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    METHOD FOR ATTACHING AN ELECTRONIC COMPONENT TO A PRODUCT
    1.
    发明申请
    METHOD FOR ATTACHING AN ELECTRONIC COMPONENT TO A PRODUCT 审中-公开
    将电子元件连接到产品的方法

    公开(公告)号：US20120199867A1

    公开(公告)日：2012-08-09

    申请号：US13266975

    申请日：2010-04-29

    Applicant: Sigrid Thomas ,  Victor Thomas

    Inventor： Sigrid Thomas ,  Victor Thomas

    IPC: H01L33/62 ,  H01L21/50

    CPC classification number: G06K19/07749 ,  G06K19/0776 ,  H01L21/6835 ,  H01L23/66 ,  H01L25/50 ,  H01L2221/68354 ,  H01L2223/6677 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: An electronic component is attached to a product, using a transfer method involving the use of a transfer sheet including a substrate sheet and at least one transfer layer covering a portion of the front surface of the substrate sheet. The transfer method consists in: placing the transfer layer in contact with the product; applying a pressure against the back surface of the substrate sheet; and finally removing the substrate sheet, said at least one transfer layer remaining affixed to the product. In addition, the attachment method includes a step prior to the transfer method, during which at least one electronic assembly including at least one electronic chip attached to at least one wire is positioned between the product and the substrate sheet, such that at least one portion of each assembly is held in place by a transfer layer following the removal of the substrate sheet.

    Abstract translation: 使用包括使用包括基片的转印片和覆盖基片的前表面的一部分的至少一个转印层的转印方法将电子元件附着到产品上。 转印方法在于：将转印层放置在与产品接触的位置; 对基片的背面施加压力; 最后移除基片，所述至少一个转印层保留在产品上。 此外，附接方法包括在传送方法之前的步骤，在此期间，至少一个电子组件包括附接到至少一根线的至少一个电子芯片，位于产品和基片之间，使得至少一个部分 每个组件在移除基片之后通过转移层保持在适当的位置。

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