigeo Moriyama
发明人： Masaaki Itou , Shigeo Moriyama
IPC分类号： G21K1/06 , G03F7/20 , G21K5/02 , H01L21/027
CPC分类号： G03F7/70075
摘要： An X-ray exposure apparatus comprises an X-ray source, a reflecting mirror for deflecting an X-ray beam radiated from the X-ray source to an object, and mechanisms for rotating the reflecting mirror about an axis of rotation apart from a reflecting surface of the reflecting mirror. The reflecting mirror has such a shape that the angle of incidence remains constant relative to the X-ray beam at given angles of rotation.
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公开(公告)号：US4575942A
公开(公告)日：1986-03-18
申请号：US542991
申请日：1983-10-18
申请人： Shigeo Moriyama
发明人： Shigeo Moriyama
IPC分类号： B23Q1/34 , B23Q1/36 , B23Q1/48 , G01B5/00 , G01B21/04 , G03F7/20 , G05D3/12 , H01L21/30 , G01B5/25
CPC分类号： B23Q1/34 , B23Q1/36 , B23Q1/48 , G01B5/0004 , G03F7/70716 , H01L21/30 , B82Y35/00
摘要： An ultra-precision two-dimensional moving apparatus is disclosed, in which a fine-moving table is two-dimensionally movably held on a coarse-moving carriage. This fine-moving table is driven finely in X, Y and .theta. directions by three piezoelectric element actuators. The fine-table position is measured by a laser interferometric measurement system. In response to the error signal between the measured position and a desired position, the piezoelectric element actuators are driven by closed loop control.
摘要翻译： 公开了一种超精密二维移动装置，其中精细移动台被二维地移动地保持在粗移动的托架上。 这种精细移动台由三个压电元件致动器在X，Y和θ方向上精细地驱动。 精细表位置由激光干涉测量系统测量。 响应于测量位置和期望位置之间的误差信号，压电元件致动器由闭环控制驱动。
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公开(公告)号：US4282469A
公开(公告)日：1981-08-04
申请号：US115410
申请日：1980-01-25
申请人： Shigeo Moriyama
发明人： Shigeo Moriyama
CPC分类号： G05B19/232 , G05B2219/41162
摘要： In a positioning control system of the type which controls an object to be controlled to a target position by the use of a servo system, the present invention is characterized in that when a position deviation between the present position of the object to be controlled and the desired target position is smaller than a predetermined value, the servo system is actuated for a first period of time in accordance with the position deviation by means of a control signal which is greater than that normally warranted by the position feedback gain which is provided in the servo system, and is thereafter changed over to a servo system which is actuated by the position feedback gain either after a predetermined time or when a predetermined velocity has been achieved.
摘要翻译： 本发明的特征在于，在通过使用伺服系统将被控制对象物进行控制的目标位置的定位控制系统中，当被控制对象的当前位置与 期望的目标位置小于预定值，则伺服系统通过大于由位置反馈增益中通常所保证的位置反馈增益的控制信号根据位置偏差而被驱动第一时间段 伺服系统，然后转换到在预定时间之后或当达到预定速度时由位置反馈增益启动的伺服系统。
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