公开(公告)号：US20010051318A1

公开(公告)日：2001-12-13

申请号：US09865399

申请日：2001-05-25

申请人： Shipley Company, L.L.C. of Marlborough, Massachusetts

发明人： John Cheung-Shing Chu

IPC分类号： G03F007/42

CPC分类号： G03F7/425 ,  Y10T29/49032

摘要： Disclosed are compositions useful for the pretreatment of polymeric material to be removed from substrates, such as electronic devices. The compositions of the present invention are particularly suitable for pretreating polymer residues from plasma etch processes. Also disclosed are methods of removing such pretreated polymeric material.

摘要翻译： 公开了可用于预处理从基底（例如电子器件）中除去的聚合物材料的组合物。 本发明的组合物特别适用于从等离子体蚀刻工艺中预处理聚合物残余物。 还公开了去除这些预处理的聚合物材料的方法。