公开(公告)号：US08630962B2

公开(公告)日：2014-01-14

申请号：US13057831

申请日：2009-05-29

申请人： Shunji Maeda ,  Hisae Shibuya

发明人： Shunji Maeda ,  Hisae Shibuya

IPC分类号： G06F15/18

CPC分类号： G05B23/0254 ,  G06K9/00536 ,  G06K9/6252 ,  G06K9/6272 ,  G06K9/6284

摘要： Provided are a method which permits complete training data and data with added errors, and enables the early and accurate discovery of errors in facilities such as a plant, and a system thereof. To achieve the objectives, (1) the behavior of temporal data is observed over time, and the trace is divided into clusters; (2) the divided cluster groups are modeled in sub spaces, and the discrepancy values are calculated as errors candidates; (3) the training data are used (compare, reference, etc.) for reference to determine the state transitions caused by the changes over time, the environmental changes, the maintenance (parts replacement), and the operation states; and (4) the modeling is a sub space method such as regression analysis or projection distance method of every N data removing N data items, (N=0, 1, 2, . . . ) (for example, when N=1, one error data item is considered to have been added, this data is removed, then the modeling is performed), or a local sub space method. Linear fitting in regression analysis is equivalent to the lowest order regression analysis.

摘要翻译： 提供了一种允许完整的训练数据和具有附加错误的数据的方法，并且能够及早准确地发现诸如工厂及其系统之类的设施中的错误。 为了实现目标，（1）随时间观察时间数据的行为，并将踪迹分为簇; （2）划分的群集组在子空间中建模，差异值计算为错误候选; （3）使用训练数据（比较，参考等）作为参考，确定随时间变化，环境变化，维护（部件更换）和操作状态引起的状态转换; （4）建模是N次数据去除N个数据项（N = 0,1,2，...）的回归分析或投影距离法的子空间法（例如，当N = 1时， 一个错误数据项被认为已被添加，该数据被删除，然后进行建模）或本地子空间方法。 回归分析中的线性拟合等价于最低阶回归分析。

公开(公告)号：US08310666B2

公开(公告)日：2012-11-13

申请号：US13116466

申请日：2011-05-26

申请人： Akira Hamamatsu ,  Shunji Maeda ,  Hisae Shibuya

发明人： Akira Hamamatsu ,  Shunji Maeda ,  Hisae Shibuya

IPC分类号： G01N21/88 ,  G01B11/00

CPC分类号： G01N21/956

摘要： When size of a defect on an increasingly miniaturized pattern is obtained by defect inspection apparatus in the related art, a value is inconveniently given, which is different from a measured value of the same defect by SEM. Thus, a dimension value of a defect detected by defect inspection apparatus needs to be accurately calculated to be approximated to a value measured by SEM. To this end, size of the defect detected by the defect inspection apparatus is corrected depending on feature quantity or type of the defect, thereby defect size can be accurately calculated.

摘要翻译： 当通过现有技术的缺陷检查装置获得越来越小型化的图案的缺陷的尺寸时，不方便地给出不同于SEM的相同缺陷的测量值的值。 因此，需要精确地计算由缺陷检查装置检测到的缺陷的尺寸值，以近似于通过SEM测量的值。 为此，由缺陷检查装置检测到的缺陷的尺寸根据缺陷的特征量或类型进行修正，从而可以精确地计算缺陷尺寸。

公开(公告)号：US20120133927A1

公开(公告)日：2012-05-31

申请号：US13368585

申请日：2012-02-08

申请人： Akira HAMAMATSU ,  Hisae Shibuya ,  Shunji Maeda

发明人： Akira HAMAMATSU ,  Hisae Shibuya ,  Shunji Maeda

IPC分类号： G01N21/55

CPC分类号： G01N21/9501 ,  G01N2021/8822

摘要： A defect inspection apparatus for inspecting defects on an inspecting object includes an illuminator which irradiates a beam of light on the inspecting object, a photo-detector which detects rays of light from the inspecting object due to the irradiation of the light beam by the illuminator, a defect detector which detects a defect by processing a signal obtained through detection by the photo-detector, a characteristic quantity calculator which calculates a characteristic quantity related to a size of the defect, and a defect size calculator which uses a relation between size and characteristic quantity which is calculated by an optical simulation and calculates a size of the detected defect.

摘要翻译： 用于检查检查对象的缺陷的缺陷检查装置包括：在检查对象物上照射光束的照明器，由于照射器照射光束而检测来自被检查物体的光的光检测器， 缺陷检测器，其通过处理通过光检测器的检测获得的信号来检测缺陷;计算与缺陷的尺寸相关的特征量的特征量计算器;以及使用尺寸和特性之间的关系的缺陷尺寸计算器 通过光学模拟计算的量，并计算检测到的缺陷的尺寸。

公开(公告)号：US08144337B2

公开(公告)日：2012-03-27

申请号：US12470505

申请日：2009-05-22

申请人： Akira Hamamatsu ,  Yoshimasa Oshima ,  Shunji Maeda ,  Hisae Shibuya ,  Yuta Urano ,  Toshiyuki Nakao ,  Shigenobu Maruyama

发明人： Akira Hamamatsu ,  Yoshimasa Oshima ,  Shunji Maeda ,  Hisae Shibuya ,  Yuta Urano ,  Toshiyuki Nakao ,  Shigenobu Maruyama

IPC分类号： G01B11/30

CPC分类号： G01B11/303 ,  G01N21/47 ,  G01N21/94 ,  G01N21/9501

摘要： To inspect a substrate such as a semiconductor substrate for surface roughness at high precision.The surface roughness of the substrate is measured in each frequency band of the surface roughness by applying a light to the substrate surface and detecting a scattered light or reflected light at a plurality of azimuth or elevation angles.

摘要翻译： 以高精度检查用于表面粗糙度的半导体基板等基板。 通过向基板表面施加光并以多个方位角或仰角检测散射光或反射光，测量表面粗糙度的每个频带中的基板的表面粗糙度。

公开(公告)号：US07952699B2

公开(公告)日：2011-05-31

申请号：US12827555

申请日：2010-06-30

申请人： Akira Hamamatsu ,  Shunji Maeda ,  Hisae Shibuya

发明人： Akira Hamamatsu ,  Shunji Maeda ,  Hisae Shibuya

IPC分类号： G01N21/88 ,  G01B11/00

CPC分类号： G01N21/956

摘要： When size of a defect on an increasingly miniaturized pattern is obtained by defect inspection apparatus in the related art, a value is inconveniently given, which is different from a measured value of the same defect by SEM. Thus, a dimension value of a defect detected by defect inspection apparatus needs to be accurately calculated to be approximated to a value measured by SEM. To this end, size of the defect detected by the defect inspection apparatus is corrected depending on feature quantity or type of the defect, thereby defect size can be accurately calculated.

摘要翻译： 当通过现有技术的缺陷检查装置获得越来越小型化的图案的缺陷的尺寸时，不方便地给出不同于SEM的相同缺陷的测量值的值。 因此，需要精确地计算由缺陷检查装置检测到的缺陷的尺寸值，以近似于通过SEM测量的值。 为此，由缺陷检查装置检测到的缺陷的尺寸根据缺陷的特征量或类型进行修正，从而可以精确地计算缺陷尺寸。

公开(公告)号：US20060159330A1

公开(公告)日：2006-07-20

申请号：US11328231

申请日：2006-01-10

申请人： Kaoru Sakai ,  Shunji Maeda ,  Hisae Shibuya ,  Hidetoshi Nishiyama

发明人： Kaoru Sakai ,  Shunji Maeda ,  Hisae Shibuya ,  Hidetoshi Nishiyama

IPC分类号： G06K9/00

CPC分类号： G06T7/0004 ,  G06T7/001 ,  G06T2207/30148

摘要： In a pattern inspection apparatus, influences of pattern brightness variations that is caused in association with, for example, a film thickness difference or a pattern width variation can be reduced, high sensitive pattern inspection can be implemented, and a variety of defects can be detected. Thereby, the pattern inspection apparatus adaptable to a broad range of processing steps is realized. In order to realize this, the pattern inspection apparatus of the present invention performs comparison between images of regions corresponding to patterns formed to be same patterns, thereby determining mismatch portions across the images to be defects. The apparatus includes multiple sensors capable of synchronously acquiring images of shiftable multiple detection systems different from one another, and an image comparator section corresponding thereto. In addition, the apparatus includes means of detecting a statistical offset value from the feature amount to be a defect, thereby enabling the defect to be properly detected even when a brightness difference is occurring in association with film a thickness difference in a wafer.

摘要翻译： 在图案检查装置中，可以减少与膜厚差或图案宽度变化相关联引起的图案亮度变化的影响，可以实现高灵敏度图案检查，并且可以检测各种缺陷 。 由此，可以实现适应于广泛的处理步骤的图案检查装置。 为了实现这一点，本发明的图案检查装置对与形成为相同图案的图案相对应的区域的图像进行比较，从而确定跨越图像的不匹配部分是缺陷。 该装置包括能够同时获取彼此不同的可移动多个检测系统的图像的多个传感器，以及与其对应的图像比较部。 此外，该装置包括检测从特征量成为缺陷的统计偏移值的装置，从而即使当与膜中的厚度差相关联地发生亮度差时，也能够适当地检测缺陷。

公开(公告)号：US08654350B2

公开(公告)日：2014-02-18

申请号：US13672742

申请日：2012-11-09

申请人： Akira Hamamatsu ,  Yoshimasa Oshima ,  Shunji Maeda ,  Hisae Shibuya ,  Yuta Urano ,  Toshiyuki Nakao ,  Shigenobu Maruyama

发明人： Akira Hamamatsu ,  Yoshimasa Oshima ,  Shunji Maeda ,  Hisae Shibuya ,  Yuta Urano ,  Toshiyuki Nakao ,  Shigenobu Maruyama

IPC分类号： G01B11/30

CPC分类号： G01B11/303 ,  G01N21/47 ,  G01N21/94 ,  G01N21/9501

摘要： An inspecting method and apparatus for inspecting a substrate surface includes illuminating a light to the substrate surface having a film, detection of a scattered light or reflected light from a plurality of positions of the substrate surface to obtain a plurality of electrical signals, comparison of the plurality of electrical signals and a database which indicates a relationship between the electrical signals and surface roughness, and calculation of a surface roughness value based on the result of comparison.

摘要翻译： 用于检查基板表面的检查方法和装置包括将光照射到具有膜的基板表面，从基板表面的多个位置检测散射光或反射光以获得多个电信号， 多个电信号和指示电信号和表面粗糙度之间的关系的数据库，以及基于比较结果的表面粗糙度值的计算。

公开(公告)号：US08620061B2

公开(公告)日：2013-12-31

申请号：US13405444

申请日：2012-02-27

申请人： Hisae Shibuya ,  Shunji Maeda

发明人： Hisae Shibuya ,  Shunji Maeda

IPC分类号： G06K9/00

CPC分类号： G06T7/0004 ,  G06T2207/30148

摘要： A visual inspection method and apparatus detecting a defect with the use of a detected signal obtained by illuminating one of a light and an electron beam onto a substrate to be inspected. The visual inspection method and apparatus includes calculation of an image feature based on an image of the detected defect, calculation of a coordinate feature based on position information of the detected defect, and outputting of real defect information by performing false alarm judgment by processing with respect to one of the image feature and the coordinate feature.

摘要翻译： 使用通过将光和电子束中的一个照射到待检查的基板上获得的检测信号来检测缺陷的目视检查方法和装置。 目视检查方法和装置包括基于检测到的缺陷的图像计算图像特征，基于检测到的缺陷的位置信息来计算坐标特征，并且通过以下方式进行伪报警判断来输出实际缺陷信息： 到一个图像特征和坐标特征。

公开(公告)号：US20130173218A1

公开(公告)日：2013-07-04

申请号：US13702531

申请日：2011-05-16

申请人： Shunji Maeda ,  Hisae Shibuya

发明人： Shunji Maeda ,  Hisae Shibuya

IPC分类号： G06F17/00

CPC分类号： G06F17/00 ,  G05B23/0221 ,  G05B23/0224 ,  G06Q10/20

摘要： To allow early sensing of anomalies in a manufacturing plant or other infrastructure (plant), provided is a method that acquires data of runtime status of said plant from a plurality of sensors of said plant, makes a model from training data that corresponds to the regular runtime status of said plant, employs the training data thus modeled in computing a anomaly measure of the data acquired from the sensors, and detects anomalies. In computing the anomaly measure, the anomaly is detected by recursively carrying out: a derivation of a residual error from the training data thus modeled acquired from the plurality of sensors, a removal of a signal having a residual error that is greater than a predetermined value, and a computation of the anomaly measure for the data that is acquired from the plurality of sensors whereupon the signal having the large residual error is removed.

摘要翻译： 为了允许早期感测制造工厂或其他基础设施（工厂）中的异常，提供了一种从所述设备的多个传感器获取所述设备的运行时状态的数据的方法，从对应于规则的训练数据 所述工厂的运行状态采用如下建模的训练数据来计算从传感器获得的数据的异常测量，并检测异常。 在计算异常测量时，通过递归地执行：从由多个传感器获取的建模的训练数据中导出残差，去除具有大于预定值的残差的信号， 以及从多个传感器获得的数据的异常测量的计算，因此除去具有大残留误差的信号。

公开(公告)号：US08467594B2

公开(公告)日：2013-06-18

申请号：US12960578

申请日：2010-12-06

申请人： Kaoru Sakai ,  Shunji Maeda ,  Hisae Shibuya ,  Hidetoshi Nishiyama

发明人： Kaoru Sakai ,  Shunji Maeda ,  Hisae Shibuya ,  Hidetoshi Nishiyama

IPC分类号： G06K9/00 ,  G06K9/68

CPC分类号： G06T7/0004 ,  G06T7/001 ,  G06T2207/30148

摘要： In a pattern inspection apparatus, influences of pattern brightness variations that is caused in association with, for example, a film thickness difference or a pattern width variation can be reduced, high sensitive pattern inspection can be implemented, and a variety of defects can be detected. Thereby, the pattern inspection apparatus adaptable to a broad range of processing steps is realized. In order to realize this, the pattern inspection apparatus of the present invention performs comparison between images of regions corresponding to patterns formed to be same patterns, thereby determining mismatch portions across the images to be defects. The apparatus includes multiple sensors capable of synchronously acquiring images of shiftable multiple detection systems different from one another, and an image comparator section corresponding thereto. In addition, the apparatus includes means of detecting a statistical offset value from the feature amount to be a defect, thereby enabling the defect to be properly detected even when a brightness difference is occurring in association with film a thickness difference in a wafer.

摘要翻译： 在图案检查装置中，可以减少与膜厚差或图案宽度变化相关联引起的图案亮度变化的影响，可以实现高灵敏度图案检查，并且可以检测各种缺陷 。 由此，可以实现适应于广泛的处理步骤的图案检查装置。 为了实现这一点，本发明的图案检查装置对与形成为相同图案的图案相对应的区域的图像进行比较，从而确定跨越图像的不匹配部分是缺陷。 该装置包括能够同时获取彼此不同的可移动多个检测系统的图像的多个传感器，以及与其对应的图像比较部。 此外，该装置包括检测从特征量成为缺陷的统计偏移值的装置，从而即使当与膜中的厚度差相关联地发生亮度差时，也能够适当地检测缺陷。