公开(公告)号：US20120293965A1

公开(公告)日：2012-11-22

申请号：US13472591

申请日：2012-05-16

申请人： Shozo OCHI ,  Yoshitake Hayashi ,  Kazuo Ohtani ,  Yosuke Maeba

发明人： Shozo OCHI ,  Yoshitake Hayashi ,  Kazuo Ohtani ,  Yosuke Maeba

IPC分类号： H05K7/00 ,  H05K13/04

CPC分类号： H01L21/56 ,  H01L21/4857 ,  H01L23/3107 ,  H01L23/5389 ,  H01L2924/0002 ,  H05K1/186 ,  H05K3/4069 ,  H05K3/4638 ,  H05K3/4697 ,  H01L2924/00

摘要： A manufacturing method for a component built-in module, including: forming, in a sheet member including resin, a via hole filled up with a conductive paste, a cavity in which an electronic component is to be built, and an adjustment space; and performing a heat press allowing the sheet member to abut against a substrate on which the electronic component has been mounted, wherein the adjustment space is formed so that a flow vector of the resin in a neighborhood of the via hole during the heat press, which is directed toward the electronic component, is cancelled by a flow vector of the resin in a neighborhood of the via hole during the heat press, which is directed toward the adjustment space.

摘要翻译： 一种组件内置模块的制造方法，包括：在包括树脂的片材构件中形成填充有导电浆料的通孔，其中将构建电子部件的空腔和调节空间; 并且进行热压机，使片材与其上安装有电子部件的基板抵接，其中调节空间被形成为在热压机过程中通孔周围的树脂的流动矢量， 被引导到电子部件，被热冲压时的通孔附近的树脂的流动矢量抵消，该朝向调节空间。

公开(公告)号：US08745859B2

公开(公告)日：2014-06-10

申请号：US13472591

申请日：2012-05-16

申请人： Shozo Ochi ,  Yoshitake Hayashi ,  Kazuo Ohtani ,  Yosuke Maeba

发明人： Shozo Ochi ,  Yoshitake Hayashi ,  Kazuo Ohtani ,  Yosuke Maeba

IPC分类号： H05K1/02

CPC分类号： H01L21/56 ,  H01L21/4857 ,  H01L23/3107 ,  H01L23/5389 ,  H01L2924/0002 ,  H05K1/186 ,  H05K3/4069 ,  H05K3/4638 ,  H05K3/4697 ,  H01L2924/00

摘要： A manufacturing method for a component built-in module, including: forming, in a sheet member including resin, a via hole filled up with a conductive paste, a cavity in which an electronic component is to be built, and an adjustment space; and performing a heat press allowing the sheet member to abut against a substrate on which the electronic component has been mounted, wherein the adjustment space is formed so that a flow vector of the resin in a neighborhood of the via hole during the heat press, which is directed toward the electronic component, is cancelled by a flow vector of the resin in a neighborhood of the via hole during the heat press, which is directed toward the adjustment space.

摘要翻译： 一种组件内置模块的制造方法，包括：在包括树脂的片材构件中形成填充有导电浆料的通孔，其中将构建电子部件的空腔和调节空间; 并且进行热压机，使片材与其上安装有电子部件的基板抵接，其中调节空间被形成为在热压机过程中通孔周围的树脂的流动矢量， 被引导到电子部件，被热冲压时的通孔附近的树脂的流动矢量抵消，该朝向调节空间。