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公开(公告)号：US20130039010A1
公开(公告)日：2013-02-14
申请号：US13643227
申请日：2011-04-28
CPC分类号： H01L23/473 , H01L21/4882 , H01L23/3731 , H01L2924/0002 , H05K7/20254 , H01L2924/00
摘要： Disclosed is a heat dissipation device which is reduced in the number of components, while having sufficient insulating function and cooling function with respect to an object to be cooled. The heat dissipation device includes a base that is formed from a ceramic and a refrigerant channel for circulating a refrigerant within the base. The base is formed by sintering a stacked body in which a plurality of ceramic sheets are stacked. The plurality of ceramic sheets include the ceramic sheet which is provided with a plurality of slits that constitute the refrigerant channel, and the ceramic sheets which are provided with communication paths that communicate the refrigerant channel and outside units with each other. A semiconductor device is configured by bonding a metal plate, on which a semiconductor element is mounted, to the heat dissipation device.
摘要翻译： 公开了一种减少部件数量的散热装置，同时相对于待冷却的物体具有足够的绝缘功能和冷却功能。 散热装置包括由陶瓷形成的基座和用于在基座内循环制冷剂的制冷剂通道。 基底通过烧结多个陶瓷片层叠的层叠体形成。 多个陶瓷片包括设置有构成制冷剂通道的多个狭缝的陶瓷片，以及设置有使制冷剂流路和外部单元相互连通的连通路的陶瓷片。 通过将安装有半导体元件的金属板接合到散热装置来构成半导体器件。
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公开(公告)号：US09379038B2
公开(公告)日：2016-06-28
申请号：US13643227
申请日：2011-04-28
IPC分类号： F28F7/00 , H01L23/473 , H01L23/373 , H05K7/20 , H01L21/48
CPC分类号： H01L23/473 , H01L21/4882 , H01L23/3731 , H01L2924/0002 , H05K7/20254 , H01L2924/00
摘要： Disclosed is a heat dissipation device which is reduced in the number of components, while having sufficient insulating function and cooling function with respect to an object to be cooled. The heat dissipation device includes a base that is formed from a ceramic and a refrigerant channel for circulating a refrigerant within the base. The base is formed by sintering a stacked body in which a plurality of ceramic sheets are stacked. The plurality of ceramic sheets include the ceramic sheet which is provided with a plurality of slits that constitute the refrigerant channel, and the ceramic sheets which are provided with communication paths that communicate the refrigerant channel and outside units with each other. A semiconductor device is configured by bonding a metal plate, on which a semiconductor element is mounted, to the heat dissipation device.
摘要翻译： 公开了一种减少部件数量的散热装置，同时相对于待冷却的物体具有足够的绝缘功能和冷却功能。 散热装置包括由陶瓷形成的基座和用于在基座内循环制冷剂的制冷剂通道。 基底通过烧结多个陶瓷片层叠的层叠体形成。 多个陶瓷片包括设置有构成制冷剂通道的多个狭缝的陶瓷片，以及设置有使制冷剂流路和外部单元相互连通的连通路的陶瓷片。 通过将安装有半导体元件的金属板接合到散热装置来构成半导体器件。
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3.发明申请FLOW CHANNEL MEMBER, AND HEAT EXCHANGER USING THE SAME, AND ELECTRONIC COMPONENT DEVICE 审中-公开流通道成员和使用其的热交换器，以及电子元件装置公开(公告)号：US20130088837A1
公开(公告)日：2013-04-11
申请号：US13702948
申请日：2011-06-09
申请人： Kenji Tsubokawa , Kazuhiko Fujio , Kenjiro Maeda
发明人： Kenji Tsubokawa , Kazuhiko Fujio , Kenjiro Maeda
CPC分类号： F28F1/04 , F16L9/003 , H01L23/473 , H01L2924/0002 , H05K1/0272 , H05K7/20 , H01L2924/00
摘要： There is provided a flow channel member which is configured by laminating a plurality of side wall units and inside which a flow channel is provided, wherein occurrence of joint failure of the side wall units are reduced. A flow channel member includes a cover unit, a side wall unit, and a bottom plate unit, wherein a flow channel through which a fluid flows is provided inside the flow channel member, and a gap which communicates with the flow channel is provided between the cover unit and the side wall unit. According to the flow channel member, since the gap which communicates with the flow channel is located between the cover unit and the side wall unit, a contact area between the flow channel and the fluid increases, and thus heat exchange efficiency with the cover unit may be increased.
摘要翻译： 提供了一种通过层叠多个侧壁单元并且在其内设置有流动通道而构成的流路构件，其中侧壁单元的接合故障的发生减少。 流路构件包括盖单元，侧壁单元和底板单元，其中流体流过的流动通道设置在流动通道构件内部，并且在流动通道之间设置有与流动通道连通的间隙 盖单元和侧壁单元。 根据流路构件，由于与流路连通的间隙位于盖单元和侧壁单元之间，所以流路和流体之间的接触面积增加，因此与盖单元的热交换效率 增加。
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