公开(公告)号：USD464363S1

公开(公告)日：2002-10-15

申请号：US29146345

申请日：2001-08-09

申请人： Shigeru Saito ,  Takanori Miyake ,  Mitsunobu Oshimura ,  Kazunobu Katase

设计人： Shigeru Saito ,  Takanori Miyake ,  Mitsunobu Oshimura ,  Kazunobu Katase

公开(公告)号：US5897800A

公开(公告)日：1999-04-27

申请号：US980276

申请日：1997-11-28

申请人： Hidekazu Sawai ,  Tsukasa Matsuno ,  Mitsunobu Oshimura ,  Eikichi Hayashi

发明人： Hidekazu Sawai ,  Tsukasa Matsuno ,  Mitsunobu Oshimura ,  Eikichi Hayashi

IPC分类号： B23K26/08 ,  B23K26/12 ,  B23K26/14 ,  B23K26/10

CPC分类号： B23K26/128

摘要： A beam confinement subsystem for an optical scanning system of a laser beam machine having a laser beam transfer path includes an expandable light path sealing and protecting member surrounding a portion of the laser beam transfer path, and a pressure adjusting buffer directly coupled to the expandable light path sealing and protecting member. Preferably, the pressure adjusting buffer including an expandable, airtight thin-film material. Additionally, the beam confinement can include a pressurized purge gas supply tank directly connected to the expandable light path sealing and protecting member to thereby provide greater protection from contamination to the laser beam transfer path.

摘要翻译： 用于具有激光束传送路径的激光束机的光学扫描系统的束限制子系统包括围绕激光束传送路径的一部分的可扩展光路密封和保护构件，以及直接耦合到可扩展光的压力调节缓冲器 路径密封和保护构件。 优选地，压力调节缓冲器包括可膨胀的气密薄膜材料。 另外，束限制可以包括直接连接到可扩展光路密封和保护构件的加压清洗气体供应罐，从而提供更大的防止污染到激光束传送路径的保护。

公开(公告)号：US5585015A

公开(公告)日：1996-12-17

申请号：US362192

申请日：1994-12-22

申请人： Eikichi Hayashi ,  Mitsunobu Oshimura ,  Tsukasa Matsuno ,  Hidekazu Sawai

发明人： Eikichi Hayashi ,  Mitsunobu Oshimura ,  Tsukasa Matsuno ,  Hidekazu Sawai

IPC分类号： B65G45/10 ,  B23K26/10 ,  B23K26/16 ,  B23K26/42 ,  B23K37/00

CPC分类号： B23K26/16 ,  B23K26/0838 ,  B23K26/702

摘要： In a laser machining apparatus and method according to the present invention, a chip conveyor provided under the machining head parallel to the moving direction of the machining head recovers chips dropping near a movable area of a machining head, the chip tray provided in a section where the chip conveyor does not exit, receives chips dropping in a movable area of the machining table where the chip conveyor does not exist, and brushes provided under the machining table move along with the machining table to clean off chips stored in the chip trays and drop the chips onto the chip conveyor.

摘要翻译： 在根据本发明的激光加工装置和方法中，设置在与加工头的移动方向平行的加工头下方的切屑输送机将在加工头的可移动区域附近的切屑落下， 切屑输送机不退出，在不存在切屑输送机的加工台的可移动区域中接收碎屑，并且设置在加工台下方的刷子与加工台一起移动以清除存储在芯片托盘中的碎屑 芯片上的切屑输送机。